Mobile phone
Description
Claims
The ornamental design for a mobile phone, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
Other references
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Patent History
Patent number: D1090474
Type: Grant
Filed: Oct 14, 2022
Date of Patent: Aug 26, 2025
Assignee: HUAWEI TECHNOLOGIES CO., LTD. (Shenzhen)
Inventors: Siwei Wang (Shenzhen), Yang Wan (Shenzhen), Wenjing Sun (Paris), Guoping Wu (Shenzhen), Ting Xu (Shanghai)
Primary Examiner: Dana K Weiland
Assistant Examiner: David Michael Sullivan
Application Number: 29/856,539
Type: Grant
Filed: Oct 14, 2022
Date of Patent: Aug 26, 2025
Assignee: HUAWEI TECHNOLOGIES CO., LTD. (Shenzhen)
Inventors: Siwei Wang (Shenzhen), Yang Wan (Shenzhen), Wenjing Sun (Paris), Guoping Wu (Shenzhen), Ting Xu (Shanghai)
Primary Examiner: Dana K Weiland
Assistant Examiner: David Michael Sullivan
Application Number: 29/856,539
Classifications
Current U.S. Class:
D14/138.G