Abstract: The disclosure provides a resin cleaning device and method. The resin cleaning device includes a control system, a treatment unit, a driving unit, and a feedback assembly. The treatment unit, the driving unit, and the feedback assembly are respectively in communication connection with the control system. The treatment unit is configured for treating a member-to-be-cleaned so as to reduce a viscosity of resin on the member-to-be-cleaned. The driving unit is configured for driving the member-to-be-cleaned to rotate. The feedback assembly is configured for acquiring a position signal of the member-to-be-cleaned and feeding the position signal back to the control system, such that the control system controls the treatment unit and the driving unit according to the position signal. Through the above manner, a more intelligent resin cleaning process with a better cleaning effect may be realized.

Abstract: Presented are systems and methods for uplink frequency selective precoding. A wireless communication device may receive a first signaling from the wireless communication node. The first signaling may include a plurality of precoding information associated with a plurality of port groups. The wireless communication device may determine signals precoded according to the plurality of precoding information. The wireless communication device may transmit the signals to the wireless communication node.

Abstract: The present disclosure relates to a cephalosporin antibacterial compound and a preparation method therefor. The cephalosporin antibacterial compound can exhibit antibacterial activity against Gram-negative bacteria and other bacteria.

Abstract: A solar cell includes a semiconductor substrate, both a front surface and a back surface of the semiconductor substrate are provided with a preset structure; the preset structure comprises a fine grid layer including a plurality of fine grids; a dielectric protection layer formed on the fine grid layer; and a busbar layer including a plurality of busbars that penetrate through the dielectric protection layer and are connected with the fine grids.

Abstract: A tracer particle spreading device for a boundary layer flow visualization experiment based on a flat plate includes a tracer particle generator, a smoke storage box, and a wall-surface particle distribution box. Fume and oil are pressurized by a micro pump and flows into a heating pipe to be heated and vaporized, and then is ejected from a nozzle to form tracer particles. The tracer particles enter the smoke storage box via a smoke guiding tube. An axial flow fan is mounted on a wall surface of the smoke storage box. The tracer particles enter a cavity of the wall-surface particle distribution box via the smoke guiding tube, and the tracer particles are rectified by a rectifying plate and ejected from a spreading slit. An outlet of the spreading slit is at an angle of 15° with respect to an experiment flat plate.

Abstract: This application relates to the field of battery technology, and in particular, to a box assembly, a battery module, a battery, and an electrical device. The box assembly may include at least a partition piece and two end plates. In the box assembly disclosed herein, a stress relief piece may be disposed at two ends of a main body of the partition piece. The main body may be connected to the end plate by use of the stress relief piece. A corner may be formed between the stress relief piece and the main body. In this way, when the battery module is subjected to stress, at least a part of the stress can be relieved through the corner formed between the stress relief piece and the main body.

Abstract: A method for manufacturing a sensor. The sensor includes a sensing element and a housing, the housing including an interior space, which is accessible through a housing opening, and the sensing element being situated in the interior space and being designed to detect a property and/or a composition of an ambient medium of the sensor. The method includes filling the interior space with a protective medium through the housing opening, the protective medium being designed to transfer the property and/or the composition of the ambient medium to the sensing element; fixing a preferably flexible diaphragm at or in the housing opening preferably for sealing the housing opening, the diaphragm including at least one diaphragm opening; and sealing the at least one diaphragm opening. A sensor, which is manufactured according to this method, is also described.

Abstract: The disclosed technology includes a heat pump having a thermal energy storage (TES) material. The heat pump can include a first heat exchanger to exchange heat between ambient air and refrigerant, a second heat exchanger to exchange heat between the refrigerant and air supplied to a climate-controlled space, and a third heat exchanger to exchange heat between the TES material and the refrigerant in a first fluid path and the refrigerant in a second fluid path. The heat pump can include a first compressor to circulate refrigerant to the first, second, and third heat exchangers and a second compressor to circulate refrigerant to the second and third heat exchangers. The first compressor can facilitate heat exchange between the ambient air and the TES material and the second compressor can facilitate heat exchange between the TES material and the air supplied to the climate-controlled space.

Abstract: A quantum bit control apparatus, including a control signal generator, optoelectronic detectors, a quantum chip, and a shielding apparatus, the optoelectronic detectors are disposed in the shielding apparatus, and an inner part of the shielding apparatus is in a vacuum state. The control signal generator is disposed in a first temperature area, and is configured to generate optical control signals and send the N optical control signals to the optoelectronic detectors. The optoelectronic detectors are disposed in a second temperature area having a temperature lower than of the first temperature area. The N optoelectronic detectors are configured to convert the received optical control signals into electronically controlled signals and send the electronically controlled signals to the quantum chip. The quantum chip is disposed in the second temperature area, and controls a quantum bit in the quantum chip based on the electronically controlled signals.

Abstract: A method for manufacturing a sensor. The sensor includes a sensing element and a housing, the housing including an interior space, which is accessible through a housing opening, and the sensing element being situated in the interior space and being designed to detect a property and/or a composition of an ambient medium of the sensor. The method includes filling the interior space with a protective medium through the housing opening, the protective medium being designed to transfer the property and/or the composition of the ambient medium to the sensing element; fixing a preferably flexible diaphragm at or in the housing opening preferably for sealing the housing opening, the diaphragm including at least one diaphragm opening; and sealing the at least one diaphragm opening. A sensor, which is manufactured according to this method, is also described.

Abstract: A method for manufacturing a pressure sensor having a pressure-sensitive medium. The method includes: providing a pressure sensor having a pressure sensor element, which is arranged in a receiving space of a housing of the pressure sensor; filling the receiving space with a pressure-sensitive medium; applying a second medium, which is immiscible with the pressure-sensitive medium, to a surface of the pressure-sensitive medium; forming a membrane in a boundary region between the pressure-sensitive medium and the second medium by way of a phase-transfer reaction between a first reactant and a second reactant, at least the first reactant or the second reactant being dissolved in the pressure-sensitive medium or in the second medium. A pressure sensor manufactured by the method is also described.

Abstract: A heat exchanger fin is disclosed. The fin can include a fin portion and a collar portion defining a fin aperture that has a central axis passing therethrough. The collar portion can include a nesting end including a nesting portion and a receiving end that (i) is located apart from the nesting end in an axial direction and (ii) comprises one or more bends to form an overhang portion that defines a gap located radially inward of the overhang portion. The gap can be dimensioned to at least partially receive the nesting portion. The collar portion can also include a contact portion extending between the nesting end and the receiving end, and the contact portion can be configured to abut an outer surface of a tube when the tube is at least partially inserted into the fin aperture.

Abstract: The present application provides a resonator and a method of preparing same, and relates to the field of semiconductor technologies. The method includes: providing a device wafer, wherein the device wafer includes a first substrate and a piezoelectric layer, a bottom electrode, and a first mass loading layer formed in sequence on the first substrate; forming, on the bottom electrode, a sacrificial layer covering the first mass loading layer; forming a supporting layer on one side of the device wafer with the sacrificial layer; forming a second substrate on the supporting layer through a bonding process; removing the first substrate to expose the piezoelectric layer; forming a top electrode and a second mass loading layer in sequence on the piezoelectric layer; and releasing the sacrificial layer to form a cavity between the first mass loading layer and the supporting layer.

Abstract: The disclosed technology includes a heat pump having a thermal energy storage (TES) material. The heat pump can include a first heat exchanger to exchange heat between ambient air and refrigerant, a second heat exchanger to exchange heat between the refrigerant and air supplied to a climate-controlled space, and a third heat exchanger to exchange heat between the TES material and the refrigerant in a first fluid path and the refrigerant in a second fluid path. The heat pump can include a first compressor to circulate refrigerant to the first, second, and third heat exchangers and a second compressor to circulate refrigerant to the second and third heat exchangers. The first compressor can facilitate heat exchange between the ambient air and the TES material and the second compressor can facilitate heat exchange between the TES material and the air supplied to the climate-controlled space.

Abstract: The disclosed technology includes devices, systems, and methods for heat pump systems configured to operate in low ambient temperatures. The disclosed technology can include a heat pump water heater system having an evaporator, a first compressor configured to compress refrigerant to a first pressure, and a second compressor configured to compress the refrigerant to a second pressure. The second pressure can be greater than the first pressure. The heat pump water heater system can include a preheater configured to receive the refrigerant at the first pressure and heat water and a condenser configured to receive the refrigerant at the second pressure and heat water. The water can be passed through the preheater before being passed through the condenser.

Abstract: Disclosed are methods for providing heating and/or cooling of the type comprising evaporating refrigerant liquid and condensing refrigerant vapor in a plurality of repeating cycles, where the method comprises (a) providing the refrigerant comprising at least about 5% by weight of a lower alkyl iodofluorocarbon; and (b) exposing at least a portion of said refrigerant in at least a portion of said plurality of said cycles to a sequestration material comprising: i) copper or a copper alloy; ii) a molecular sieve (preferably a zeolite), comprising copper, silver, lead or a combination thereof; iii) an anion exchange resin, and iv) a combination of two or more of these, wherein said exposing temperature is preferably above about 20 C.

Abstract: The present application provides a resonator and a preparation method for a resonator, and relates to the technical field of semiconductors. The method involves introducing a first single crystal substrate to facilitate the epitaxial growth of a high-quality single crystal piezoelectric layer on the first single crystal substrate, and firstly performing ion implantation on the first single crystal substrate to form a damaged layer at a certain depth within it. Therefore, while the first single crystal substrate is removed, it is firstly possible to adopt the heating process, and after the first single crystal substrate is subjected to high-temperature treatment, a first layer and a second layer are split at the damaged layer, thereby a part of the first single crystal substrate is firstly removed, and then the remaining part of the first single crystal substrate is removed by trimming, etching, and other modes.

Abstract: Embodiments include heat pump systems with gas bypasses and related methods. In one embodiment, a system may include a gas bypass tank having a bypass inlet, a liquid outlet, and a vapor outlet, and a first splitting valve having a first splitter outlet in fluid communication with the bypass inlet, a first splitter inlet in fluid communication with the liquid outlet, and a first switching path configured to switch between a first conduit path in fluid communication with a first coil system and a second conduit path in fluid communication with a second coil system.

Abstract: A resonator and a preparation method of a resonator, and a filter relate to the technical field of resonators.

Abstract: The present invention relates to heat transfer compositions comprising refrigerant, lubricant and stabilizer, wherein the refrigerant comprises from about 5% by weight to 100% by weight of trifluoroiodomethane (CF3I), and wherein said lubricant comprises polyol ester (POE) lubricant and/or polyvinyl ether (PVE) lubricant, and wherein said stabilizer comprises an alkylated naphthalene and optionally but preferably an acid depleting moiety.