Patents by Inventor Yang Zou

Yang Zou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11841283
    Abstract: A method for manufacturing a sensor. The sensor includes a sensing element and a housing, the housing including an interior space, which is accessible through a housing opening, and the sensing element being situated in the interior space and being designed to detect a property and/or a composition of an ambient medium of the sensor. The method includes filling the interior space with a protective medium through the housing opening, the protective medium being designed to transfer the property and/or the composition of the ambient medium to the sensing element; fixing a preferably flexible diaphragm at or in the housing opening preferably for sealing the housing opening, the diaphragm including at least one diaphragm opening; and sealing the at least one diaphragm opening. A sensor, which is manufactured according to this method, is also described.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: December 12, 2023
    Assignee: ROBERT BOSCH GMBH
    Inventors: Lars Sodan, Dorothee Nonnenmacher, Elmar Kroner, Friedhelm Guenter, Joachim Friedl, Joachin Kreutzer, Klaus-Volker Schuett, Michael Raedler, Patrick Stihler, Raschid Baraki, Steven Maul, Yang Zou
  • Publication number: 20230393009
    Abstract: A method for manufacturing a pressure sensor having a pressure-sensitive medium. The method includes: providing a pressure sensor having a pressure sensor element, which is arranged in a receiving space of a housing of the pressure sensor; filling the receiving space with a pressure-sensitive medium; applying a second medium, which is immiscible with the pressure-sensitive medium, to a surface of the pressure-sensitive medium; forming a membrane in a boundary region between the pressure-sensitive medium and the second medium by way of a phase-transfer reaction between a first reactant and a second reactant, at least the first reactant or the second reactant being dissolved in the pressure-sensitive medium or in the second medium. A pressure sensor manufactured by the method is also described.
    Type: Application
    Filed: November 24, 2021
    Publication date: December 7, 2023
    Inventors: Dorothee Nonnenmacher, Elmar Kroner, Friedhelm Guenter, Joachim Friedl, Joachim Kreutzer, Klaus-Volker Schuett, Lars Sodan, Michael Raedler, Patrick Stihler, Raschid Baraki, Steven Maul, Yang Zou
  • Patent number: 11835306
    Abstract: A heat exchanger fin is disclosed. The fin can include a fin portion and a collar portion defining a fin aperture that has a central axis passing therethrough. The collar portion can include a nesting end including a nesting portion and a receiving end that (i) is located apart from the nesting end in an axial direction and (ii) comprises one or more bends to form an overhang portion that defines a gap located radially inward of the overhang portion. The gap can be dimensioned to at least partially receive the nesting portion. The collar portion can also include a contact portion extending between the nesting end and the receiving end, and the contact portion can be configured to abut an outer surface of a tube when the tube is at least partially inserted into the fin aperture.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: December 5, 2023
    Assignee: Rheem Manufacturing Company
    Inventor: Yang Zou
  • Publication number: 20230387883
    Abstract: The present application provides a resonator and a method of preparing same, and relates to the field of semiconductor technologies. The method includes: providing a device wafer, wherein the device wafer includes a first substrate and a piezoelectric layer, a bottom electrode, and a first mass loading layer formed in sequence on the first substrate; forming, on the bottom electrode, a sacrificial layer covering the first mass loading layer; forming a supporting layer on one side of the device wafer with the sacrificial layer; forming a second substrate on the supporting layer through a bonding process; removing the first substrate to expose the piezoelectric layer; forming a top electrode and a second mass loading layer in sequence on the piezoelectric layer; and releasing the sacrificial layer to form a cavity between the first mass loading layer and the supporting layer.
    Type: Application
    Filed: May 24, 2023
    Publication date: November 30, 2023
    Inventors: Chao GAO, Yang ZOU, Yao CAI, Dawdon CHEAM, Yuanhang QU, Yaxin WANG, Bowoon SOON, Chengliang SUN
  • Patent number: 11821662
    Abstract: The disclosed technology includes a heat pump having a thermal energy storage (TES) material. The heat pump can include a first heat exchanger to exchange heat between ambient air and refrigerant, a second heat exchanger to exchange heat between the refrigerant and air supplied to a climate-controlled space, and a third heat exchanger to exchange heat between the TES material and the refrigerant in a first fluid path and the refrigerant in a second fluid path. The heat pump can include a first compressor to circulate refrigerant to the first, second, and third heat exchangers and a second compressor to circulate refrigerant to the second and third heat exchangers. The first compressor can facilitate heat exchange between the ambient air and the TES material and the second compressor can facilitate heat exchange between the TES material and the air supplied to the climate-controlled space.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 21, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Patent number: 11808494
    Abstract: The disclosed technology includes devices, systems, and methods for heat pump systems configured to operate in low ambient temperatures. The disclosed technology can include a heat pump water heater system having an evaporator, a first compressor configured to compress refrigerant to a first pressure, and a second compressor configured to compress the refrigerant to a second pressure. The second pressure can be greater than the first pressure. The heat pump water heater system can include a preheater configured to receive the refrigerant at the first pressure and heat water and a condenser configured to receive the refrigerant at the second pressure and heat water. The water can be passed through the preheater before being passed through the condenser.
    Type: Grant
    Filed: October 26, 2021
    Date of Patent: November 7, 2023
    Assignee: Rheem Manufacturing Company
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Patent number: 11787989
    Abstract: Disclosed are methods for providing heating and/or cooling of the type comprising evaporating refrigerant liquid and condensing refrigerant vapor in a plurality of repeating cycles, where the method comprises (a) providing the refrigerant comprising at least about 5% by weight of a lower alkyl iodofluorocarbon; and (b) exposing at least a portion of said refrigerant in at least a portion of said plurality of said cycles to a sequestration material comprising: i) copper or a copper alloy; ii) a molecular sieve (preferably a zeolite), comprising copper, silver, lead or a combination thereof; iii) an anion exchange resin, and iv) a combination of two or more of these, wherein said exposing temperature is preferably above about 20 C.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: October 17, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Ankit Sethi, Samuel F. Yana Motta, Elizabet del Carmen Vera Becerra, Yang Zou, Henna Tangri, Gregory L. Smith
  • Publication number: 20230318557
    Abstract: The present application provides a resonator and a preparation method for a resonator, and relates to the technical field of semiconductors. The method involves introducing a first single crystal substrate to facilitate the epitaxial growth of a high-quality single crystal piezoelectric layer on the first single crystal substrate, and firstly performing ion implantation on the first single crystal substrate to form a damaged layer at a certain depth within it. Therefore, while the first single crystal substrate is removed, it is firstly possible to adopt the heating process, and after the first single crystal substrate is subjected to high-temperature treatment, a first layer and a second layer are split at the damaged layer, thereby a part of the first single crystal substrate is firstly removed, and then the remaining part of the first single crystal substrate is removed by trimming, etching, and other modes.
    Type: Application
    Filed: March 24, 2023
    Publication date: October 5, 2023
    Inventors: Yao CAI, Binghui LIN, Yang ZOU, Dawdon CHEAM, Zhipeng DING, Bowoon SOON, Chengliang SUN
  • Patent number: 11761693
    Abstract: Embodiments include heat pump systems with gas bypasses and related methods. In one embodiment, a system may include a gas bypass tank having a bypass inlet, a liquid outlet, and a vapor outlet, and a first splitting valve having a first splitter outlet in fluid communication with the bypass inlet, a first splitter inlet in fluid communication with the liquid outlet, and a first switching path configured to switch between a first conduit path in fluid communication with a first coil system and a second conduit path in fluid communication with a second coil system.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: September 19, 2023
    Assignee: RHEEM MANUFACTURING COMPANY
    Inventor: Yang Zou
  • Publication number: 20230231528
    Abstract: A resonator and a preparation method of a resonator, and a filter relate to the technical field of resonators.
    Type: Application
    Filed: January 17, 2023
    Publication date: July 20, 2023
    Inventors: Tiancheng LUO, Yao CAI, Chao GAO, Yang ZOU, Binghui LIN, Kaixiang LONG, Bowoon SOON, Chengliang SUN
  • Publication number: 20230223908
    Abstract: The present disclosure provides a single crystal film bulk acoustic resonator, a manufacturing method for a single crystal film bulk acoustic resonator, and a filter, and relates to the technical field of filters. The method includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode that are stacked on a temporary base substrate; forming a first bonding layer on the first electrode; providing a substrate; etching the substrate to form a plurality of first bumps on a surface of the substrate; forming a second bonding layer covering top surfaces of the plurality of first bumps on the surface of the substrate; and bonding the second bonding layer located at the top surfaces of the plurality of first bumps to the first bonding layer.
    Type: Application
    Filed: November 16, 2022
    Publication date: July 13, 2023
    Inventors: Yang ZOU, Yao CAI, Binghui LIN, Tiancheng LUO, Chao GAO, Dawdon CHEAM, Bowoon SOON, Chengliang SUN
  • Publication number: 20230220259
    Abstract: The present invention relates to heat transfer compositions comprising refrigerant, lubricant and stabilizer, wherein the refrigerant comprises from about 5% by weight to 100% by weight of trifluoroiodomethane (CF3I), and wherein said lubricant comprises polyol ester (POE) lubricant and/or polyvinyl ether (PVE) lubricant, and wherein said stabilizer comprises an alkylated naphthalene and optionally but preferably an acid depleting moiety.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 13, 2023
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Gregory Laurence Smith, Ankit Sethi, Yang Zou, Samuel F. Yana Motta
  • Publication number: 20230188334
    Abstract: This application discloses quantum key distribution methods and devices, and storage media. In an implementation, an ith node generates, based on a determined first quantum key corresponding to the ith node on a target routing path and a determined second quantum key corresponding to the ith node on the target routing path, a third quantum key corresponding to the ith node on the target routing path, and sends the third quantum key corresponding to the ith node on the target routing path to a destination node on the target routing path, or encrypts a received first ciphertext by using the third quantum key corresponding to the ith node on the target routing path, and sends an obtained second ciphertext corresponding to the ith node to an (i+1)th node on the target routing path.
    Type: Application
    Filed: February 8, 2023
    Publication date: June 15, 2023
    Inventors: Zhengyu LI, Changzheng SU, Su HU, Yang ZOU
  • Publication number: 20230130780
    Abstract: The disclosed technology includes a heat pump having a thermal energy storage (TES) material. The heat pump can include a first heat exchanger to exchange heat between ambient air and refrigerant, a second heat exchanger to exchange heat between the refrigerant and air supplied to a climate-controlled space, and a third heat exchanger to exchange heat between the TES material and the refrigerant in a first fluid path and the refrigerant in a second fluid path. The heat pump can include a first compressor to circulate refrigerant to the first, second, and third heat exchangers and a second compressor to circulate refrigerant to the second and third heat exchangers. The first compressor can facilitate heat exchange between the ambient air and the TES material and the second compressor can facilitate heat exchange between the TES material and the air supplied to the climate-controlled space.
    Type: Application
    Filed: October 26, 2021
    Publication date: April 27, 2023
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Publication number: 20230129242
    Abstract: The disclosed technology includes devices, systems, and methods for heat pump systems configured to operate in low ambient temperatures. The disclosed technology can include a heat pump water heater system having an evaporator, a first compressor configured to compress refrigerant to a first pressure, and a second compressor configured to compress the refrigerant to a second pressure. The second pressure can be greater than the first pressure. The heat pump water heater system can include a preheater configured to receive the refrigerant at the first pressure and heat water and a condenser configured to receive the refrigerant at the second pressure and heat water. The water can be passed through the preheater before being passed through the condenser.
    Type: Application
    Filed: October 26, 2021
    Publication date: April 27, 2023
    Inventors: Yang Zou, Sivakumar Gopalnarayanan
  • Publication number: 20230128232
    Abstract: The disclosed technology includes systems and methods for a heat pump water heater. The disclosed technology can include a heat pump water heater system having an evaporator, a condenser, a vapor injection line, a compressor, and a multi-fluid heat exchanger. The vapor injection line can include an expansion valve to transition refrigerant received from the condenser at a first pressure to a second pressure. The compressor can be configured to circulate refrigerant through the condenser, the multi-fluid heat exchanger, the vapor injection line, and the evaporator. The multi-fluid heat exchanger can be configured to receive refrigerant at a first pressure from the condenser, refrigerant at a second pressure from the vapor injection line, and water. The multi-fluid heat exchanger can further facilitate heat transfer between the refrigerants at the first and second pressures and the water to preheat the water before the water is passed through the condenser.
    Type: Application
    Filed: October 26, 2021
    Publication date: April 27, 2023
    Inventors: Yang Zou, Sivakumar Gopalnarayanan, Atilhan Manay, Vishwanath Reddy Ardha
  • Publication number: 20230121689
    Abstract: Provided are a cephalosporin compound represented by formula I-1, I-2, or I-3, a pharmaceutical composition comprising same, and use thereof as an antibacterial agent.
    Type: Application
    Filed: January 22, 2021
    Publication date: April 20, 2023
    Inventors: Jian HUANG, Lingjian ZHU, Yang ZOU, Cili ZHANG
  • Publication number: 20230105200
    Abstract: Provided are a display panel and a display apparatus. The display panel includes a first display region and a second display region. The light transmittance of the first display region is greater than the light transmittance of the second display region. The display panel also includes a substrate and at least one light adjustment layer disposed on one side of the substrate. Each light adjustment layer includes a first light adjustment layer and a second light adjustment layer. The first light adjustment layer is disposed on the side of the second light adjustment layer facing away from the substrate. The refractive index of the first light adjustment layer is greater than the refractive index of the second light adjustment layer.
    Type: Application
    Filed: December 9, 2022
    Publication date: April 6, 2023
    Applicant: Wuhan Tianma Microelectronics Co., Ltd.
    Inventor: Yang ZOU
  • Publication number: 20230092227
    Abstract: The present application provides a preparation method for synthesizing a chiral nicotine from a chiral tert-butylsulfenamide, which includes steps as follows: condensating 3-pyridinecarboxaldehyde with tert-butylsulfenamide at the presence of a titanate; and then reacting (1,3-dioxane-2-yl ethyl) magnesium bromide; cyclizing under an acidic condition; finally obtaining chiral nicotine after reduction and amine methylation.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 23, 2023
    Applicant: SHENZHEN ZINWI BIO-TECH CO., LTD
    Inventors: Jun ZOU, Yang ZOU, Meisen LIU, Weixian LUO
  • Publication number: 20230091745
    Abstract: The disclosure provides a film bulk acoustic resonator and a manufacturing method therefor, and a film bulk acoustic wave filter, and relates to the technical field of resonators. The film bulk acoustic resonator includes a substrate, where the substrate is provided with two opposite protective walls protruding out of a surface of the substrate, a cavity is formed between the two protective walls, and an insulating layer is further arranged on one side, away from the cavity, of each protective wall on the substrate; and the film bulk acoustic resonator further includes a transducer stacking structure, where the transducer stacking structure covers the insulating layer, the cavity and the protective walls, and two sides, along a stacking direction, of the transducer stacking structure are in communication with the cavity and the outside respectively.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 23, 2023
    Inventors: Bangtao CHEN, Zhipeng DING, Bowoon SOON, Liyan SIOW, Feng GAO, Yang ZOU, Chengliang SUN