Abstract: Semiconductor devices and methods which utilize a treatment process of a bottom anti-reflective layer are provided. The treatment process may be a physical treatment process in which material is added in order to fill holes and pores within the material of the bottom anti-reflective layer or else the treatment process may be a chemical treatment process in which a chemical reaction is used to form a protective layer. By treating the bottom anti-reflective layer the diffusion of subsequently applied chemicals is reduced or eliminated, thereby helping to prevent defects that arise from such diffusion.

Abstract: An electrical connector assembly mounted on a printed circuit board (PCB) includes an insulating housing. The insulating housing includes a base with opposite front and rear end regions and a plurality of side walls upwardly extending from the base. The base cooperates with the side walls to commonly define a first receiving room. A notch defined in the front region of the base forms a second receiving room under the first receiving room. Said second receiving room is smaller than the first receiving room in both the front-to-back direction and a transverse direction perpendicular to said front-to-back direction. No portions of said contacts are located in the second receiving room so as to allow an optoelectronic module including a first portion and a second portion to be snugly received in the first receiving room and the second receiving room respectively, the second portion is attached to the first portion and supported on a top surface of the PCB.

Abstract: An electrical connector assembly mounted on a printed circuit board (PCB) includes an insulating housing. The insulating housing includes a base with opposite front and rear end regions and a plurality of side walls upwardly extending from the base. The base cooperates with the side walls to commonly define a first receiving room. A notch defined in the front region of the base forms a second receiving room under the first receiving room. Said second receiving room is smaller than the first receiving room in both the front-to-back direction and a transverse direction perpendicular to said front-to-back direction. No portions of said contacts are located in the second receiving room so as to allow an optoelectronic module including a first portion and a second portion to be snugly received in the first receiving room and the second receiving room respectively, the second portion is attached to the first portion and supported on a top surface of the PCB.

Abstract: Provided herewith a land grid array socket comprises an insulative housing having a plurality of contacts and a metallic reinforce plate positioned at a bottom surface of the housing. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts.

Abstract: An electrical connector (1) for attaching an IC package to a circuit member includes a base (3) defining four side walls, a number of terminals receiving in the base, a cover (4) slidably mounted on the base and a lever (5) slidably moving the cover relative to the base. The base defines a plurality of grooves (31) extending from one side wall of the base to any other side wall of the base and one end of the groove is communicated with exterior space to decline the temperature of the terminals.

Abstract: A socket connector (1) for connecting an IC package to a printed circuit board includes a base (10) mounting a plurality of conductive terminals therein. A cover (13) assembled on the base (10) and sliding along a first direction relative to the base defines a pair of sidewalls (132, 133) extending downwardly therefrom. An actuating lever (14) drives the cover (13) sliding on the base (10). The sidewalls (132, 133) of the cover (13) are fitly engaging with corresponding sides (111, 112) of the base (10) except a releasing slot (1110, 1120) defined between part portion of the sidewall and the side.

Abstract: A socket connector terminal (1) adapted for connecting an IC package to a PCB includes a base portion (10) for retaining, a pair of contacting portion (113) for connecting with the IC package, a pair of resilient arm (11) respectively connecting with the base portion and the contacting portions and a solder portion (12) for soldering on the PCB. The pair of resilient arms each includes a short bridge portion (111) extending outward from a lateral side of base portion and a resilient portion (112) extending upward from the bridge portion. The solder portion extends downwards from one of the bridge portion.

Abstract: In a land grid array connector for electrically connecting a chip module to a printed circuit board, comprising: an insulative housing and a plurality of contacts, the housing including side walls and a central portion surrounded by the side walls, the central portion having a first mounting face toward the chip module, a second mounting face toward the printed circuit board, and a plurality of grooves receiving the contacts, at least two of the side walls each including a spring arm extending into the central portion, the improvement wherein a protrusion is disposed on at least one of the spring arm and the associated side wall.

Abstract: Provided herewith a land grid array socket comprises an insulative housing having a plurality of contacts. The insulative housing has a top surface for receiving a land grid array package. A cover member is pivotally mounted on a first end of the insulative housing. The cover member is pivotal between an open position and a closed position where the cover member presses the land grid array package toward the top surface of the insulative housing so that the land grid array package electrically connects to the contacts.

Abstract: A socket connector (1) for connecting an IC package to a printed circuit board includes a base (10) mounting a plurality of conductive terminals therein. A cover (13) assembled on the base (10) and sliding along a first direction relative to the base defines a pair of sidewalls (132, 133) extending downwardly therefrom. An actuating lever (14) drives the cover (13) sliding on the base (10). The sidewalls (132, 133) of the cover (13) are fitly engaging with corresponding sides (111, 112) of the base (10) except a releasing slot (1110, 1120) defined between part portion of the sidewall and the side.

Abstract: A socket connector terminal (1) adapted for connecting an IC package to a PCB includes a base portion (10) for retaining, a pair of contacting portion (113) for connecting with the IC package, a pair of resilient arm (11) respectively connecting with the base portion and the contacting portions and a solder portion (12) for soldering on the PCB. The pair of resilient arms each includes a short bridge portion (111) extending outward from a lateral side of base portion and a resilient portion (112) extending upward from the bridge portion. The solder portion extends downwards from one of the bridge portion.

Abstract: An electrical connector (10) includes a base (101), and a cover (102) locatable above the base. The base has a major surface (1011) with a plurality of terminal receiving passageways (1010) extending therefrom. The cover has a major face (1025) opposite the major surface and spaced apart from the major surface of the base. A plurality of discrete protrusions (1012) is arranged extending longitudinally from one of said major face and said major surface towards the other, and positionable adjacent the passageways. Thus, a plurality of voids is located laterally adjacent the discrete protrusions and between the major surface of the base and the major face of the cover, thereby allowing the heat from pin-like conductive elements (21) of a CPU chip (20) to be dissipated through the plurality of laterally voids around the pin-like conductive elements.

Abstract: An electrical connector (1) for attaching an IC package to a circuit member includes a base (3) defining four side walls, a number of terminals receiving in the base, a cover (4) slidably mounted on the base and a lever (5) slidably moving the cover relative to the base. The base defines a plurality of grooves (31) extending from one side wall of the base to any other side wall of the base and one end of the groove is communicated with exterior space to decline the temperature of the terminals.

Abstract: An LGA connector contact (30) includes a base (31), and a pair of spring arms (32) extending from the base. One of the spring arms includes an extending section (320), a connecting section (321), and a contacting section (322) adapted for engaging a contact pad of an IC package. The contacting section has an exterior side and an interior side, with a recess (323) on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions (324) adjacent the recess. The LGA contacting portion is configured to have its contact regions electrically engage with un-oxidized portions of the IC package, thereby achieving an effective electrical connection between the LGA connector contact and the corresponding IC package pad.

Abstract: An assembled method about an electrical connector comprises the following steps: A. providing a housing received a plurality of terminals and defined a housing hole; B. providing a cover defined a cover hole thereof; C. mounting the cover on the housing and making the housing hole in alignment with the cover hole; D. providing a cam defined a end surface and a riveting plate for riveting the cam; E. inserting the cam into the cover hole, the housing hole and riveting hole in turn; F. using the pressing header riveting the end surface of the cam; in addition, the assemble method further comprises the step G: defining a recess with the shape similar to the shape of the pressing header.

Abstract: Provided is an electrical connector (3) including an insulative housing (20) defining a number of passageways (202) and a number of contacts (1) received in the corresponding passageways, respectively. Each passageway defines a T-shaped cross-sectional configuration including a narrow fastening slot (2021) and a wide receiving slot (2022) communicated with each other. The contact forms a planar medial section (14) interferingly secured in the fastening slot and a dome-shaped bulge (142) projecting from the planar medial section. A lying wall (2024) adjacent the narrow fastening slot correspondingly defines a recess (2023) to receive the bulge. Therefore, the contact can be securely retained in the passageway and free from disengaging or deflecting from the passageway.

Abstract: An LGA connector contact (30) includes a base (31), and a pair of spring arms (32) extending from the base. Each of the spring arms includes an extending section (320), a connecting section (321), and a contacting section (322) adapted for engaging a circuit board's contact pad. The contacting section has an exterior side and an interior side with a recess (323) on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions (324) adjacent the recess. The LGA contacting portion is configured to have its contact regions electrically engage with an un-oxidized portion of the circuit board's contact pad, thereby achieving an effective electrical connection between the LGA connector contact and the corresponding circuit board pad.

Abstract: In a land grid array connector for electrically connecting a chip module to a printed circuit board, comprising: an insulative housing and a plurality of contacts, the housing including side walls and a central portion surrounded by the side walls, the central portion having a first mounting face toward the chip module, a second mounting face toward the printed circuit board, and a plurality of grooves receiving the contacts, at least two of the side walls each including a spring arm extending into the central portion, the improvement wherein a protrusion is disposed on at least one of the spring arm and the associated side wall.

Abstract: A land grid array socket (1) in accordance with the present invention is provided. The socket comprises an insulative housing (2) having a plurality of passageways (24) extending throughout an upper mating surface (22) and a lower mounting surface (20). A plurality of electrical terminals (3) are received in corresponding passageways, each terminal comprises a first part (32) having a first spring arm (322) extending out of the upper mating surface for electrically connected to an IC chip (4) and a second spring arm (306) extending out of the lower mounting surface for electrically connected to a motherboard (5). The first part and the second part are accommodated in a same passageway and separate from each other while interconnected by a third spring arm (304) settled therebetween.

Abstract: An LGA connector contact (30) includes a base (31), and a pair of spring arms (32) extending from the base. Each of the spring arms includes an extending section (320), a connecting section (321), and a contacting section (322) adapted for engaging a circuit board's contact pad. The contacting section has an exterior side and an interior side with a recess (323) on the exterior side of the contacting section around a middle portion of the contacting section so as to define at least a pair of contact regions (324) adjacent the recess. The LGA contacting portion is configured to have its contact regions electrically engage with an un-oxidized portion of the circuit board's contact pad, thereby achieving an effective electrical connection between the LGA connector contact and the corresponding circuit board pad.