Abstract: System and method for replacing a resist filter in such a manner as to reduce filter-induced wafer defects are described. In one embodiment, the system comprises a filtration system connected to a dispenser, the filtration system comprising a filter; and a switch connected to the filter for selectively connecting the filtration system to throughput one of a first chemical solution and a second chemical solution.

Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.

Abstract: The present disclosure provides a lithography apparatus. The apparatus includes an exposure module designed for exposure processing; a baking module embedded in the exposure module and designed for post exposure baking (PEB); and a control module designed to control the exposure module and the baking module.

Abstract: System and method for replacing a resist filter in such a manner as to reduce filter-induced wafer defects are described. In one embodiment, the system comprises a filtration system connected to a dispenser, the filtration system comprising a filter; and a switch connected to the filter for selectively connecting the filtration system to throughput one of a first chemical solution and a second chemical solution.

Abstract: A method and apparatus for adjusting exhaust flow, and the apparatus has a programmable exhaust control regulator generating a first input signal to a motor control circuit, an exhaust flow meter generating a second input signal to the motor control circuit and a motor driven control valve moved to different positions according to the first and second input signals, the control valve being installed in an exhaust portion of the hot plate apparatus.

Abstract: In the manufacture of semiconductor devices, a system and method for delivering gas at a predetermined rate of flow is disclosed, which includes: a flow controller having a diaphragm forming upstream and downstream chambers; a regulator for delivering gas to the upstream chamber of the flow controller at a substantially constant pressure, the controller having an outlet from the downstream chamber which is opened and closed by the diaphragm; an urging means for urging the diaphragm toward its closed position; and a valve for selectively adjusting the spring force to achieve the predetermined rate of flow without having to use a gas flow measurement device to monitor the flow rate.

Abstract: A method and apparatus for adjusting exhaust flow, and the apparatus has a programmable exhaust control regulator generating a first input signal to a motor control circuit, an exhaust flow meter generating a second input signal to the motor control circuit and a motor driven control valve moved to different positions according to the first and second input signals, the control valve being installed in an exhaust portion of the hot plate apparatus.

Abstract: A method and apparatus for rinsing and drying a substrate (100) of a semiconductor wafer (102), has a first nozzle (110) dispensing rinsing fluid against the substrate (100); and a second nozzle (114) dispensing dry gas under pressure against the substrate (100) during a drying cycle to dry the substrate (100) completely. The second nozzle (114) can point to the substrate (100) while the substrate (100) spins. The nozzles (110) and (114) can be positioned by a robot arm (112).

Abstract: An exhaust apparatus for evacuating vapor during baking of liquid chemicals deposited on substrates including a heating chamber containing a hot plate for horizontally supporting and heating a substrate. A cover plate is suspended horizontally over the hot plate; the cover plate has a plurality of exhaust ports extending from the top to its bottom surfaces. The ports are radially and evenly disposed midway between the periphery and a centered port with a manifold mounted to the top of the cover plate. The manifold has tubular conduits connected underneath to each exhaust port. Each conduit has an adjustable damper disposed at its front opening for regulating the vapor being exhausted. The tubular conduits converge from each exhaust port towards a common enclosure with an exhaust pipe coupled to its top for exhausting vapor to an external recovery facility.

Abstract: A developer dispensing apparatus for dispensing developer solution onto a semiconductor wafer substrate which has a vertically-adjustable knife ring. The knife ring is vertically actuated in the apparatus by pressurized air or fluid. In an application, the gap distance between the upper edge of the knife ring and the backside of the wafer is initially adjusted to a minimum value as the developer solution is dispensed onto the wafer, by adjusting the knife ring to the uppermost position in the apparatus.

Abstract: A system for resist recycling includes a supply tank for storing a resist, a supply line connecting the supply tank with a pump therein for transferring the resist, a nozzle connected to the supply line for dispensing a predetermined dosage of the resist, and a recycle tank for receiving the predetermined dosage of dummy resist dispensed by the nozzle. The dummy resist is dispensed to prevent crystallized resist at the nozzle. A recycle line is disposed between the recycle tank and the supply tank for recycling the resist received by the recycle tank to the supply tank. The system can further include a coating system working in cooperation with the resist recycling system. Other systems and methods are also provided.

Abstract: A liquid dispensing nozzle beneficial in varying or controlling the quantity of a developing liquid dispensed onto various regions of a semiconductor wafer substrate during the photolithography step of semiconductor fabrication is disclosed. The liquid dispensing nozzle includes a nozzle housing which includes a bottom dispensing opening. A shutter plate in the nozzle housing is engaged by a shutter motor which displaces the shutter plate in the nozzle head and varies the position of the shutter plate with respect to the dispensing opening. The shutter plate opening narrows as the developing liquid is dispensed onto the edge of the substrate to prevent excessive application of the liquid onto those regions. The shutter plate widens the opening as the developing liquid is dispensed onto the central region of the substrate.

Abstract: A spin-coater for coating a liquid material on a wafer that is equipped with a self-cleaning coating cup and a method for self-cleaning a spin-coater are described. The spin-coater is constructed of a coating cup of circular shape, a wafer pedestal situated in the cup, a coating material dispensing nozzle over the pedestal, a motor means for rotating the pedestal, and a solvent dispensing means that is mounted juxtaposed to an upper rim of the sidewall of the cup for dispensing a cleaning solvent onto an interior surface of the sidewall to dissolve and rinse off any liquid coating material splattered thereon and to prevent the formation of solid contamination from the solidified coating material.

Abstract: A spin-coater for coating a liquid material on a wafer that is equipped with a self-cleaning coating cup and a method for self-cleaning a spin-coater are described. The spin-coater is constructed of a coating cup of circular shape, a wafer pedestal situated in the cup, a coating material dispensing nozzle over the pedestal, a motor means for rotating the pedestal, and a solvent dispensing means that is mounted juxtaposed to an upper rim of the sidewall of the cup for dispensing a cleaning solvent onto an interior surface of the sidewall to dissolve and rinse off any liquid coating material splattered thereon and to prevent the formation of solid contamination from the solidified coating material.

Abstract: A flow system that is suitable for controlled dispensing of liquids such as anti-reflection coatings is described. The system is driven by a gas at high pressure from a single dispensing bottle. On emerging from the dispensing bottle the fluid is directed into one of two branches, each such branch being terminated by its own nozzle. By inserting a needle valve in each branch of the flow system, between the branch point and the nozzle, control of the amount of liquid dispensed by each nozzle is separately achieved and a change in flow through one nozzle does not affect the flow through the other nozzle.