Patents by Inventor Yao-Sheng LAI

Yao-Sheng LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Anti-curl copper foil
    Patent number: 9287566
    Abstract: The present disclosure relates to an improved coated copper foil that exhibits anti-curl and anti-wrinkle properties; and to methods for manufacturing the foil. Typically, the copper foil of the instant disclosure has: (a) a shiny side; (b) a matte side, wherein the matte side has an MD gloss in the range of 330 to 620; (c) a difference in surface roughness (Rz) between the shiny side and the matte side in the range of 0.3 to 0.59 ?m; and (d) a difference in tensile strength in the transverse direction of 1.2 kgf/mm2 or less.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: March 15, 2016
    Assignee: CHANG CHUN PETROCHEMICAL CO., LTD.
    Inventors: Jui-Chang Chou, Kuei-Sen Cheng, Yao-Sheng Lai, Huei-Fang Huang
  • ELECTRODEPOSITED COPPER FOIL
    Publication number: 20150267313
    Abstract: An electrodeposited copper foil having a texture coefficient of a plane (200) from 50 to 80%, based on the sum of the texture coefficients of a plane (111), the plane (200), a plane (220) and a plane (200) of the electrodeposited copper foil is provided. The electrodeposited copper foil is particularly suitable for use in the applications in printed circuit boards and lithium ion secondary batteries.
    Type: Application
    Filed: September 15, 2014
    Publication date: September 24, 2015
    Applicant: Chang Chun Petrochemical Co., Ltd.
    Inventors: Jui-Chang Chou, Kuei-Sen Cheng, Yao-Sheng Lai, Hsi-Hsing Lo, Yueh-Min Liu
  • ELECTROLYTIC COPPER FOIL, CLEANING FLUID COMPOSITION AND METHOD FOR CLEANING COPPER FOIL
    Publication number: 20150225678
    Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.
    Type: Application
    Filed: April 24, 2015
    Publication date: August 13, 2015
    Applicant: Chang Chun Petrochemical Co., Ltd.
    Inventors: Kuei-Sen Cheng, Yao-Sheng LAI, Tsang-Jin JUO, Jui-Chang CHOU, Hsi-Hsing LO, Yueh-Min LIU
  • ELECTROLYTIC COPPER FOIL, CLEANING FLUID COMPOSITION AND METHOD FOR CLEANING COPPER FOIL
    Publication number: 20150037606
    Abstract: An electrolytic copper foil includes a copper foil body; and a IIA-group metal adhered to a surface of the copper foil body, wherein a signal strength of the IIA group metal is greater than 0.1% based on a signal strength of copper element as 100% analyzed by a secondary ion mass spectrometer. The present invention also provides a method for cleaning copper foil and a cleaning fluid composition which is used in the cleaning method.
    Type: Application
    Filed: October 4, 2013
    Publication date: February 5, 2015
    Applicant: Chang Chun Petrochemical Co., Ltd.
    Inventors: Kuei-Sen CHENG, Yao-Sheng LAI, Tsang-Jin JUO, Jui-Chang CHOU, Hsi-Hsing LO, Yueh-Min LIU