Abstract: A light emitting module is provided with a light emitting element and an optical wavelength converting member. The optical wavelength converting member includes a light incident plane, a light output plane, and an outer plane which is a plane except for said light incident plane and said light output plane. The optical wavelength converting member converts a wavelength of light emitted on the light emitting element and entered from the light incident plane into the optical wavelength converting member and outputs the wavelength-converted light from the light output plane. An average roughness “Ra” of at least a portion of the outer plane is lower than an average roughness of the light output plane.

Abstract: In a plate-shaped fluorescent member configured to convert the wavelength of the light emitted by a semiconductor light emitting element, the fluorescent member is formed of an inorganic material having a refractive index of 1.5 or more and a light transmittance at the emission peak wavelength of the semiconductor light emitting element of less than 20%. A concave portion is formed, of the surfaces of the fluorescent member, on the surface on the side where the light in the semiconductor light emitting element is mainly emitted. In the fluorescent member, the light transmittance of the light having a wavelength of 380 nm to 500 nm may be less than 20%. The concave portion may be a groove. The concave portion may be a plurality of holes that are scattered.

Abstract: In a plate-shaped fluorescent member configured to convert the wavelength of the light emitted by a semiconductor light emitting element, the fluorescent member is formed of an inorganic material having a refractive index of 1.5 or more and a light transmittance at the emission peak wavelength of the semiconductor light emitting element of less than 20%. A concave portion is formed, of the surfaces of the fluorescent member, on the surface on the side where the light in the semiconductor light emitting element is mainly emitted. In the fluorescent member, the light transmittance of the light having a wavelength of 380 nm to 500 nm may be less than 20%. The concave portion may be a groove. The concave portion may be a plurality of holes that are scattered.

Abstract: In a light wavelength conversion unit, a light wavelength conversion member is placed on the emission surface of a semiconductor light-emitting element. The light wavelength conversion member converts the wavelength of blue light, which has emitted from the semiconductor light-emitting element and entered from an incident surface, so as to emit yellow light and then emits the yellow light from an emission surface. A light reflection layer is provided on a lateral face in the surface of the light wavelength conversion member. Here, the lateral face excludes the incident surface and the emission surface. The light wavelength conversion member is roughened such that an average roughness Ra of the lateral face is 0.5 ?m or above.

Abstract: A light emitting module includes: an LED chip; a plate-shaped phosphor layer that is provided so as to face the light emitting surface of the LED chip and is configured to convert the wavelength of the light emitted by the LED chip; and a filter layer that is formed, of the surfaces of the phosphor layer, on at least one of the surface that faces the LED chip and the side surface, and that is configured to transmit the light emitted from the LED chip and to reflect the light whose wavelength has been converted by the phosphor layer. The filter layer is formed such that a ratio of the energy of the emitted light within a range of ±60° with respect to the front direction to the total energy of emitted light is 80% or more.

Abstract: In a light emitting module 40, light wavelength conversion ceramic 58 converts the wavelength of the light emitted by a semiconductor light emitting element 52. The light wavelength conversion ceramic 58 is made so transparent that the light wavelength conversion ceramic 58 has 40 percent or more of the total light transmittance of the light with a wavelength within the conversion wavelength range. A reflective film 60 is provided on the surface of the light wavelength conversion ceramic 58 and narrows down the emission area of the light that has transmitted the light wavelength conversion ceramic 58 to an area smaller than the light emitting area of the semiconductor light emitting element 52. In the case, the reflective film 60 guides the light such that the light is emitted in the direction approximately parallel to the light emitting surface of the light emitting element 52.

Abstract: A light-emitting module 50 is provided with a substrate 54, a plurality of semiconductor light-emitting elements 52a through 52d mounted on the substrate 54 and arranged in a matrix, a fluorescent substance layer 58 provided such that the fluorescent substance layer 58 faces respective light-emitting surfaces 56a through 56d of the semiconductor light-emitting elements, and light-shielding portions 60a through 60d provided such that the light-shielding portions surround the perimeter of respective light-emitting surfaces of at least some light-emitting elements among the plurality of semiconductor light-emitting elements.

Abstract: A light emitting module includes a plurality of light emitting units that emits light by using semiconductor light emitting elements, and a substrate that supports the plurality of arranged light emitting units. The light emitting units include light guide portions that guide light emitted by the semiconductor light emitting elements so that light emitted by the semiconductor light emitting elements is not directed at irradiation regions of adjacent light emitting units.

Abstract: A light emitting module includes a board on which a plurality of light emitting devices are mounted, a first interconnecting section having first interconnections, one end of each of which being connected to one of an anode side and an cathode side of an associated one of the light emitting devices, a second interconnecting section having second interconnections, one end of each of which being connected to the other of the anode side and the cathode side of an associated one of the light emitting devices, and a power supply portion provided along one side of the board to receive an external power. The second interconnecting section has at least one, but less than the number of the second interconnections, collectively interconnecting portion to which another end of each of the second interconnections is connected.

Abstract: A light emitting module includes: a plurality of semiconductor light emitting elements; a substrate by which the arranged plurality of semiconductor light emitting elements are supported; and a plate-shaped light wavelength conversion component that is provided so as to face the light emitting surfaces of the plurality of semiconductor light emitting elements and that converts the wavelength of the light emitted by the semiconductor light emitting element. A phosphor layer has a shielding portion formed in the boundary between respective areas facing the respective light emitting surfaces of the adjacent semiconductor light emitting elements.

Abstract: A light emitting device is provided with a semiconductor light emitting element and a wavelength conversion portion. The wavelength conversion portion includes an outer peripheral portion between an input surface and an output surface. The outer peripheral portion includes a first inclined part at a side of the input surface and a second inclined part at a side of the output surface. The first inclined part and the second inclined part define a projecting portion that is projected on the outer peripheral portion.

Abstract: In a light emitting module, each of a first light wavelength conversion member, a second light wavelength conversion member, and a third light wavelength conversion member converts the wavelength of the light emitted by a semiconductor light emitting element to emit the light within a wavelength range different from the others. Each of the first light wavelength conversion member, the second light wavelength conversion member, and the third light wavelength conversion member is formed into a plate shape and is laminated such that the light emitted by the semiconductor light emitting element passes through each of them in descending order of the average wavelength of the light whose wavelength has been converted.

Abstract: A light source module includes a circuit board on which a circuit pattern is formed; a semiconductor light emitting element; an electrode pad; and a connecting body. The semiconductor light emitting element includes a first surface formed into an oblong shape, and a second surface positioned facing opposite the first surface. The second surface is connected with a second part of the circuit pattern. The electrode pad is provided on the first surface of the semiconductor light emitting element and includes a connecting portion. The connecting body is connected with the connecting portion of the electrode pad and a first part of the circuit pattern. The electrode pad is provided on a portion of the semiconductor light emitting element that includes one end portion of the first surface. The connecting portion of the electrode pad is provided at a position in one of a continuous and spaced manner in the lengthwise direction of the electrode pad.

Abstract: In a light emitting module 40, a semiconductor light emitting element 48 is configured by forming an electrode pattern to which a current for light emission is supplied on the light emitting surface 48a. A light wavelength conversion member 52 is formed to be transparent and to convert the wavelength of the light emitted by the semiconductor light emitting element 48 and to emit the light from the emitting surface 52a. In the light wavelength conversion member 52, a plurality of protruding portions 52b are provided on the emitting surface 52a at an arrangement interval smaller than the repeating pattern interval in the electrode pattern. Each of the plurality of protruding portions 52b is formed into a hemispherical shape. In addition, the plurality of protruding portions 52b are provided on the emitting surface 52a at an arrangement interval of 300 ?m or less.

Abstract: In a light emission module (40), a light wavelength conversion ceramic (52) is formed in a sheet shape which converts the wavelength of the light emitted from a semiconductor light emission element (48) when emitting the light. The light wavelength conversion ceramic (52) has a tapered plane (52a) which is inclined to approach the semiconductor light emission element (48) toward the brim portion. The light wavelength conversion ceramic (52) is transparent and is arranged so that the light emission wavelength band after the conversion has an all ray permeability of 40% or above.

Abstract: A light emitting module is provided with a light emitting element and an optical wavelength converting member. The optical wavelength converting member includes a light incident plane, a light output plane, and an outer plane which is a plane except for said light incident plane and said light output plane. The optical wavelength converting member converts a wavelength of light emitted on the light emitting element and entered from the light incident plane into the optical wavelength converting member and outputs the wavelength-converted light from the light output plane. An average roughness “Ra” of at least a portion of the outer plane is lower than an average roughness of the light output plane.

Abstract: In a light emitting module 40, light wavelength conversion ceramic 58 converts the wavelength of the light emitted by a semiconductor light emitting element 52. The light wavelength conversion ceramic 58 is made so transparent that the light wavelength conversion ceramic 58 has 40 percent or more of the total light transmittance of the light with a wavelength within the conversion wavelength range. A reflective film 60 is provided on the surface of the light wavelength conversion ceramic 58 and narrows down the emission area of the light that has transmitted the light wavelength conversion ceramic 58 to an area smaller than the light emitting area of the semiconductor light emitting element 52. In the case, the reflective film 60 guides the light such that the light is emitted in the direction approximately parallel to the light emitting surface of the light emitting element 52.

Abstract: In a light emitting module 40, a light wavelength conversation ceramic 52 converts the wavelength of the light emitted by a semiconductor light emitting element 48 then emits the light. An optical filter 50 transmits the blue light Lb mainly emitted by the semiconductor light emitting element 48 and reflects the yellow light Ly whose wavelength has been mainly converted by the light wavelength conversion ceramic 52. The optical filter 50 is provided on the surface of the light wavelength conversion ceramic 52. The light emitting module 40 is manufactured by: the process where the optical filter 50 is provided on at least one surface of the light wavelength conversion ceramic 52; and the process where the semiconductor light emitting element 48 and the light wavelength conversion ceramic 52 are arranged such that the light emitted by the semiconductor light emitting element 48 is incident into the light wavelength conversion ceramic 52.

Abstract: A light emitting module includes a plurality of light emitting units that emits light by using semiconductor light emitting elements, and a substrate that supports the plurality of arranged light emitting units. The light emitting units include light guide portions that guide light emitted by the semiconductor light emitting elements so that light emitted by the semiconductor light emitting elements is not directed at irradiation regions of adjacent light emitting units.

Abstract: A light emitting module includes: a plurality of semiconductor light emitting elements; a substrate by which the arranged plurality of semiconductor light emitting elements are supported; and a plate-shaped light wavelength conversion component that is provided so as to face the light emitting surfaces of the plurality of semiconductor light emitting elements and that converts the wavelength of the light emitted by the semiconductor light emitting element. A phosphor layer has a shielding portion formed in the boundary between respective areas facing the respective light emitting surfaces of the adjacent semiconductor light emitting elements.