Abstract: In a light emitting module board, an electrode receiving the supply of current for light emission is provided in the light emitting surface of a semiconductor light emitting device. A light wavelength conversion member is a plate-like member mounted on the light emitting surface, and emits light after converting the wavelength of the light emitted by the semiconductor light emitting device. A relay electrode is provided in the surface of the light wavelength conversion member. The relay electrode extends from a position in contact with the electrode to an exposed position in the external space in a state where the light wavelength conversion member is mounted on the light emitting surface. The relay electrode is provided so that the upper part of the relay electrode, which is the exposed position, extends to a position located opposite to the lower part of the relay electrode which is the contacted position.

Abstract: A vehicular marker lamp including a lamp cover that contains nanosized fluorescent material and light sources that excite the fluorescent material so as to cause the lamp cover to emit colored light.

Abstract: A light source module includes a circuit board on which a circuit pattern is formed; a semiconductor light emitting element; an electrode pad; and a connecting body. The semiconductor light emitting element includes a first surface formed into an oblong shape, and a second surface positioned facing opposite the first surface. The second surface is connected with a second part of the circuit pattern. The electrode pad is provided on the first surface of the semiconductor light emitting element and includes a connecting portion. The connecting body is connected with the connecting portion of the electrode pad and a first part of the circuit pattern. The electrode pad is provided on a portion of the semiconductor light emitting element that includes one end portion of the first surface. The connecting portion of the electrode pad is provided at a position in one of a continuous and spaced manner in the lengthwise direction of the electrode pad.

Abstract: A light source module for generating light, including a semiconductor light-emitting element, nano-particles having a diameter smaller than half the wavelength of light generated by the light source module, a fluorescent substance for generating visible light in accordance with light generated by the semiconductor light-emitting element, and a binder formed stratiformly for covering a light-emitting surface of the semiconductor light-emitting element to hold the nano-particles and the fluorescent substance, wherein the refractive index of the nano-particles is higher than the refractive index of the binder.

Abstract: A light emitting module for generating a light includes a semiconductor light emitting unit for generating a light, a plurality of nanophosphor particles having diameters which are smaller than a half-wavelength of the light generated from the light emitting module and serving to emit a fluorescent light corresponding to the light generated from the semiconductor light emitting unit, and a binder for holding the nanophosphor particles like a layer covering a light emitting surface of the semiconductor light emitting unit. Furthermore, a lighting unit for a vehicle includes the light emitting module.

Abstract: A vehicular marker lamp including a lamp cover that contains nanosized fluorescent material and light sources that excite the fluorescent material so as to cause the lamp cover to emit colored light.

Abstract: A light emitting module for generating a light includes a semiconductor light emitting unit for generating a light, a plurality of nanophosphor particles having diameters which are smaller than a half-wavelength of the light generated from the light emitting module and serving to emit a fluorescent light corresponding to the light generated from the semiconductor light emitting unit, and a binder for holding the nanophosphor particles like a layer covering a light emitting surface of the semiconductor light emitting unit. Furthermore, a lighting unit for a vehicle includes the light emitting module.

Abstract: A light emitting apparatus includes a device protective layer including a transparent binder (A) and particles (B), and a light emitting device coated with the device protective layer, characterized in that the transparent binder (A) contains one or more ceramics, and the particles (B) have a smaller particle diameter than the wavelength of the light produced by the light emitting device, and characterized in that the refractive index of the device protective layer is preferably 1.4 or more, the particle diameter of the particles (B) is 100 nm or less, and the device protective layer contains a phosphor therein. The light emitting apparatus can form a vehicle lamp high in luminous efficiency.

Abstract: The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state. (1) The coefficient of linear expansion in the film transverse direction (TD) at 50–200° C. is 17–30 ppm/° C. (2) The tensile modulus of elasticity is 6–12 GPa By means of this construction the present invention can provide, on an industrial basis, an adhesive-backed tape suitable for producing semiconductor devices, together with copper-clad laminates, semiconductor connecting substrates and semiconductor devices employing said tape, and it enables, the reliability of semiconductor devices for high density mounting to be enhanced.

Abstract: A light source module for generating light, including a semiconductor light-emitting element, nano-particles having a diameter smaller than half the wavelength of light generated by the light source module, a fluorescent substance for generating visible light in accordance with light generated by the semiconductor light-emitting element, and a binder formed stratiformly for covering a light-emitting surface of the semiconductor light-emitting element to hold the nano-particles and the fluorescent substance, wherein the refractive index of the nano-particles is higher than the refractive index of the binder.

Abstract: Resin composition for sealing semiconductor devices, which contains a filler (A) of spherical fused silica having maximum particle size of not larger than 45 &mgr;m and may contain metal impurities having a particle size of not larger than 53 &mgr;m; and a semiconductor device sealed with the resin composition.

Abstract: The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state.

Abstract: Disclosed are a resin composition for sealing semiconductor devices, which contains a filler (A) of spherical fused silica having a maximum particle size of not larger than 45 &mgr;m and may contain metal impurities having a particle size of not larger than 53 &mgr;m; and a semiconductor device sealed with the resin composition.

Abstract: A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little.