Abstract: An electron source/image display device manufacturing apparatus according to this invention includes (A) a support which supports a substrate having a first major surface and a second major surface on which a conductor is arranged, and includes a plurality of electrostatic chucks each having a conductive member, (B) a vessel which has a gas inlet port and an exhaust port, and covers part of the first major surface, (C) a valve connected to the inlet port to introduce gas into the vessel, (D) an exhaust system connected to the exhaust port to exhaust the gas from the vessel, and (E) a power supply for applying a predetermined potential difference between the conductor and the conductive member. This apparatus arrangement enables easy, stable processing in the “forming” and “activation” steps.

Abstract: A method and an apparatus of manufacturing an image displaying apparatus having an electron source substrate and a phosphor substrate. The electron source substrate is provided with an electron emitting element formed by covering with a container and by applying a voltage to an electronic conductor on the substrate. While, the phosphor substrate is provided with a phosphor thereon. The substrates are subjected to a getter processing and to a seal bonding process under a vacuum condition through a processing chamber, to complete an image forming apparatus. An improvement resides in miniaturizing and simplifying operation, and in greater manufacture speed and mass production.

Abstract: This invention provides an electron source manufacturing apparatus which can be easily downsized and operated. The electron source manufacturing apparatus includes a support member for supporting a substrate (10) having a conductor (11), a vessel (12) which has a gas inlet port (15) and a gas exhaust port (16) and covers a partial region of the surface of the substrate (10); a gas inlet unit (24) connected to the gas inlet port (15) to introduce gas into the vessel, an exhaust unit (26) connected to the gas exhaust port to evacuate the interior of the vessel, and a voltage application unit (32) for applying a voltage to the conductor.

Abstract: This invention provides an electron source manufacturing apparatus which can be easily downsized and operated. The electron source manufacturing apparatus includes a support member for supporting a substrate (10) having a conductor (11), a vessel (12) which has a gas inlet port (15) and a gas exhaust port (16) and covers a partial region of the surface of the substrate (10); a gas inlet unit (24) connected to the gas inlet port (15) to introduce gas into the vessel, an exhaust unit (26) connected to the gas exhaust port to evacuate the interior of the vessel, and a voltage application unit (32) for applying a voltage to the conductor.

Abstract: An image-forming apparatus comprises a rear plate including electron-emitting devices formed thereon, a face plate including a fluorescent film formed thereon and being disposed to face the rear plate, a spacer in the form of a flat plate disposed between the rear plate and the face plate, and an outer frame surrounding peripheral edges of the rear plate and the face plate. Electrons emitted from the electron-emitting devices are irradiated to the fluorescent film to thereby display an image under condition where an inner space of a container constructed by the rear plate, the face plate and the outer frame is evacuated through a vent tube into a depressurized state. The vent tube is attached to a side of the outer frame that is positioned across an imaginary extension of the flat-plate spacer in the longitudinal direction thereof, or to the face plate or the rear plate in the vicinity of that side of the outer frame.

Abstract: A method and an apparatus of manufacturing an image displaying apparatus comprising an electron source substrate and a phosphor substrate. The electron source substrate is provided with an electron emitting element formed by covering with a container and by applying a voltage to an electronic conductor on the substrate. While, the phosphor substrate is provided with a phosphor thereon. The substrates are subjected to a getter processing and to a seal bonding process under a vacuum condition through a processing chamber, to complete an image forming apparatus. An improvement resides in miniaturizing and simplifying operation, and in greater manufacture speed and mass production.

Abstract: An electron source/image display device manufacturing apparatus according to this invention includes (A) a support which supports a substrate having a first major surface and a second major surface on which a conductor is arranged, and includes a plurality of electrostatic chucks each having a conductive member, (B) a vessel which has a gas inlet port and an exhaust port, and covers part of the first major surface, (C) a valve connected to the inlet port to introduce gas into the vessel, (D) an exhaust system connected to the exhaust port to exhaust the gas from the vessel, and (E) a power supply for applying a predetermined potential difference between the conductor and the conductive member. This apparatus arrangement enables easy, stable processing in the “forming” and “activation” steps.

Abstract: This invention provides an electron source manufacturing apparatus which can be easily downsized and operated. The electron source manufacturing apparatus includes a support member for supporting a substrate (10) having a conductor (11), a vessel (12) which has a gas inlet port (15) and a gas exhaust port (16) and covers a partial region of the surface of the substrate (10); a gas inlet unit (24) connected to the gas inlet port (15) to introduce gas into the vessel, an exhaust unit (26) connected to the gas exhaust port to evacuate the interior of the vessel, and a voltage application unit (32) for applying a voltage to the conductor.

Abstract: A process for preparing a semiconductor device includes a step of surface-modifying a desired portion of the surface of a substrate carried out in an atmosphere containing oxygen or nitrogen atoms. The process also includes a step of depositing selectively a metal on an electron-donative surface provided corresponding to the desired portion.

Abstract: An image-forming apparatus comprises an electron source and an image-forming member disposed in an envelope. The image-forming member includes a fluorescent film and a metal back covering the fluorescent film. The metal back contains a gettering substance and the gettering substance is irradiated with electron beams emitted from the electron source.

Abstract: The present invention relates to a gas collecting system collecting an inspection objective gas, such as a toxic gas discharged into an ambient air, and particularly to a gas collecting system which can achieve down-sizing of the system and permit implementation of analysis of gas concentration of the inspection objective gas at high precision with simple operation.

Abstract: The concentration of formaldehyde in air is measured by the method of the invention. More specifically, the invention relates to a method for analyzing formaldehyde in air by collecting the air and implementing an analysis of the concentration of formaldehyde at the site where such air is found.

Abstract: A processing method for etching a substrate is described. This method includes subjecting a surface of a substrate to be processed to selective irradiation with a light in a gas atmosphere to form a surface-modified layer. The substrate surface with the surface-modified layer is then annealed to stabilize and make the surface-modified layer more etch resistant. Both the stabilized surface-modified layer and a non-modified portion of the substrate are then subjected to dry etching, thereby utilizing the higher resistance to dry etching of the stabilized surface-modified layer compared to the non-modified portion to selectively etch the non-modified portion to a desired depth.

Abstract: A processing method comprises:a first step of depositing on a substrate which is a specimen a film of any one of a semiconductor, a metal and an insulator;a second step of subjecting the surface of the film deposited in the first step, to irradiation with a beam having a given energy to produce a physical damage on the surface;a third step of subjecting the film surface on which the physical damage is produced in the second step, to selective irradiation with light to partially cause a photochemical reaction so that a mask pattern depending on the desired device structure is formed on the film surface; anda fourth step of carrying out photoetching using as a shielding member the mask pattern formed in the third step.

Abstract: A processing method comprises:a first step of depositing on a substrate which is a specimen a film of any one of a semiconductor, a metal and an insulator;a second step of subjecting the surface of the film deposited in the first step, to irradiation with a beam having a given energy to produce a physical damage on the surface;a third step of subjecting the film surface on which the physical damage is produced in the second step, to selective irradiation with light to partially cause a photochemical reaction so that a mask pattern depending on the desired device structure is formed on the film surface; anda fourth step of carrying out photoetching using as a shielding member the mask pattern formed in the third step.

Abstract: An image-forming apparatus has a rear plate including electron-emitting devices formed thereon, a face plate including a fluorescent film formed thereon and being disposed to face the rear plate, flat plate spacers disposed between the rear plate and the face plate, and an outer frame surrounding peripheral edges of the rear plate and the face plate. Electrons emitted from the electron-emitting devices are irradiated to the fluorescent film to thereby display an image under condition where an inner space of a container constructed by the rear plate, the face plate and the outer frame is evacuated through a vent tube into a depressurized state. The vent tube is attached to a side of the outer frame that is positioned across an imaginary extension of the flat-plate spacer in the longitudinal direction thereof, or to the face plate or the rear plate in the vicinity of that side of the outer frame.

Abstract: An image-forming apparatus includes an electron source and an image-forming member disposed in an envelope. The image-forming member includes a fluorescent film and a metal back covering the fluorescent film. The metal back contains a gettering substance and the gettering substance is irradiated with electron beams emitted from the electron source.

Abstract: An image display apparatus includes a display panel formed by arranging in juxtaposition a face plate carrying thereon a phosphor and a rear plate carrying thereon electron-emitting devices within a housing. The phosphor is so arranged as to be irradiated with electrons emitted from the electron-emitting devices to display images. The image display apparatus further includes an air blower for causing air to flow between the display panel and the housing.

Abstract: A processing method is described which has a first step of depositing on a substrate a specimen film which may be any one of a semiconductor, a metal and a insulator.In a second step, the surface of the specimen film deposited in the first step, is irradiated with an ion beam to produce a physical damage on the surface, next, in a third step, the damaged specimen film surface is selectively irradiated with the light to partially cause a photochemical reaction so that a mask pattern, which depends on the desired device structure, is formed on the film surface. Finally, in a fourth step, photoetching is performed using the mask pattern formed in the third step as a shielding member.

Abstract: A processing method comprises:a first step of depositing on a substrate which is a specimen a film of any one of a semiconductor, a metal and an insulator;a second step of subjecting the surface of the film deposited in the first step, to irradiation with a beam having a given energy to produce a physical damage on the surface;a third step of subjecting the film surface on which the physical damage is produced in the second step, to selective irradiation with light to partially cause a photochemical reaction so that a mask pattern depending on the desired device structure is formed on the film surface; anda fourth step of carrying out photoetching using as a shielding member the mask pattern formed in the third step.