Abstract: In the method for forming a protective coat on an electrode for a touch panel according to the invention, a photosensitive layer comprising a photosensitive resin composition containing a binder polymer having a carboxyl group and an acid value of 30 to 120 mgKOH/g, a photopolymerizable compound having at least three ethylenic unsaturated groups, and a photopolymerization initiator, is formed on a base material having an electrode for a touch panel, prescribed sections of the photosensitive layer are cured by irradiation with active light rays and then the sections other than the prescribed sections are removed, to form a protective coat comprising the cured sections of the photosensitive resin composition covering all or a portion of the electrode.

Abstract: In the method for forming a protective coat on an electrode for a touch panel according to the invention, a photosensitive layer comprising a photosensitive resin composition containing a binder polymer having a carboxyl group and an acid value of 30 to 120 mgKOH/g, a photopolymerizable compound having at least three ethylenic unsaturated groups, and a photopolymerization initiator, is formed on a base material having an electrode for a touch panel, prescribed sections of the photosensitive layer are cured by irradiation with active light rays and then the sections other than the prescribed sections are removed, to form a protective coat comprising the cured sections of the photosensitive resin composition covering all or a portion of the electrode.

Abstract: The conductive pattern formation method according to the present invention comprises a step of providing a photosensitive conductive film including a conductive layer containing conductive fibers, a photosensitive resin layer containing a photosensitive resin and an inorganic filler, and a support film in this order, and laminating the conductive layer and the photosensitive resin layer on a base material such that the conductive layer side is closely bonded to the base material, and a step of exposing and developing the photosensitive resin layer and the conductive layer on the base material to form a conductive pattern.

Abstract: The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 ?m or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator.

Abstract: A laminate which includes a substrate 230, conductive fibers 221 and a resin layer, wherein, in said laminate, a ratio of increase in resistance after irradiation with light emitted from a xenon lamp at an intensity of 60 W/m2 (integrated value of spectral irradiance at a wavelength of 300 nm to 400 nm) for 300 hours is 20% or less.

Abstract: A photosensitive resin composition comprises a component (A): a resin having a phenolic hydroxyl group; a component (B): an aliphatic compound having two or more functional groups, the functional groups being one or more group selected from an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group and a hydroxyl group; a component (C): a photosensitive acid generator; and a component (D): an inorganic filler having an average particle diameter of 100 nm or less.

Abstract: The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 ?m or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator.

Abstract: Provided is a photosensitive resin composition comprising (A) a resin having a phenolic hydroxyl group; (B) an aliphatic or alicyclic epoxy compound having two or more oxirane rings; (C) a photosensitive acid generator; and (D) a solvent; wherein the photosensitive resin composition comprises 20 to 70 parts by mass of the component (B) relative to 100 parts by mass of the component (A).

Abstract: In the method for forming a protective coat on an electrode for a touch panel according to the invention, a photosensitive layer comprising a photosensitive resin composition containing a binder polymer having a carboxyl group and an acid value of 30 to 120 mgKOH/g, a photopolymerizable compound having at least three ethylenic unsaturated groups, and a photopolymerization initiator, is formed on a base material having an electrode for a touch panel, prescribed sections of the photosensitive layer are cured by irradiation with active light rays and then the sections other than the prescribed sections are removed, to form a protective coat comprising the cured sections of the photosensitive resin composition covering all or a portion of the electrode.

Abstract: The method for forming a resin cured film pattern according to the invention comprises a first step in which there is formed on a base material a photosensitive layer composed of a photosensitive resin composition comprising a binder polymer with a carboxyl group having an acid value of 75 mgKOH/g or greater, a photopolymerizable compound and a photopolymerization initiator, and having a thickness of 10 ?m or smaller, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections of the photosensitive layer other than the prescribed sections are removed to form a cured film pattern of the prescribed sections of the photosensitive layer, wherein the photosensitive resin composition comprises an oxime ester compound and/or a phosphine oxide compound as the photopolymerization initiator.

Abstract: The method for forming a protective coat on an electrode for a touch panel according to the invention comprises a first step in which a photosensitive layer comprising a photosensitive resin composition containing a binder polymer, a photopolymerizable compound and a photopolymerization initiator is provided on a base material having an electrode for a touch panel, a second step in which prescribed sections of the photosensitive layer are cured by irradiation with active light rays, and a third step in which the sections other than the prescribed sections of the photosensitive layer are removed to form a protective coat comprising the cured sections of the photosensitive layer covering all or a portion of the electrode, wherein the hydroxyl value of the photosensitive resin composition is no greater than 40 mgKOH/g.

Abstract: The present invention discloses a photosensitive resin composition which comprises (A) a compound having a molecule with at least one thiirane ring and a total number of a thiirane ring and/or an epoxy ring of at least 2 in the molecule, and (B) a photo acid generator, said composition having a refractive index of at least 1.6, and a method of obtaining a high refractive index periodical structure which comprises subjecting the photosensitive resin composition to photolithography.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: Provided is a positive photosensitive resin composition which is advantageous not only in excellent sensitivity, resolution and adhesion, but also in excellent heat resistance even when the composition is cured by a low-temperature process at equal to or lower than 280° C., as well as low water absorption and capability to give a pattern with favorable configuration. The positive photosensitive resin composition contains: (a) alkaline aqueous solution-soluble polyamide having a polyoxazole precursor structure; (b) an o-quinonediazide compound; and (c) a latent acid generator which generates acid upon heating. The composition optionally further contains (d) a compound having a phenolic hydroxyl group or (e) a solvent.

Abstract: The present invention discloses a photosensitive resin composition which comprises (A) a compound having a molecule with at least one thiirane ring and a total number of a thiirane ring and/or an epoxy ring of at least 2 in the molecule, and (B) a photo acid generator, said composition having a refractive index of at least 1.6, and a method of obtaining a high refractive index periodical structure which comprises subjecting the photosensitive resin composition to photolithography.

Abstract: The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): - 25 ? E 1 - E 0 E 0 × 100 ? 25 ( 1 ) wherein E0 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm×187 mm and a step size of 3 mm×12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E1 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.

Abstract: The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): - 25 ? E 1 - E 0 E 0 × 100 ? 25 ( 1 ) wherein E0 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm×187 mm and a step size of 3 mm×12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E1 represents an exposure amount in mJ/cm2 at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.

Abstract: The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1): 1 - 25 ≦ E 1 - E 0 E 0 × 100 ≦ 25 ( 1 )