Abstract: To provide a glass substrate with an antireflection film, which employs glass having high refractive index and which has excellent strength, and an optical member comprising it. A glass substrate with an antireflection film, comprising a glass substrate which consists of glass having refractive index (nd) of from 1.68 to 2.00 and which has plate thickness of from 0.01 to 2 mm, and an antireflection film formed on at least one principal plane of the glass substrate.

Abstract: A laminate including a glass plate and a coating layer, wherein the coating layer includes one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride, wherein a ratio (dc/dg) of a thickness dc of the coating layer to a thickness dg of the glass plate is in a range of 0.05×10?3 to 1.2×10?3, and wherein a radius of curvature r1 of the laminate with negating of self-weight deflection is 10 m to 150 m.

Abstract: A laminate including a glass plate and a coating layer, wherein the coating layer includes one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride, wherein a ratio (dc/dg) of a thickness dc of the coating layer to a thickness dg of the glass plate is in a range of 0.05×10?3 to 1.2×10?3, and wherein a radius of curvature r1 of the laminate with negating of self-weight deflection is 10 m to 150 m.

Abstract: A laminate including a glass plate and a coating layer, wherein the coating layer includes one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride, wherein a ratio (dc/dg) of a thickness dc of the coating layer to a thickness dg of the glass plate is in a range of 0.05×10?3 to 1.2×10?3, and wherein a radius of curvature r1 of the laminate with negating of self-weight deflection is 10 m to 150 m.

Abstract: To provide a glass substrate with an antireflection film, which employs glass having high refractive index and which has excellent strength, and an optical member comprising it. A glass substrate with an antireflection film, comprising a glass substrate which consists of glass having refractive index (nd) of from 1.68 to 2.00 and which has plate thickness of from 0.01 to 2 mm, and an antireflection film formed on at least one principal plane of the glass substrate.

Abstract: A laminate including a glass plate and a coating layer, wherein the coating layer includes one or more components selected from the group consisting of silicon nitride, titanium oxide, alumina, niobium oxide, zirconia, indium tin oxide, silicon oxide, magnesium fluoride, and calcium fluoride, wherein a ratio (dc/dg) of a thickness dc of the coating layer to a thickness dg of the glass plate is in a range of 0.05×10?3 to 1.2×10?3, and wherein a radius of curvature r1 of the laminate with negating of self-weight deflection is 10 m to 150 m.

Abstract: To provide an antifouling film-coated substrate, which has a fluorinated organic silicon compound coating film and which is excellent in the antifouling properties as it has water repellency, oil repellency, etc. and also excellent in the abrasion resistance so that deterioration in the antifouling properties is prevented against repeated wiping operations. The antifouling film-coated substrate 3 comprises a transparent substrate 1 having a film-forming surface 1a exposed to at least a moisture-containing atmosphere, and a fluorinated organic silicon compound coating film 2 formed on the film-forming surface 1a of the transparent substrate 1 by a dry-mode method.

Abstract: The present invention relates to a light-shielding film-attached glass substrate including: a glass substrate; and a light-shielding film having a multilayer structure and being formed on the glass substrate, in which the light-shielding film having a multilayer structure includes: a first chromium oxynitride film (CrOx1Ny1); and a second chromium oxynitride film (CrOx2Ny2), each satisfying the following conditions and being laminated in this order from the glass substrate side: 0.15<x1<0.5, 0.1<y1<0.35, 0.4<x1+y1<0.65, 0.03<x2<0.15, and 0.09<y2<0.25.

Abstract: The present invention provides a mask blank which comprises a substrate made of a synthetic quartz glass and a light-shielding film laminated on a surface of the substrate and is for use in a semiconductor device production technique employing an exposure light wavelength of 200 nm or shorter, wherein the mask blank has a birefringence, as measured at a wavelength of 193 nm, of 1 nm or less per substrate thickness. According to the present invention, mask blanks suitable for use in the immersion exposure technique and the polarized illumination technique are provided.

Abstract: The present invention relates to a light-shielding film-attached glass substrate including: a glass substrate; and a light-shielding film having a multilayer structure and being formed on the glass substrate, in which the light-shielding film having a multilayer structure includes: a first chromium oxynitride film (CrOx1Ny1); and a second chromium oxynitride film (CrOx2Ny2), each satisfying the following conditions and being laminated in this order from the glass substrate side: 0.15<x1<0.5, 0.1<y1<0.35, 0.4<x1<0.65, 0.03<x2<0.15, and 0.09<y2<0.25.

Abstract: The present invention provides a mask blank which comprises a substrate made of a synthetic quartz glass and a light-shielding film laminated on a surface of the substrate and is for use in a semiconductor device production technique employing an exposure light wavelength of 200 nm or shorter, wherein the mask blank has a birefringence, as measured at a wavelength of 193 nm, of 1 nm or less per substrate thickness. According to the present invention, mask blanks suitable for use in the immersion exposure technique and the polarized illumination technique are provided.

Abstract: The present invention provides a mask blank which comprises a substrate made of a synthetic quartz glass and a light-shielding film laminated on a surface of the substrate and is for use in a semiconductor device production technique employing an exposure light wavelength of 200 nm or shorter, wherein the mask blank has a birefringence, as measured at a wavelength of 193 nm, of 1 nm or less per substrate thickness. According to the present invention, mask blanks suitable for use in the immersion exposure technique and the polarized illumination technique are provided.

Abstract: A substrate with transparent conductive film which is suitable for laser patterning and can be produced with high productivity, is provided. A substrate with transparent conductive film, which comprises a glass substrate and a transparent conductive film composed mainly of indium oxide, formed thereon, wherein the average domain diameter at the surface of the transparent conductive film is at most 150 nm. Such transparent conductive film is formed by sputtering at a substrate temperature of at most 250° C. during the film deposition.

Abstract: A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy as the major component, formed on the conductive layer, a substrate with wires produced by etching the laminate to remove an unnecessary metal, and a method for producing the same.

Abstract: A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy as the major component, formed on the conductive layer, a substrate with wires produced by etching the laminate to remove an unnecessary metal, and a method for producing the same.

Abstract: To provide a process for producing a transparent electrode comprising a tin oxide film which can readily be patterned, which can be realized at a low cost, and which has low resistivity and is excellent in transparency. A process for producing a transparent electrode having a patterned tin oxide film formed on a substrate, which comprises a step of forming a tin oxide film having light absorption characteristics on a substrate, a patterning step of removing part of the tin oxide film having light absorption characteristics, and a step of subjecting the patterned tin oxide film having light absorption characteristics to heat treatment to obtain a tin oxide film.

Abstract: A laminate for forming a substrate with wires, comprising a conductive layer containing Al or an Al alloy as the major component, formed on a substrate and a capping layer containing a Ni—Mo alloy as the major component, formed on the conductive layer, a substrate with wires produced by etching the laminate to remove an unnecessary metal, and a method for producing the same.

Abstract: It is to provide a black matrix with which the etching rate during patterning can be controlled to be the same level as that of a metal chromium film, and which has adequate acid resistance, alkali resistance, heat resistance and water resistance in a color filter production process. At least one light shielding layer and a low-reflecting film as the case requires are formed on a transparent substrate, and the composition of the light shielding layer is substantially as follows: Ni 40 to 80 mass % Mo 10 to 59 mass % Ta + Nb 0.5 to 8 mass % Fe + Al 0.5 to 10 mass % Zr 0 to 7 mass %.

Abstract: It is to provide a black matrix with which the etching rate during patterning can be controlled to be the same level as that of a metal chromium film, and which has adequate acid resistance, alkali resistance, heat resistance and water resistance in a color filter production process.

Abstract: Transparent conductive films are provided which provide high sheet resistance, high transparency, high heat resistance and high moisture resistance, wherein the transparent conductive films contain either (a) an oxide film made of a mixed oxide of indium and tin and doped with at least 0.01 and less than 0.6 weight % of nitrogen and a geometrical thickness of from 5 to 25 nm or (b) an oxide film made of a mixed oxide of indium and tin, wherein the oxide film contains tin within a range of from 4.2 to 8.3 atomic % based on indium and a geometrical thickness of from 5 to 20 nm, and where in each case (a) and (b) the oxide film has a light transmittance of more than 90% at a wavelength of 550 nm, transparent conductive film-coated substrates prepared therefrom and touch panels prepared from the transparent conductive film-coated substrates.