Abstract: An inductor element has a support layer, a first conductive layer formed on the support layer and having a first inductor pattern and a first pad at one end of the first inductor pattern, a first insulation layer formed on the support layer and first conductive layer and including a magnetic material layer and a resin layer, a second conductive layer formed on the first insulation layer and having a second inductor pattern and a second pad at one end of the second inductor pattern, and a via conductor formed through the first insulation layer and connecting the first and second conductive layers. The magnetic material layer is covering at least part of the first inductor pattern, the resin layer is covering the first pad and has opening exposing at least part of the first pad, and the via conductor is formed in the opening of the first insulation layer.

Abstract: A printed wiring board includes a first buildup layer including first and second interlayer insulating layers, and a second buildup layer formed on the first buildup layer and including the outermost interlayer insulating layer and the outermost conductive layer formed on the outermost interlayer resin insulating layer. The buildup layer includes a first signal line interposed between the first and second interlayer insulating layers, a first ground layer formed on a surface of the first interlayer resin insulating layer, and a second ground layer formed on a surface of the second interlayer resin insulating layer such that the first signal line is interposed between the first and second ground layers, the first and second interlayer insulating layers and the outermost interlayer insulating layer include resin materials, respectively, and the first and second interlayer insulating layers are different from the outermost interlayer insulating layer in material and/or thickness.

Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.

Abstract: An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure.

Abstract: A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

Abstract: An antenna device has a substrate having a first surface and a second surface on the opposite side of the first surface, a first-surface-side conductive layer formed on the first surface of the substrate, a second-surface-side conductive layer formed on the second surface of the substrate, and through hole conductors connecting the first-surface-side conductive layer and the second-surface-side conductive layer. The first-surface-side conductive layer and the second-surface-side conductive layer are formed such that the first-surface-side conductive layer and the second-surface-side conductive layer are connected via the through hole conductors in a crank form from the first surface to second surface of the substrate.

Abstract: A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.

Abstract: A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.

Abstract: A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: This invention provides a small package board integrated with power supply capable of supplying a low level of voltage and high level of current to an IC while achieving a low height of its power supply. It becomes hard to saturate an inductor magnetically when the surface of a copper wire is coated with a magnetic layer, and the inductor can accordingly be provided with a sufficient degree of inductance. A multiplicity of inductors can be provided within a confined space by arranging a multiplicity of inductors in parallel, and by fixing them with resin so as to form an inductor array, thereby making it possible to divide a power supply. The number of power supply lines is increased by dividing the power supply so as to reduce the level of current in an individual power supply line, so that a high level of current can be supplied to an IC chip.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: The capacitance of a capacitor is adjusted by forming openings in one of a pair of electrodes of the capacitor, the openings having different sizes d1, d2, d3, . . . , wherein d1>d2>d3> . . . and being arranged in numbers n1, n2, n3, . . . , respectively; and sequentially filling a necessary number of the openings with an electroconductive material in descending order of the size so as to adjust the capacitance gradually with an increasing degree of precision. The resulting capacitor is mounted to a printed wiring board.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: A printed wiring board includes a capacitor including a dielectric body having a first surface and a second surface, a first electrode provided on the first surface of the dielectric body, and a second electrode provided on the second surface of the dielectric body. The first electrode has an area facing and being smaller than the first surface of the dielectric body, and the second electrode has an area facing and being larger than the second surface of the dielectric body.