Abstract: The capacitance of a capacitor is adjusted by forming openings in one of a pair of electrodes of the capacitor, the openings having different sizes d1, d2, d3, wherein d1>d2>d3> . . . and being arranged in numbers n1, n2, n3, . . . , respectively; and sequentially filling a necessary number of the openings with an electroconductive material in descending order of the size so as to adjust the capacitance gradually with an increasing degree of precision. The resulting capacitor is mounted to a printed wiring board.

Abstract: This invention provides a small package board integrated with power supply capable of supplying a low level of voltage and high level of current to an IC while achieving a low height of its power supply. It becomes hard to saturate an inductor magnetically when the surface of a copper wire is coated with a magnetic layer, and the inductor can accordingly be provided with a sufficient degree of inductance. A multiplicity of inductors can be provided within a confined space by arranging a multiplicity of inductors in parallel, and by fixing them with resin so as to form an inductor array, thereby making it possible to divide a power supply. The number of power supply lines is increased by dividing the power supply so as to reduce the level of current in an individual power supply line, so that a high level of current can be supplied to an IC chip.

Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.

Abstract: Disclosed is a noise shield type multi-layered substrate which is advantageous in terms of shielding leaked magnetic flux and cross-talk by disposing a magnetic material onto at least one of circuit patterns, passive components and active components, thus blocking noise generated from the circuit patterns, passive components and active components. Thus, malfunctions of neighboring circuit patterns and various parts due to leaked magnetic flux are prevented. A method of manufacturing the noise shield type multi-layered substrate is also provided.

Abstract: Disclosed is a noise shield type multi-layered substrate which is advantageous in terms of shielding leaked magnetic flux and cross-talk by disposing a magnetic material onto at least one of circuit patterns, passive components and active components, thus blocking noise generated from the circuit patterns, passive components and active components. Thus, malfunctions of neighboring circuit patterns and various parts due to leaked magnetic flux are prevented. A method of manufacturing the noise shield type multi-layered substrate is also provided.

Abstract: A magnetic oxide obtained by mixing a given amount ranging from 0.20 to 76.0% by weight of at least one member selected from among Ca, Ti, Sn, Si and Mg magnetization control (regulation) materials with hematite, a mixture of hematite and magnetite, or magnetite as a starting material to obtain a mixed powder, adding 0.1 to 4.0% by weight of a liquid or powder substance having a carbon-to-carbon single or double bond to the mixed powder, stirring the mixture to obtain a substantially homogeneous mixture and sintering the obtained mixture in an inert gas at 550.degree. to 1500.degree. C., and a process for producing the same.

Abstract: Hematite powder is mixed with a substance having a carbon-to-carbon single or double bond, and sintered in an inert gas to form magnetite powder. The magnetite powder can be provided with a desired electric resistance while retaining the properties characteristic of the magnetite powder by effecting a heating in an oxygenic atmosphere after the formation of the magnetite powder (or during a cooling subsequent to the sintering in the inert gas).