Abstract: The invention provides a Cu—Ni—Sn—P alloy sheet satisfying the resistance property of stress relaxation in the direction perpendicular to the rolling direction and excellent in the other necessary properties as terminals and connectors.

Abstract: Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al—Mg—Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.

Abstract: A Cu—Fe—P alloy sheet that is provided with the high strength and with the improved resistance of peel off of oxidation film, in order to deal with problems such as package cracks and peeling, is provided. A copper alloy sheet for electric and electronic parts according to the present invention is a copper alloy sheet containing Fe: 0.01 to 0.50 mass % and P: 0.01 to 0.15 mass %, respectively, with the remainder of Cu and inevitable impurities. A centerline average roughness Ra is 0.2 ?m or less and a maximum height Rmax is 1.5 ?m or less, and Kurtosis (degree peakedness) Rku of roughness curve is 5.0 or less, in measurement of the surface roughness of the copper alloy sheet in accordance with JIS B0601.

Abstract: A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width ? of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 ?m or less.

Abstract: A copper alloy with an excellent stress relaxation resistance including Ni: 0.1 through 3.0 mass %, Sn: 0.01 through 3.0 mass %, P: 0.01 through 0.3 mass % and remainder copper and inevitable impurities, and the Ni content in extracted residues separated and left on a filter having filter mesh size of 0.1 ?m by using an extracted residues method accounting for 40 mass % or less of the Ni content in the copper alloy, wherein the extracted residues method requires that 10 g of the copper alloy is immersed in 300 ml of a methanol solution which contains 10 mass % of ammonium acetate, and using the copper alloy as the anode and platinum as the cathode, constant-current electrolysis is performed at the current density of 10 mA/cm2, and the solution in which the copper alloy is thus dissolved is subjected to suction filtration using a membrane filter of polycarbonate whose filter mesh size is 0.

Abstract: The present invention provides a copper alloy tube for heat exchangers which is tolerable to a high operating pressure of new cooling media such as carbon dioxide and HFC-based fluorocarbons, and is excellent in fracture strength, even if the tube is thinned, and a copper alloy tube for a heat exchanger which has a composition having specified amounts of Sn and P, has an average crystal grain size of 30 ?m or less and has a high strength of 250 MPa or more of a tensile strength in the longitudinal direction of the tube improves the fracture strength as a texture in which the orientation distribution density in the Goss orientation is 4% or less.

Abstract: The present invention relates to a copper alloy having high strength, high electrical conductivity, and excellent bendability, the copper alloy containing, in terms of mass %, 0.4 to 4.0% of Ni; 0.05 to 1.0% of Si; and, as an element M, one member selected from 0.005 to 0.5% of P, 0.005 to 1.0% of Cr, and 0.005 to 1.0% of Ti, with the remainder being copper and inevitable impurities, in which an atom number ratio M/Si of elements M and Si contained in a precipitate having a size of 50 to 200 nm in a microstructure of the copper alloy is from 0.01 to 10 on average, the atom number ratio being measured by a field emission transmission electron microscope with a magnification of 30,000 and an energy dispersive analyzer. According to the invention, it is possible to provide a copper alloy having high strength, high electrical conductivity, and excellent bendability.

Abstract: The present invention provides a Cu—Fe—P alloy which has a high strength, high conductivity and superior bending workability. The copper alloy comprises 0.01 to 1.0% Fe, 0.01 to 0.4% P, 0.1 to 1.0% Mg, and the remainder Cu and unavoidable impurities. The size of oxides and precipitates including Mg in the copper alloy is controlled so that the ratio of the amount of Mg measured by a specified measurement method in the extracted residue by a specified extracted residue method to the Mg content in said copper alloy is 60% or less, thus endowing the alloy with a high strength and superior bending workability.

Abstract: An aluminum alloy sheet for bottle cans superior in high-temperature properties and capable of preventing thermal deformation thereof in coating and heat treatment and securing can strength after the heat treatment. The aluminum alloy sheet has the following composition: Mn 0.7-1.5%, Mg 0.8-1.7%, Fe 0.1-0.7%, Si 0.05-0.5%, Cu 0.1-0.6%, with the remainder being Al and inevitable impurities, and has a crystal structure elongated in a rolling direction and with an aspect ratio of crystal grains of 3 or more as determined through an examination from above of a part located at the center in the through-thickness direction. In the sheet, the amount of solute Cu is 0.05-0.3%, which means the amount of Cu in a solution separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol, and the amount of solute Mg is 0.75-1.6%, which means the amount of solute Mg separated from a precipitate exceeding 0.2 m in particle size by the extracted residue method using hot phenol.

Abstract: A Cu—Fe—P copper alloy sheet which has the high strength and the high electrical conductivity compatible with excellent bendability is provided. The Cu—Fe—P copper alloy sheet contains 0.01% to 3.0% of Fe and 0.01% to 0.3% of P on a percent by mass basis wherein the orientation density of the Brass orientation is 20 or less and the sum of the orientation densities of the Brass orientation, the S orientation, and the Copper orientation is 10 or more and 50 or less in the microstructure of the copper alloy sheet.

Abstract: Disclosed is an aluminum alloy sheet resistant to deterioration through natural aging. The aluminum alloy sheet is an Al—Mg—Si aluminum alloy sheet containing 0.35 to 1.0 percent by mass of magnesium; 0.5 to 1.5 percent by mass of silicon; 0.01 to 1.0 percent by mass of manganese; and 0.001 to 1.0 percent by mass of copper, with the remainder being aluminum and inevitable impurities, in which the amount of dissolved silicon is 0.55 to 0.80 percent by mass, the amount of dissolved magnesium is 0.35 to 0.60 percent by mass, and the ratio of the former to the latter is 1.1 to 2. The aluminum alloy sheet may further contain 0.005 to 0.2 percent by mass of titanium with or without 0.0001 to 0.05 percent by mass of boron.

Abstract: Disclosed is a Cu—Fe—P alloy capable of enabling high strength, high electrical conductivity, and excellent softening resistance to coexist. The Cu—Fe—P alloy is suitable for use as a constituent material of a lead frame for a semiconductor device. With the Cu—Fe—P alloy with strength rendered higher by micronizing Fe-containing compounds, when enhancing softening resistance by increasing Sn content so as to exceed 0.5 mass %, at least one element selected from the group consisting of Ni, Mg, Ca, Al, Si, and Cr, in trace amounts, are caused to be additionally contained to thereby check cracking likely to occur at the time of forging and hot rolling in a process of producing the copper alloy, as a result of an increase in the Sn content.

Abstract: A Cu—Ni—Sn—P alloy is provided, which is excellent in stress relaxation property in a direction perpendicular to a rolling direction, and has any of high strength, high conductivity, and excellent bendability. A copper alloy contains 0.1 to 3.0% of Ni, 0.1 to 3.0% of Sn, and 0.01 to 0.3% of P in mass percent respectively, and includes copper and inevitable impurities as the remainder; wherein in a radial distribution function around a Ni atom according to a XAFS analysis method, a first peak position is within a range of 2.16 to 2.35 ?, the position indicating a distance between a Ni atom in Cu and an atom nearest to the Ni atom. Thus, distances to atoms around the Ni atom in Cu are comparatively increased, so that the stress relaxation property in a direction perpendicular to the rolling direction of the copper alloy is improved.

Abstract: A aluminum base alloy containing boron and manufacturing method thereof, said alloy exhibiting good mechanical properties (such as high-temperature strength and creep strength) over a long period of time and also having a neutron absorbing capacity owing to boron present therein in the form of a compound without segregation. The alloy contains 0.5–10 mass % of boron with an isotopic element satisfying a relation of 10B/(10B +11B)?30%. said boron being present in the form of a boron compound which is 300 ?m or below in size. The alloy is obtained by melting at a temperature in excess of 950° C. and cast at a temperature in the range of 800° C. to 950° C., in such a way that the molten metal is kept for 60–180° seconds until it cools from 950° C. to the casting temperature.

Abstract: A copper alloy contains 0.01% to 1.0% of Fe, 0.01% to 0.4% of P, and 0.1% to 1.0% of Mg with the remainder being copper and inevitable impurities and has a volume fraction of dispersoids having a particle diameter exceeding 200 nm of 5% or less, in which dispersoids having a particle diameter of 200 nm or less and containing Mg and P have an average particle diameter of 5 nm or more and 50 nm or less. The copper alloy preferably has an average particle diameter of dispersoids containing Fe and P of 20 nm or less. The copper alloy has improved bendability and stress relaxation property.

Abstract: A aluminum base alloy containing boron and manufacturing method thereof, said alloy exhibiting good mechanical properties (such as high-temperature strength and creep strength) over a long period of time and also having a neutron absorbing capacity owing to boron present therein in the form of a compound without segregation. The alloy contains 0.5-10 mass % of boron with an isotopic element satisfying a relation of 10B/(10B+11B)?30%, said boron being present in the form of a boron compound which is 300 ?m or below in size. The alloy is obtained by melting at a temperature in excess of 950° C. and cast at a temperature in the range of 800° C. to 950° C., in such a way that the molten metal is kept for 60-1800 seconds until it cools from 950° C. to the casting temperature.

Abstract: Disclosed is a copper alloy containing Fe of 0.01 to 0.5% and P of 0.01 to 0.3% in mass with the balance consisting of copper and unavoidable impurities, wherein the mass content ratio of Fe to P, namely Fe/P, is in the range from 0.5 to 6.0 and the volume fraction and the number of dispersoids of 1 to 20 nm in average particle diameter in the microstructure of the copper alloy are 1.0% or more and 300 pieces/?m2 or more, respectively. The Cu—Fe—P alloy can secure a high strength and a high conductivity simultaneously.

Abstract: A softening-resistant copper alloy contains Fe in an Fe content in the range of 0.01 to 4.0% by mass. The copper alloy has a cube orientation density of 50% or below and a mean grain size of 30 ?m or below after being annealed at 500° C. for 1 min. A copper alloy sheet forming method of forming a copper alloy sheet comprises, in successive steps: a hot rolling process for hot-rolling a copper alloy sheet of the copper alloy according to any one of claims 1 to 4, at least two working cycles each of a cold rolling process and an annealing process, and a finish cold rolling process. Reduction ratio for each of the cold rolling processes of the working cycles is in the range of 50 to 80%, and reduction ratio for the finish cold rolling process is in the range of 30 to 85%.