Patents by Inventor Yasuhiro Jinbo

Yasuhiro Jinbo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10271438
    Abstract: A light-emitting device can be folded in such a manner that a flexible light-emitting panel is supported by a plurality of housings which are provided spaced from each other and the light-emitting panel is bent so that surfaces of adjacent housings are in contact with each other. Furthermore, in the light-emitting device, in which part or the whole of the housings have magnetism, the two adjacent housings can be fixed to each other by a magnetic force when the light-emitting device is used in a folded state.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: April 23, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshiharu Hirakata, Yasuhiro Jinbo, Shunpei Yamazaki
  • Patent number: 10243012
    Abstract: A method for manufacturing a display device, which does not easily damage an electrode, is provided. In the first step, a terminal electrode, a wiring, and a functional layer are provided over a first substrate; the terminal electrode, the wiring, and the functional layer are electrically connected to one another; an insulating layer is provided over the terminal electrode; a first layer is provided over the terminal electrode and the insulating layer; an adhesive layer is sandwiched between the first substrate and a second substrate; the second substrate and the adhesive layer include a first opening overlapping with part of the first layer; and the insulating layer includes a second opening inside the first opening in a top view. In the second step, part of the first layer is removed by emitting particles having a high sublimation property to the first layer, so that the terminal electrode is exposed.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: March 26, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Minato Ito, Yasuhiro Jinbo
  • Patent number: 10229940
    Abstract: The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.
    Type: Grant
    Filed: October 12, 2017
    Date of Patent: March 12, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yasuhiro Jinbo, Masafumi Morisue, Hajime Kimura, Shunpei Yamazaki
  • Patent number: 10228807
    Abstract: A functional panel is provided. The functional panel includes a first substrate, a second substrate, a bonding layer, a functional element, a protective layer, and a terminal. The bonding layer is positioned between the first and second substrates. The functional element is surrounded by the first substrate, the second substrate, and the bonding layer. The terminal is electrically connected to the functional element and provided not to overlap with one of the first and second substrates. The protective layer is provided to be in contact with side surfaces of the first and second substrates and an exposed surface of the bonding layer. A surface of the terminal is partly exposed without being covered with the protective layer. The surface of the terminal partly includes a material having a lower ionization tendency than hydrogen.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: March 12, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yasuhiro Jinbo, Kenichi Okazaki
  • Patent number: 10170600
    Abstract: A manufacturing method of a semiconductor device including a step of forming a silicon layer over a formation substrate, a step of forming a resin layer over the silicon layer, a step of forming a transistor over the resin layer, a step of forming a conductive layer over the silicon layer and the resin layer, and a step of separating the formation substrate and the transistor. The resin layer has an opening over the silicon layer. The conductive layer is in contact with the silicon layer through the opening in the resin layer. In the step of separating the formation substrate and the transistor, the silicon layer is irradiated with light, so that silicon contained in the silicon layer reacts with a metal contained in the conductive layer, and a metal silicide layer is formed.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: January 1, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Yasuhiro Jinbo
  • Patent number: 10147780
    Abstract: A novel display device that is highly convenient with low power consumption is provided. The display device includes a display element including a liquid crystal layer, a display element including a light-emitting layer, and a pixel circuit. Electrodes of the display element including the liquid crystal layer and the display element including the light-emitting layer are electrically connected to the pixel circuit. The electrode of the display element including the liquid crystal layer includes a reflective film including an opening. The pixel circuit includes a transistor including a semiconductor film. The number of insulating films in a region overlapping with the opening is smaller than that of insulating films overlapping with the semiconductor film. In addition, the display element including the light-emitting layer includes two light-emitting elements.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: December 4, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Daiki Nakamura, Kohei Yokoyama, Yasuhiro Jinbo, Toshiki Sasaki, Masataka Nakada, Naoto Goto, Takahiro Iguchi
  • Patent number: 10141544
    Abstract: A highly reliable display device or electronic device is provided. The display device includes a first electrode, a second electrode, a light-emitting layer between the first electrode and the second electrode, and a protective film over the second electrode. The protective film includes a first insulating film and a second insulating film over the first insulating film. The first insulating film includes one or more of aluminum oxide, hafnium oxide, and zirconium oxide, and the second insulating film includes one or more of aluminum oxide, hafnium oxide, and zirconium oxide. A composition of the first insulating film is different from a composition of the second insulating film. A water vapor transmission rate of the protective film is lower than 1×10?2 g/(m2·day).
    Type: Grant
    Filed: August 7, 2017
    Date of Patent: November 27, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kazuki Tsuda, Kohei Yokoyama, Yasuhiro Jinbo
  • Patent number: 10065808
    Abstract: An apparatus for supplying a support having a clean surface is provided. Alternatively, an apparatus for manufacturing a stack including a support and a remaining portion of a processed member whose one surface layer is separated is provided. A positioning portion, a slit formation portion, and a peeling portion are included. The positioning portion is provided with a first transfer mechanism of a stacked film including a support and a separator and a table for fixing the stacked film. The slit formation portion is provided with a cutter that can form a slit which does not pass through the separator. The peeling portion is provided with a second transfer mechanism and a peeling mechanism extending the separator and then peeling the separator. In addition, a pretreatment portion activating a support surface is included.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: September 4, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masakatsu Ohno, Kohei Yokoyama, Satoru Idojiri, Hisao Ikeda, Yasuhiro Jinbo, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi
  • Publication number: 20180247990
    Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.
    Type: Application
    Filed: April 30, 2018
    Publication date: August 30, 2018
    Inventors: Yasuhiro JINBO, Kohei YOKOYAMA, Yuki TAMATSUKURI, Naoto GOTO, Masami JINTYOU, Masayoshi DOBASHI, Masataka NAKADA, Akihiro CHIDA, Naoyuki SENDA
  • Publication number: 20180197975
    Abstract: A manufacturing method of a semiconductor device including a step of forming a silicon layer over a formation substrate, a step of forming a resin layer over the silicon layer, a step of forming a transistor over the resin layer, a step of forming a conductive layer over the silicon layer and the resin layer, and a step of separating the formation substrate and the transistor. The resin layer has an opening over the silicon layer. The conductive layer is in contact with the silicon layer through the opening in the resin layer. In the step of separating the formation substrate and the transistor, the silicon layer is irradiated with light, so that silicon contained in the silicon layer reacts with a metal contained in the conductive layer, and a metal silicide layer is formed.
    Type: Application
    Filed: January 2, 2018
    Publication date: July 12, 2018
    Inventor: Yasuhiro JINBO
  • Publication number: 20180172222
    Abstract: An object of this invention is to provide a highly portable light-emitting device or a highly browsable light-emitting device. The light-emitting device includes a joint portion, and a plurality of light-emitting units apart from each other with the joint portion positioned therebetween. The joint portion and the light-emitting units are flexible. The joint portion can be bent to a curvature radius smaller than a curvature radius to which the light-emitting unit can be bent. The light-emitting unit is supplied with a signal through a side not adjacent to the joint portion or is supplied with a signal by wireless communication.
    Type: Application
    Filed: February 7, 2018
    Publication date: June 21, 2018
    Inventors: Tomoya AOYAMA, Yasuhiro JINBO, Yoshiharu HIRAKATA, Shunpei YAMAZAKI
  • Patent number: 9997576
    Abstract: To provide a display device with a manufacturing yield and/or a display device with suppressed mixture of colors between adjacent pixels. The display device includes a first pixel electrode, a second pixel electrode, a first insulating layer, a second insulating layer, and an adhesive layer. The first insulating layer includes a first opening. The second insulating layer includes a second opening. The first opening and the second opening are provided between the first pixel electrode and the second pixel electrode. In a top view, a periphery of the second opening is positioned on an inner side than a periphery of the first opening. The adhesive layer has a region overlapping with the second insulating layer below the second insulating layer.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: June 12, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yasuhiro Jinbo, Kohei Yokoyama, Yuki Tamatsukuri, Naoto Goto, Masami Jintyou, Masayoshi Dobashi, Masataka Nakada, Akihiro Chida, Naoyuki Senda
  • Publication number: 20180145277
    Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.
    Type: Application
    Filed: January 4, 2018
    Publication date: May 24, 2018
    Inventors: Shunpei YAMAZAKI, Yasuhiro JINBO, Shingo EGUCHI
  • Patent number: 9966560
    Abstract: A highly reliable light-emitting module or light-emitting device is provided. A method for manufacturing a highly reliable light-emitting module is provided. The light-emitting module includes, between a first substrate and a second substrate, a first electrode provided over the first substrate, a second electrode provided over the first electrode with a layer containing a light-emitting organic compound interposed therebetween, and a sacrifice layer formed using a liquid material provided over the second electrode.
    Type: Grant
    Filed: April 17, 2015
    Date of Patent: May 8, 2018
    Assignee: Semiconductor Energy Laboratory Co., LTD.
    Inventors: Shunpei Yamazaki, Satoshi Seo, Hideto Ohnuma, Hajime Kimura, Yasuhiro Jinbo
  • Patent number: 9952626
    Abstract: A highly portable semiconductor device and the like providing improved browsability of display. Provided is a semiconductor device including a flexible display panel, a first housing supporting a first region of the display panel, a second housing supporting a second region of the display panel, and a flexible base material firmly attached to the first housing. The display panel can be deformed into an open position where the first and second regions are substantially on the same plane or into a folded position where the first and second regions overlap with each other. The second housing includes a groove portion where the flexible base material can partly slide. Part of the flexible base material is inserted into the groove portion in the open position. The part of the flexible base material which is inserted into the groove portion is at least partly withdrawn in a deformation into the folded position.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: April 24, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventor: Yasuhiro Jinbo
  • Publication number: 20180102271
    Abstract: The present invention provides a manufacturing technique of a semiconductor device and a display device using a peeling process, in which a transfer process can be conducted with a good state in which a shape and property of an element before peeling are kept. Further, the present invention provides a manufacturing technique of more highly reliable semiconductor devices and display devices with high yield without complicating the apparatus and the process for manufacturing. According to the present invention, an organic compound layer including a photocatalyst substance is formed over a first substrate having a light-transmitting property, an element layer is formed over the organic compound layer including a photocatalyst substance, the organic compound layer including a photocatalyst substance is irradiated with light which has passed through the first substrate, and the element layer is peeled from the first substrate.
    Type: Application
    Filed: October 12, 2017
    Publication date: April 12, 2018
    Inventors: Yasuhiro JINBO, Masafumi MORISUE, Hajime KIMURA, Shunpei YAMAZAKI
  • Patent number: 9925749
    Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: March 27, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masakatsu Ohno, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo, Hisao Ikeda, Kohei Yokoyama, Hiroki Adachi, Satoru Idojiri
  • Publication number: 20180072033
    Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
    Type: Application
    Filed: November 6, 2017
    Publication date: March 15, 2018
    Inventors: Masakatsu OHNO, Yoshiharu HIRAKATA, Shingo EGUCHI, Yasuhiro JINBO, Hisao IKEDA, Kohei YOKOYAMA, Hiroki ADACHI, Satoru IDOJIRI
  • Publication number: 20180069064
    Abstract: A method for manufacturing a display device, which does not easily damage an electrode, is provided. In the first step, a terminal electrode, a wiring, and a functional layer are provided over a first substrate; the terminal electrode, the wiring, and the functional layer are electrically connected to one another; an insulating layer is provided over the terminal electrode; a first layer is provided over the terminal electrode and the insulating layer; an adhesive layer is sandwiched between the first substrate and a second substrate; the second substrate and the adhesive layer include a first opening overlapping with part of the first layer; and the insulating layer includes a second opening inside the first opening in a top view. In the second step, part of the first layer is removed by emitting particles having a high sublimation property to the first layer, so that the terminal electrode is exposed.
    Type: Application
    Filed: October 31, 2017
    Publication date: March 8, 2018
    Inventors: Minato ITO, Yasuhiro JINBO
  • Patent number: 9909725
    Abstract: An object of this invention is to provide a highly portable light-emitting device or a highly browsable light-emitting device. The light-emitting device includes a joint portion, and a plurality of light-emitting units apart from each other with the joint portion positioned therebetween. The joint portion and the light-emitting units are flexible. The joint portion can be bent to a curvature radius smaller than a curvature radius to which the light-emitting unit can be bent. The light-emitting unit is supplied with a signal through a side not adjacent to the joint portion or is supplied with a signal by wireless communication.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: March 6, 2018
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Tomoya Aoyama, Yasuhiro Jinbo, Yoshiharu Hirakata, Shunpei Yamazaki