Abstract: Described is a technique capable of optimizing a timing of a maintenance process.

Abstract: There is provided a technique that includes a process chamber configured to be capable of processing a substrate; a main controller configured to be capable of controlling the processing of the substrate; a storage configured to be capable of storing start-up condition execution status information used to determine whether or not a start-up condition is executed when the main controller is started, start-up condition management information for managing the start-up condition, and a state of the start-up condition management information; and a start-up condition controller configured to be capable of validating the start-up condition execution status information when the start-up condition management information satisfies a predetermined condition.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber wherein a maintenance timing at which the process chamber enters into a maintenance enable state is determined by the maintenance reservation information; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, stopping one or more substrates including the substrate from being transferred into the process chamber, and thereafter setting the process chamber to the maintenance enable state.

Abstract: There is provided a technique that includes at least one substrate processing apparatuses configured to process a substrate and comprising a first controller that is capable of controlling transmission of at least one type of data; a second controller that is capable of controlling operation of the at least one substrate processing apparatus; and a relay capable of receiving the data from at least one first controller and adjusting, when transmitting the data to the second controller, a reception interval from the first controller and a transmission interval to the second controller to be different from each other.

Abstract: There is provided a technique that includes a plurality of substrate processing apparatuses each configured to process a substrate; a first controller installed in each substrate processing apparatus among the plurality of substrate processing apparatuses and configured to control the substrate processing apparatus; a relay configured to receive a plurality of types of data from the first controller; and a second controller configured to receive the data from the relay, wherein the relay is configured to change a transmission interval of the data to the second controller according to one of each type of the data and each first controller, or according to both of each type of the data and each first controller.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber wherein a maintenance timing at which the process chamber enters into a maintenance enable state is determined by the maintenance reservation information; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, stopping one or more substrates including the substrate from being transferred into the process chamber, and thereafter setting the process chamber to the maintenance enable state.

Abstract: Described herein is a technique capable of capable of managing a substrate processing apparatus efficiently. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: process performing parts configured to process a substrate based on a program; a first controller configured to process the program; and a second controller configured to control the process performing parts based on data received from the first controller, wherein the first controller is further configured to determine whether or not a first controller provided in an additional substrate processing apparatus is malfunctioning based on operation data of the first controller provided in the additional substrate processing apparatus, and to perform an alternative control for the first controller provided in the additional substrate processing apparatus when it is determined that the first controller provided in the additional substrate processing apparatus is malfunctioning.

Abstract: Described herein is a technique capable of capable of managing a substrate processing apparatus efficiently. According to one aspect of the technique described herein, there is provided a substrate processing apparatus including: a process chamber where a substrate is processed; a position information acquisition part configured to acquire position information of the process chamber; a memory device configured to store the position information; and an information controller configured to cause the position information acquired by the position information acquisition part to be stored in the memory device and the position information stored in the memory device to be outputted.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

Abstract: There is provided a technique that includes a plurality of substrate processing apparatuses each configured to process a substrate; a first controller installed in each substrate processing apparatus among the plurality of substrate processing apparatuses and configured to control the substrate processing apparatus; a relay configured to receive a plurality of types of data from the first controller; and a second controller configured to receive the data from the relay, wherein the relay is configured to change a transmission interval of the data to the second controller according to one of each type of the data and each first controller, or according to both of each type of the data and each first controller.

Abstract: A processing container including a plasma generation space in which a processing gas is plasma-excited and a substrate processing space communicating with the plasma generation space; a plasma generator including a coil arranged to surround the plasma generation space and provided to be wound around an outer periphery of the processing container, and a high-frequency power source that supplies high-frequency power to the coil; a gas supply section that supplies the processing gas to the plasma generation space; a temperature sensor provided outside the processing container and configured to detect a temperature of the processing container; and a controller configured to perform control to cause the temperature of the processing container detected by the temperature sensor to fall within a range of a target temperature defined by a preset upper limit value and a preset lower limit value, prior to execution of a process recipe for processing a substrate.

Abstract: Described herein is a technique capable of optimizing a timing of a maintenance process. According to one aspect of the technique of the present disclosure, there is provided a method of manufacturing a semiconductor device including: (a) transferring a substrate from a storage container storing one or more substrates including the substrate to a process chamber, and performing a substrate processing; (b) receiving maintenance reservation information of the process chamber; and (c) continuously performing the substrate processing after the maintenance reservation information is received in (b) until the substrate processing in the process chamber related to the maintenance reservation information is completed, and setting the process chamber to a maintenance enable state after the substrate processing is completed by stopping the one or more substrates from being transferred into the process chamber.

Abstract: Described herein is a technique capable of capable of managing a substrate processing apparatus efficiently. According to one aspect of the technique of the present disclosure, there is provided a substrate processing apparatus including: process performing parts configured to process a substrate based on a program; a first controller configured to process the program; and a second controller configured to control the process performing parts based on data received from the first controller, wherein the first controller is further configured to determine whether or not a first controller provided in an additional substrate processing apparatus is malfunctioning based on operation data of the first controller provided in the additional substrate processing apparatus, and to perform an alternative control for the first controller provided in the additional substrate processing apparatus when it is determined that the first controller provided in the additional substrate processing apparatus is malfunctioning.

Abstract: Described herein is a technique capable of capable of managing a substrate processing apparatus efficiently. According to one aspect of the technique described herein, there is provided a substrate processing apparatus including: a process chamber where a substrate is processed; a position information acquisition part configured to acquire position information of the process chamber; a memory device configured to store the position information; and an information controller configured to cause the position information acquired by the position information acquisition part to be stored in the memory device and the position information stored in the memory device to be outputted.

Abstract: A technique is described that provides efficient production management of a substrate processing system that includes a substrate processing apparatus and a mobile terminal. The substrate processing apparatus includes: at least one reactor where a substrate is processed; a transfer chamber adjacent to at least one reactor; a detector that detects a state of at least one reactor, a state of the transfer chamber, and generates monitored apparatus information representing the state of at least one reactor, and the state of the transfer chamber.

Abstract: Provided is a substrate processing apparatus which may update an accumulated film thickness of each dummy substrate when a dummy substrate carrier is reloaded. The substrate processing apparatus includes: a process chamber where a plurality of substrates including a dummy substrate are processed; a substrate receiving unit whereon a dummy substrate carrier accommodating at least the dummy substrate is placed; a memory unit configured to store a film thickness of the dummy substrate in the dummy substrate carrier when the dummy substrate carrier is unloaded from the substrate receiving unit; and a management unit configured to update the film thickness of the dummy substrate in the dummy substrate carrier based on the film thickness stored in the memory unit when the dummy substrate carrier is reloaded onto the substrate receiving unit.

Abstract: A technique capable of facilitating a determination of a state of a process chamber is provided. According to the technique described herein, there is provided a method of manufacturing a semiconductor device, including: (a) acquiring a first process chamber data representing a state of a process chamber without a substrate loaded in the process chamber while controlling a heating unit provided in the process chamber and an atmosphere controller configured to control an atmosphere of the process chamber; (b) acquiring a second process chamber data representing the state of the process chamber with the substrate loaded in the process chamber while controlling the heating unit and the atmosphere controller to process the substrate; and (c) displaying the first process chamber data and the second process chamber data along with a first reference data and a second reference data acquired in advance on a display screen while performing (b).