Abstract: A heat exchanger has a tube and an inner fin. A heat medium exchanging heat with a heat exchange target flows in the tube, and the tube has a flat shape in cross section perpendicular to a flow direction of the heat medium. The inner fin has first fins and second fins. The second fins are formed parallel to the flow direction in at least one of an upstream end portion located on an upstream side of an area, in which the first fins are formed, in the flow direction or a downstream end portion located on a downstream side of the area in the flow direction. Fin pitches between the first fins are all identical with each other. At least one of fin pitches between the second fins is different from other fin pitches between the second fins.

Abstract: Display device, including: substrates, color filters having first and second color filters, drain and gate signal lines (of light blocking material), wherein, an overlapping portion adjacent the first and second color filter overlap, is formed on a region with one of the drain or gate signal lines, a first color filter edge is a first taper and a second color filter edge is a second taper, in the overlapping portion, the first taper is closer to the drain or gate signal line than the second taper in the overlapping portion, the first taper angle is 45° or more and 90° or less corresponding to a surface of the drain or gate signal line, the second taper angle is 45° or more and 90° or less corresponding to a surface of the first taper and, the first taper angle is larger than the second taper angle.

Abstract: A cooler includes a cooling pipe having a cooling surface in contact with a heat-exchanged component, and a refrigerant passage. A pair of outer passages are formed between a pair of opposed inner wall surfaces which are located at both ends of an inner wall surface of the cooling pipe in a perpendicular direction and which constitute the refrigerant passage, and a pair of partition walls that are located at both ends of an inner fin in the perpendicular direction. At least one flow-regulating rib is formed in the refrigerant passage to project into the refrigerant passage at a position inward of the pair of outer passages in the perpendicular direction and at a position outward of an inflow hole and a discharge hole in the perpendicular direction as well as at a position outward of the inner fin in an arrangement direction and at a position inward of the inflow hole and the discharge hole in the arrangement direction.

Abstract: A stacked cooler includes flow pipes that are stacked, each of the flow pipes having a flat shape and including a medium passage in which a heat medium flows, a heat exchange object that is disposed between each adjacent two of the flow pipes and is clamped between their flat planes, a protruding pipe part that is connected to at least one of the flow pipes and protrudes in a stacking direction of the flow pipes, and a load restraining part that restrains a load applied to a connection portion of the at least one of the flow pipes to the protruding pipe part as compared with a load applied to the other portion of the at least one of the flow pipes.

Abstract: Display device, including: substrates, color filters having first and second color filters, drain and gate signal lines (of light blocking material), wherein, an overlapping portion adjacent the first and second color filter overlap, is formed on a region with one of the drain or gate signal lines, a first color filter edge is a first taper and a second color filter edge is a second taper, in the overlapping portion, the first taper is closer to the drain or gate signal line than the second taper in the overlapping portion, the first taper angle is 45° or more and 90° or less corresponding to a surface of the drain or gate signal line, the second taper angle is 45° or more and 90° or less corresponding to a surface of the first taper and, the first taper angle is larger than the second taper angle.

Abstract: A main object of the present invention is to provide a method capable of measuring surface temperatures of a plurality of points of cast slab at a secondary cooling zone of a continuous caster with a good accuracy and at low cost. The method comprises the steps of inserting one end of a plurality of optical fibers 3 respectively to nozzles 1 and tubes 2, and installing each nozzle between support rolls that support the cast slab, while spraying purge air from each nozzle toward a surface of the cast slab, receiving a thermal radiation light from the cast slab at the one end of each optical fiber, gathering other ends of the optical fibers 3, 81 in a bundle to take images including a core image of the other end of each optical fibers by an imaging means 5, and calculating the surface temperature of the cast slab.

Abstract: A main object of the present invention is to provide a method capable of measuring surface temperatures of a plurality of points of cast slab at a secondary cooling zone of a continuous caster with a good accuracy and at low cost. The method comprises the steps of inserting one end of a plurality of optical fibers 3 respectively to nozzles 1 and tubes 2, and installing each nozzle between support rolls that support the cast slab, while spraying purge air from each nozzle toward a surface of the cast slab, receiving a thermal radiation light from the cast slab at the one end of each optical fiber, gathering other ends of the optical fibers 3, 81 in a bundle to take images including a core image of the other end of each optical fibers by an imaging means 5, and calculating the surface temperature of the cast slab.

Abstract: Display device, including: substrates, color filters having first and second color filters, drain and gate signal lines (of light blocking material), wherein, an overlapping portion adjacent the first and second color filter overlap, is formed on a region with one of the drain or gate signal lines, a first color filter edge is a first taper and a second color filter edge is a second taper, in the overlapping portion, the first taper is closer to the drain or gate signal line than the second taper in the overlapping portion, the first taper angle is 45° or more and 90° or less corresponding to a surface of the drain or gate signal line, the second taper angle is 45° or more and 90° or less corresponding to a surface of the first taper and, the first taper angle is larger than the second taper angle.

Abstract: A liquid crystal display device with a higher aperture ratio is provided. According to one embodiment of the present invention, second color filters are formed so as to overlap with first color filters when adjacent color filters having different colors are formed on the TFT substrate side, so that the angle of the first tapers where said first color filters overlap and the angle of the second tapers where said second color filters overlap are set to 45° or more and 90° or less.

Abstract: A heat exchanger has partitioning means for dividing a header tank such that a first space and a second space of a tank main body are arranged in a longitudinal direction of the header tank. An annular outer peripheral seal surface is provided around a tube bonding surface of a core plate of the header tank over an entire perimeter thereof and is provided with a gasket. A partitioning seal surface is provided to the tube bonding surface at a position corresponding to the partitioning means, and is provided with the gasket. The gasket seals between the core plate and the partitioning means. The partitioning seal surface is positioned on a plane identical with a plane of the outer peripheral seal surface. A part of the gasket, which is held by the core plate and the tank main body therebetween, has a uniform thickness.

Abstract: An analog-to-digital conversion device has: an analog-to-digital converter configured to receive an input signal via an input signal node, and convert the input signal to a digital signal; and a control circuit configured to receive the digital signal when the input signal is set to have a fixed value, and change, when a deviation amount of the digital signal with the respect to an expected value is equal to or larger than a threshold value, a value of a capacitor between a power supply potential node and a reference potential node of the analog-to-digital converter and/or values of resistors connected to the power supply potential node and the reference potential node of the analog-to-digital converter.

Abstract: An outer peripheral sealing surface of an inner surface of a core plate of a header tank is configured into a loop and extends along an outer peripheral edge portion of the core plate and clamps a packing in cooperation with an outer peripheral end portion of a tank main body of the header tank. A transition section of the outer peripheral sealing surface connects between a primary section and a secondary section, which are located in two different planes, respectively, and the plane of the secondary section is the same as a plane of a boundary portion sealing surface held between two tube connecting surfaces in the core plate.

Abstract: Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein, in the particle size distribution as determined by sieving the whole epoxy resin composition for encapsulating a semiconductor using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is from 0.5% by mass or more to 60% by mass or less, and the ratio of microfine particles having a size of less than 106 ?m is not more than 5% by mass.

Abstract: An outer peripheral sealing surface of an inner surface of a core plate of a header tank is configured into a loop and extends along an outer peripheral edge portion of the core plate and clamps a packing in cooperation with an outer peripheral end portion of a tank main body of the header tank. A transition section of the outer peripheral sealing surface connects between a primary section and a secondary section, which are located in two different planes, respectively, and the plane of the secondary section is the same as a plane of a boundary portion sealing surface held between two tube connecting surfaces in the core plate.

Abstract: Disclosed is a granular epoxy resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, wherein, in the particle size distribution as determined by sieving the whole epoxy resin composition for encapsulating a semiconductor using JIS standard sieves, the ratio of particles having a size of 2 mm or greater is not more than 3% by mass, the ratio of particles having a size of 1 mm or greater, but less than 2 mm is from 0.5% by mass or more to 60% by mass or less, and the ratio of microfine particles having a size of less than 106 ?m is not more than 5% by mass.

Abstract: A heat exchanger has partitioning means for dividing a header tank such that a first space and a second space of a tank main body are arranged in a longitudinal direction of the header tank. An annular outer peripheral seal surface is provided around a tube bonding surface of a core plate of the header tank over an entire perimeter thereof and is provided with a gasket. A partitioning seal surface is provided to the tube bonding surface at a position corresponding to the partitioning means, and is provided with the gasket. The gasket seals between the core plate and the partitioning means. The partitioning seal surface is positioned on a plane identical with a plane of the outer peripheral seal surface. A part of the gasket, which is held by the core plate and the tank main body therebetween, has a uniform thickness.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

Abstract: A liquid crystal display device with a higher aperture ratio is provided. According to one embodiment of the present invention, second color filters are formed so as to overlap with first color filters when adjacent color filters having different colors are formed on the TFT substrate side, so that the angle of the first tapers where said first color filters overlap and the angle of the second tapers where said second color filters overlap are set to 45° or more and 90° or less.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.

Abstract: An epoxy resin composition for encapsulating semiconductors which comprises as essential components (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a component comprising (e1) a butadiene-acrylonitrile copolymer having carboxyl group and/or (e2) a reaction product of (e1) a butadiene-acrylonitrile copolymer having carboxyl group with an epoxy resin, wherein the content of component (e1) in the entire epoxy resin composition is 0.01 to 1% by weight. The composition exhibits excellent releasing property in molding, continuous molding property and resistance to solder reflow.