Abstract: A laser processing head includes a tubular main body, and a gas supply part disposed in the main body and allowing an assist gas supplied from outside to flow into an internal space of the main body. The gas supply part includes a first gas supply hole extending along a first axis on a plane orthogonal to an axis of a tube of the main body and opening at an inner circumferential surface of the main body, a second gas supply hole forming a predetermined angle relative to the first axis around the axis, extending along a second axis on the plane orthogonal to the axis and opening at the inner circumferential surface, and a flow path forming ring facing the inner circumferential surface with a predetermined interval, and forming a cylindrical space extending along the axis between the flow path forming ring and the inner circumferential surface.

Abstract: A laser processing head includes a tubular main body, and a gas supply part disposed in the main body and allowing an assist gas supplied from outside to flow into an internal space of the main body. The gas supply part includes a first gas supply hole extending along a first axis on a plane orthogonal to an axis of a tube of the main body and opening at an inner circumferential surface of the main body, a second gas supply hole forming a predetermined angle relative to the first axis around the axis extending along a second axis on the plane orthogonal to the axis and opening at the inner circumferential surface, and a flow path forming ring facing the inner circumferential surface with a predetermined interval, and forming a cylindrical space extending along the axis between the flow path forming ring and the inner circumferential surface.

Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Abstract: According to one embodiment, a memory controller includes: a memory I/F that reads a codeword written in a NAND memory as any one of hard-bit information, first soft-bit information, and second soft-bit information; a codeword processor that generates a codeword of an first soft-decision value from the first soft-bit information, and generates a codeword of a second soft-decision value from the second soft-bit information; a first decoder that executes hard-decision decoding on a codeword of a hard-decision value configured from the hard-bit information; a second decoder that executes first soft-decision decoding on the codeword of the first soft-decision value; and a third decoder that executes second soft-decision decoding on the codeword of the second soft-decision value, wherein the first soft-bit information includes information having a first number of bits greater than the number of bits of the hard-bit information, and the second soft-bit information includes information having a second number of bits

Abstract: According to one embodiment, a memory controller includes: a memory I/F that reads a codeword written in a NAND memory as any one of hard-bit information, first soft-bit information, and second soft-bit information; a codeword processor that generates a codeword of an first soft-decision value from the first soft-bit information, and generates a codeword of a second soft-decision value from the second soft-bit information; a first decoder that executes hard-decision decoding on a codeword of a hard-decision value configured from the hard-bit information; a second decoder that executes first soft-decision decoding on the codeword of the first soft-decision value; and a third decoder that executes second soft-decision decoding on the codeword of the second soft-decision value, wherein the first soft-bit information includes information having a first number of bits greater than the number of bits of the hard-bit information, and the second soft-bit information includes information having a second number of bits

Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Abstract: A measuring apparatus measure the amount of a metal catalyst supported on a sample that has a membrane of a metal catalyst layer containing the metal catalyst. The measuring apparatus includes a terahertz-wave emitting part that emits a terahertz wave in the range of 0.01 to 10 THz to the sample, a transmitted-terahertz-wave detection part that detects the electric field intensity of a transmitted terahertz wave that has passed through the sample, a storage that stores correlation information acquired in advance and indicating the correlation between the amount of the metal catalyst supported and the electric field intensity of the transmitted terahertz wave, and an amount-of-catalyst-supported acquisition module that acquires the amount of the metal catalyst supported on the sample, on the basis of the correlation information and the electric field intensity of the transmitted terahertz wave detected by the transmitted-terahertz-wave detection part.

Abstract: A measuring apparatus measure the amount of a metal catalyst supported on a sample that has a membrane of a metal catalyst layer containing the metal catalyst. The measuring apparatus includes a terahertz-wave emitting part that emits a terahertz wave in the range of 0.01 to 10 THz to the sample, a transmitted-terahertz-wave detection part that detects the electric field intensity of a transmitted terahertz wave that has passed through the sample, a storage that stores correlation information acquired in advance and indicating the correlation between the amount of the metal catalyst supported and the electric field intensity of the transmitted terahertz wave, and an amount-of-catalyst-supported acquisition module that acquires the amount of the metal catalyst supported on the sample, on the basis of the correlation information and the electric field intensity of the transmitted terahertz wave detected by the transmitted-terahertz-wave detection part.

Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: The present invention provides a solder bump formation resin composition which ensures resist (e.g., dry film) removability and which exhibits excellent solder bonding performance, even when the working substrate is placed at high temperature during reflowing, baking, or a similar process. The solder bump formation resin composition contains (A) at least one species selected from among an alkali-dissoluble thermoplastic resin having an acid value (mgKOH/g) of 110 or higher, an unsaturated fatty acid polymer having an acid value of 80 or higher, and an unsaturated fatty acid-aliphatic unsaturated compound copolymer having an acid value of 50 or higher; (B) a solvent; and (C) a solder powder, and contains no activating agent.

Abstract: Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

Abstract: A disk drive for encrypting user data. A motor configured to rotate a disk which stores encoded user data and an encryption flag which has not been encoded. An encoder/decoder processor configured to encode the user data that is written into the disk without encoding the encryption flag, and decodes the user data that is read out from the disk without decoding the encryption flag that is read out from the disk. An encryption processor configured to encrypt the user data at the encryption flag, wherein the encryption flag indicates encryption before the encoder/decoder processor starts encoding, and wherein the encryption processor obtains an encryption flag read out from the disk before the encoder/decoder processor completes decoding of the user data read out from the disk, commencing decryption of decoded data where the encryption flag indicates encryption before decoding of the user data is complete.

Abstract: A surface mounting method includes applying an active resin composition to at least part of a surface of a printed wiring substrate; mounting a surface mount device on the substrate; performing reflow soldering; applying an under-filling resin into a space of interest; before and/or after applying the under-filling resin, performing a vacuum treatment and/or heating at a temperature lower than the curing reaction-initiating temperature of any of the applied active resin composition and the under-filling resin; and subsequently, thermally curing the resin composition and the under-filling resin. The active resin composition contains an epoxy resin in an amount of 100 parts by weight, a blocked carboxylic acid compound in an amount of 1-50 parts by weight and/or a carboxylic acid compound in an amount of 1-10 parts by weight, and a curing agent which can initiate curing reaction at 150° C. or higher, in an amount of 1-30 parts by weight.

Abstract: Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.

Abstract: The present invention provides a data storage device comprising a disk storage medium containing user data in a plurality of sectors, a head for writing or reading the user data and error correcting means for correcting an error that occurs in the user data during the reading process. The error correcting means comprises a syndrome generator for generating syndromes on the basis of the user data contained in predetermined sectors, registers for storing the syndromes generated and an exclusive OR circuit for exclusive ORing the values stored in the registers.

Abstract: The present invention provides a data storage device comprising a disk storage medium containing user data in a plurality of sectors, a head for writing or reading the user data and error correcting means for correcting an error that occurs in the user data during the reading process. The error correcting means comprises a syndrome generator for generating syndromes on the basis of the user data contained in predetermined sectors, registers for storing the syndromes generated and an exclusive OR circuit for exclusive ORing the values stored in the registers.

Abstract: A disk drive for encrypting user data. A motor configured to rotate a disk which stores encoded user data and an encryption flag which has not been encoded. An encoder/decoder processor configured to encode the user data that is written into the disk without encoding the encryption flag, and decodes the user data that is read out from the disk without decoding the encryption flag that is read out from the disk. An encryption processor configured to encrypt the user data at the encryption flag, wherein the encryption flag indicates encryption before the encoder/decoder processor starts encoding, and wherein the encryption processor obtains an encryption flag read out from the disk before the encoder/decoder processor completes decoding of the user data read out from the disk, commencing decryption of decoded data where the encryption flag indicates encryption before decoding of the user data is complete.

Abstract: Activated resinous composition contains, on the basis of epoxy resin being solid at a room temperature of 100 parts by weight, carboxylic acid compound of 1 to 10 parts by weight, hardening agent of 1 to 30 parts by weight, a hardening reaction initiation temperature of said hardening agent being 150° C. or higher, and solvent of 10 to 300 parts by weight.