Abstract: Provided is a highly reliable optical filtering device used as a spatial filter for an optical inspection apparatus and configured to prevent a shutter from sticking to a wall surface of a shutter opening. The optical filtering device includes the shutter openable and closeable by voltage control and a substrate having the shutter opening serving as a movable range of the shutter, in which the substrate includes a sticking prevention part configured to prevent the shutter from sticking to the wall surface of the shutter opening when the shutter is opened.

Abstract: A BSS to which a destination wireless communication apparatus of a physical layer frame belongs is identified, and accuracy of preamble detection is improved by changing a reception operation. A wireless communication apparatus includes a reception unit that detects a frame including information for identifying a BSS, and a control unit that switches between a first operation in a case where the frame is a frame which is associated with a BSS to which the wireless communication apparatus belongs and a second operation in a case where the frame is a frame which is not associated with the BSS to which the wireless communication apparatus belongs. Carrier sensing is not performed in the first operation, and the carrier sensing is performed in the second operation.

Abstract: An ultrasonic probe includes a semiconductor chip in which an ultrasonic transducer is formed and an electrode pad electrically connected to an upper electrode or a lower electrode of the ultrasonic transducer is provided and a flexible substrate in which a bump electrically connected to the electrode pad is provided and the bump is disposed in a portion overlapping with a stepped portion of the semiconductor chip. Further, a height of a connection surface of the electrode pad of the semiconductor chip connected to the bump is lower than a height of a lower surface of the lower electrode.

Abstract: According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.

Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

Abstract: Provided is an automatic analyzer provided with a liquid level sensing function in which liquid levels in sample containers having various heights can be precisely detected using ultrasonic waves. This device is provided with: a conveyance rack for conveying a sample container which contains a sample and is loaded thereon; a fixed ultrasonic distance sensor for measuring the liquid level position in the sample container loaded on the conveyance rack; sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; and a sound wave guide control unit for adjusting the length or switching the length of the sound wave guides in accordance with the distance between the ultrasonic distance sensor and the sample container.

Abstract: A method for purifying an organic solvent has a first treatment of bringing an organic solvent to be treated into contact with an H-type cation exchanger, and a second treatment of bringing a treated liquid from the first treatment into contact with an anion exchanger and an H-type strongly acidic cation exchanger. According to the present application, the provided method and an apparatus for purifying an organic solvent remove metal impurities of both metal species of monovalent and polyvalent metals in the organic solvent.

Abstract: A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.

Abstract: An ultrasonic probe includes a semiconductor chip 101 in which a CMUT 102 is formed and an electrode pad 101a electrically connected to an upper electrode or a lower electrode of the CMUT 102 is provided and a flexible substrate 100 in which a bump 100b electrically connected to the electrode pad 101a is provided and the bump 100b is disposed in a portion overlapping with a stepped portion 101e of the semiconductor chip 101. Further, a height of a connection surface 101aa of the electrode pad 101a of the semiconductor chip 101 connected to the bump 100b is lower than a height of a lower surface of the lower electrode.

Abstract: Provided is an automatic analyzer provided with a liquid level sensing function in which liquid levels in sample containers having various heights can be precisely detected using ultrasonic waves. This device is provided with: a conveyance rack for conveying a sample container which contains a sample and is loaded thereon; a fixed ultrasonic distance sensor for measuring the liquid level position in the sample container loaded on the conveyance rack; sound wave guides for suppressing diffusion of sound waves transmitted from the ultrasonic distance sensor, the sound wave guides being disposed between the sample container and the ultrasonic distance sensor; and a sound wave guide control unit for adjusting the length or switching the length of the sound wave guides in accordance with the distance between the ultrasonic distance sensor and the sample container.

Abstract: Provided is a method for producing a chelate resin, wherein a highly pure treatment liquid can be obtained by reducing the amount of metal impurities in a to-be-treated liquid containing metal impurities. The method for producing a chelate resin comprises a purification step for purifying a to-be-purified chelate resin by bringing the chelate resin into contact with at least 5 wt % of a mineral acid solution containing 1 mg/L or less of metal impurities, wherein the total amount of metal impurities eluted when 3 wt % of hydrochloric acid is passed through the purified chelate resin in an amount equal to 25 times the amount of the chelate resin by volume ratio is 5 ?m/mL-R or less.

Abstract: Provided is an ultrasonic probe having ultrasonic elements and a printed-circuit board that establishes connection between the ultrasonic elements and external wiring, achieving strong connection between the ultrasonic elements and the printed-circuit board mechanically and electrically, and thereby improving performance in examination and diagnosis using the ultrasonic probe. The printed-circuit board with pads each having a via-hole to be bonded to electrode pads of a chip equipped with the ultrasonic elements, is provided with a reinforcement, in an area of the base material where the pad having the via-hole is not formed. The reinforcement is formed simultaneously with forming the pads and wiring on the printed-circuit board, having the same thickness as the pads. With the reinforcement, pressure is evenly applied to the printed-circuit board when the electrode pad is press-fitted into the pad having the via-hole, thereby preventing warping and deforming of the board.

Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

Abstract: A battery case enables a battery cell to be placed in a continuously pressured state without increasing the complexity of the battery module manufacturing process. Specifically, the battery case has: a plastic first accommodation unit and second accommodation unit in which a laminated body of a battery cell is accommodated; a UD tape integrally positioned on a first side wall, a second side wall, and a third side wall, which form the first accommodation unit; and a UD tape integrally positioned on the first side wall, which form the second accommodation unit. The UD tapes are configured, in particular, to be positioned straddling the third side walls from the second side walls across the first side wall.

Abstract: A structure that prevents a substrate from being warped is provided on a region or a location other than a membrane that determines the characteristics of a CMUT. In a CMUT in a structure in which a first conductive layer and a second conductive layer are provided sandwiching a cavity on a substrate, for example, as a warpage prevention structure, a warpage prevention layer that prevents the substrate from being warped is provided between the substrate and the first conductive film. When the insulating film disposed between the cavity and the first conductive film and the insulating film disposed between the cavity and the second conductive film are silicon oxide films, the warpage prevention layer includes a silicon nitride film.

Abstract: The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.

Abstract: According to one embodiment, an ultrasonic probe includes: an oscillator; a base on which the oscillator is provided; a base conductive wire portion connected to the oscillator; a bump electrode portion supplying a signal to the oscillator via the base conductive wire portion; a pad portion engaging with the bump electrode portion; and an acoustic lens provided such that a force toward the bump electrode portion is applied to the pad portion.

Abstract: An information processing apparatus including an acquisition unit configured to acquire a plurality of vertices forming a one path included in a glyph path, a calculation unit configured to calculate a winding value relating to the one path, a determination unit configured to determine a shift direction of the one path based on the calculated winding value, and a movement unit configured to move positions of the plurality of vertices based on the determined shift direction.

Abstract: A capacitive micromachined ultrasonic transducer 111A includes: a silicon substrate 101; an insulating film 102 formed over the silicon substrate 101; a lower electrode 103; insulating films 104 and 106; a cavity 105 constituted by a void formed in a portion of the insulating film 106; an upper electrode 107; insulating films 108 and 114; and a protective film 109. In addition, the insulating film 106, upper electrode 107, insulating film 108 and insulating film 114 above the cavity 105 configure a vibration film 110, and the protective film 109 above the vibration film 110 is divided into a plurality of isolated patterns regularly arranged with a gap 115 having a constant spacing formed therebetween.

Abstract: In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.