Patents by Inventor Yasumasa Kasuya
Yasumasa Kasuya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230298981Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: ApplicationFiled: May 26, 2023Publication date: September 21, 2023Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA
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Patent number: 11699641Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: GrantFiled: October 12, 2021Date of Patent: July 11, 2023Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya
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Publication number: 20220310491Abstract: An electronic device includes: an electronic element having an element obverse surface and an element reverse surface spaced apart from each other in a first direction, the element obverse surface being provided with an obverse-surface electrode; a resin member having a resin reverse surface facing in a same direction as the element reverse surface, the resin member covering the electronic element; and an electrically conductive member supporting the electronic element and electrically connected to the electronic element. The electrically conductive member has a first exposed region, a second exposed region and a third exposed region each of which is exposed from the resin reverse surface. The resin member has a first resin side surface and a second resin side surface connected to each other and standing up from the resin reverse surface. As viewed in the first direction, the first exposed region is located at a corner portion where the first resin side surface and the second resin side surface are connected.Type: ApplicationFiled: June 25, 2020Publication date: September 29, 2022Inventors: Toshiro TSUCHIYAMA, Yasumasa KASUYA, Tatsuo YAMAZAKI
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Publication number: 20220028763Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: ApplicationFiled: October 12, 2021Publication date: January 27, 2022Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA
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Patent number: 11177198Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: GrantFiled: November 1, 2019Date of Patent: November 16, 2021Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya
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Patent number: 10832996Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.Type: GrantFiled: April 20, 2020Date of Patent: November 10, 2020Assignee: ROHM CO., LTD.Inventors: Yasumasa Kasuya, Hiroaki Matsubara, Hiroshi Kumano, Toshio Nakajima, Shigeru Hirata, Yuji Ishimatsu
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Patent number: 10790258Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.Type: GrantFiled: December 12, 2018Date of Patent: September 29, 2020Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya, Taro Nishioka
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Publication number: 20200251410Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.Type: ApplicationFiled: April 20, 2020Publication date: August 6, 2020Inventors: Yasumasa KASUYA, Hiroaki MATSUBARA, Hiroshi KUMANO, Toshio NAKAJIMA, Shigeru HIRATA, Yuji ISHIMATSU
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Patent number: 10679928Abstract: A power module includes a first die pad, a first switching element, a second die pad, a second switching element, an integrated circuit element, an encapsulation resin, and a lead frame assembly. The encapsulation resin encapsulates the first switching element, the second switching element, and the integrated circuit element. The lead frame assembly includes an outer lead and an inner lead. The lead frame assembly includes a first lead frame and a second lead frame. The first lead frame includes a first inner lead connected to the first die pad and a first outer lead connected to the first inner lead. The second lead frame includes a second inner lead connected to the second die pad and a second outer lead connected to the second inner lead.Type: GrantFiled: August 1, 2017Date of Patent: June 9, 2020Assignee: ROHM CO., LTD.Inventors: Yasumasa Kasuya, Hiroaki Matsubara, Hiroshi Kumano, Toshio Nakajima, Shigeru Hirata, Yuji Ishimatsu
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Publication number: 20200066619Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: ApplicationFiled: November 1, 2019Publication date: February 27, 2020Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA
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Patent number: 10497644Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: GrantFiled: July 25, 2018Date of Patent: December 3, 2019Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya
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Patent number: 10366948Abstract: A semiconductor device 1 includes a semiconductor chip 2, a plurality of leads 4, disposed in a periphery of the semiconductor chip 2, and a sealing resin 5, sealing the semiconductor chip 2 and the leads 4 such that lower surfaces 18 and outer end surfaces 20 at sides opposite the semiconductor chip 2 of the leads 4 are exposed. Lead plating layers 21 arranged to improve solder wettability are formed on the lower surfaces 18 and the outer end surfaces 20 of the leads 4.Type: GrantFiled: December 29, 2016Date of Patent: July 30, 2019Assignee: ROHM CO., LTD.Inventor: Yasumasa Kasuya
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Publication number: 20190157236Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.Type: ApplicationFiled: December 12, 2018Publication date: May 23, 2019Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA, Taro NISHIOKA
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Patent number: 10192845Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.Type: GrantFiled: February 26, 2018Date of Patent: January 29, 2019Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya, Taro Nishioka
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Patent number: 10163850Abstract: A semiconductor device according to the present invention includes a semiconductor chip, an electrode pad made of a metal material containing aluminum and formed on a top surface of the semiconductor chip, an electrode lead disposed at a periphery of the semiconductor chip, a bonding wire having a linearly-extending main body portion and having a pad bond portion and a lead bond portion formed at respective ends of the main body portion and respectively bonded to the electrode pad and the electrode lead, and a resin package sealing the semiconductor chip, the electrode lead, and the bonding wire, the bonding wire is made of copper, and the entire electrode pad and the entire pad bond portion are integrally covered by a water-impermeable film.Type: GrantFiled: September 18, 2017Date of Patent: December 25, 2018Assignee: ROHM CO., LTD.Inventors: Motoharu Haga, Shingo Yoshida, Yasumasa Kasuya, Toichi Nagahara, Akihiro Kimura, Kenji Fujii
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Publication number: 20180331025Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: ApplicationFiled: July 25, 2018Publication date: November 15, 2018Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA
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Patent number: 10056318Abstract: A semiconductor device includes a semiconductor element circuit, a conductive support and a sealing resin. The conductive support includes a die pad, first terminals spaced in a first direction, second terminals spaced in the first direction and opposite to the first terminals in a second direction perpendicular to the first direction, and a support terminal connected to the die pad. The sealing resin encapsulates portions of the first and second terminals, a portion of the support terminal, the semiconductor element circuit and the die pad. The sealing resin has two first side surfaces spaced apart in the second direction and two second side surfaces spaced apart in the first direction. The first terminals and second terminals are exposed from the first side surfaces, while none of the elements of the conductive support is exposed from the second side surfaces.Type: GrantFiled: October 24, 2017Date of Patent: August 21, 2018Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya
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Publication number: 20180182729Abstract: An electronic device includes an electronic element, a plurality of first sub-electrodes arrayed in a first direction, a plurality of second sub-electrodes arrayed in a second direction that is orthogonal to the first direction, a dummy electrode, and a sealing resin. The sealing resin has a resin back surface from which the plurality of first sub-electrodes, the plurality of second sub-electrodes and the dummy electrode are exposed. The plurality of second sub-electrodes are located further in the first direction than any of the plurality of first sub-electrodes. The plurality of first sub-electrodes are located further in the second direction than any of the plurality of second sub-electrodes. The dummy electrode is located further in the first direction than any of the plurality of first sub-electrodes, and is located further in the second direction than any of the plurality of second sub-electrodes.Type: ApplicationFiled: February 26, 2018Publication date: June 28, 2018Inventors: Hiroaki MATSUBARA, Yasumasa KASUYA, Taro NISHIOKA
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Patent number: 9991213Abstract: A resin-encapsulated semiconductor device having a semiconductor chip which is prevented from being damaged. The resin-encapsulated semiconductor device (100) comprises a semiconductor chip (1) including a silicon substrate, a die pad (10) to which the semiconductor chip (1) is secured through a first solder layer (2), a resin-encapsulating layer (30) encapsulating the semiconductor chip (1), and lead terminals (21) electrically connected to the semiconductor chip (1) and including inner lead portion (21b) covered with the resin-encapsulating layer (30). The lead terminals (21) are made of copper or a copper alloy. The die pad (10) is made of 42 alloy or a cover alloy and has a thickness (about 0.125 mm) less than the thickness (about 0.15 mm) of the lead terminals (21).Type: GrantFiled: October 11, 2016Date of Patent: June 5, 2018Assignee: Rohm Co., Ltd.Inventors: Yasumasa Kasuya, Motoharu Haga, Shoji Yasunaga
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Patent number: D824866Type: GrantFiled: March 16, 2017Date of Patent: August 7, 2018Assignee: ROHM CO., LTD.Inventors: Hiroaki Matsubara, Yasumasa Kasuya, Shigeru Hirata