Abstract: A thermoplastic composite material comprising, a fiber bundle having a polypropylene emulsion impregnated therein and having a plurality of reinforcing fibers lined up in a predetermined direction, and satisfies the following conditions (1) to (4); and a formed body: (1) A void content of the thermoplastic composite material is 3% or less, (2) A fiber volume fraction of the thermoplastic composite material is 40% or more and 70% or less, (3) A bending strength of a laminated body, in which a plurality of layers of the thermoplastic composite material has been laminated so that the reinforcing fibers would be lined up in one direction, when bent in the fiber-axis direction and measured in conformity to JIS K7074, is 250 MPa or more, and a bending elastic modulus of the laminated body is 90 GPa or more, and (4) A variation coefficient of the bending strength, when measured at N=5 or more and calculated in conformity to JIS K7074, is within 7%.

Abstract: A thermoplastic composite material comprising, a fiber bundle having a polypropylene emulsion impregnated therein and having a plurality of reinforcing fibers lined up in a predetermined direction, and satisfies the following conditions (1) to (4); and a formed body: (1) A void content of the thermoplastic composite material is 3% or less, (2) A fiber volume fraction of the thermoplastic composite material is 40% or more and 70% or less, (3) A bending strength of a laminated body, in which a plurality of layers of the thermoplastic composite material has been laminated so that the reinforcing fibers would be lined up in one direction, when bent in the fiber-axis direction and measured in conformity to JIS K7074, is 250 MPa or more, and a bending elastic modulus of the laminated body is 90 GPa or more, and (4) A variation coefficient of the bending strength, when measured at N=5 or more and calculated in conformity to JIS K7074, is within 7%.

Abstract: Provided are a current collector which has an excellent high-rate property and exerts a sufficient safety function when employed in a secondary battery or a capacitor, as well as an electrode, a secondary battery or a capacitor in which said current collector is employed. According to the invention, a current collector is provided which comprises: metal foil; and a conductive layer with a film thickness of 0.1 ?m to 10 ?m formed on a surface of said metal foil. Here, said conductive layer includes a conductive material and a binder material. A melting point of said binder material is 80° C. to 150° C. Further, said binder material shows, in differential scanning calorimetry (DSC) in a range from room temperature to 200° C., one or more endothermic peaks in the heating-up process. In a case where said binder material shows two or more endothermic peaks, each difference between said peaks is 15° C. or more. Moreover, said binder material shows one or more exothermic peaks in the cooling-down process.

Abstract: A current collector having high safety, the current collector being capable of stably maintaining the PTC function even when the temperature further increases after realizing the PTC function when used for the electrode structure of electrical storage devices such as non-aqueous electrolyte batteries, electrical double layer capacitors, and lithium ion capacitors; electrode structures; electrical storage devices; and composition for current collectors, is provided. A current collector 100 including a conductive substrate 103 and a resin layer 105 provided onto at least one side of the conductive substrate 103, is provided. Here, the resin layer 105 is obtained by coating a paste onto the conductive substrate 103, followed by cross-linking. The paste includes polyolefin-based emulsion particles 125, a conductive material 121, and a cross-linker 131.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A current collector with high safety which can realize both of a superior conductivity at normal temperature conditions and a superior shut down function at high temperature conditions, is provided. A current collector, including a conductive substrate; and a resin layer provided on at least one side of the conductive substrate, is provided. Here, the resin layer is formed with a paste containing an aggregate of polyolefin-based emulsion particles; and a conductive material. Further, the aggregate has an average particle diameter of 0.5 to 5 ?m.

Abstract: A current collector which can achieve both of the improvement in battery characteristics by reducing the initial (at ambient temperature) interface resistance and the improvement in safety by the PTC function, when the current collector is used for the electrode structure of electrical storage devices such as non-aqueous electrolyte batteries, electrical double layer capacitors, and lithium ion capacitors; electrode structures; electrical storage devices; and composition for current collectors; are provided. A current collector, including: a conductive substrate 103; and a resin layer 105 provided on at least one side of the conductive substrate 103; is provided. Here, the resin layer is formed by coating a paste including: polyolefin-based emulsion particles 125; and a conductive material 121; onto the conductive substrate 103. The coating weight of the paste is 0.1 to 20 g/m2; and the porosity of the resin layer 105 is 10% (v/v) or less.

Abstract: A current collector which can realize sufficient safety function even when the cell is deformed by external force or when the internal pressure is increased; and an electrode, a secondary battery, and a capacitor using the current collector; are provided. A current collector, including: a metal foil; and a conductive layer formed on a surface of the metal foil; is provided. Here, regarding the current collector, a temperature-resistance curve of the current collector obtained by sandwiching the current collector in between brass electrodes of 1 cm diameter, the measurement of resistance being performed with conditions of 15N of load between the electrodes and temperature being raised from ambient temperature at a rate of 10° C./min satisfies a relation of R(Ta+5)/R(Ta?5)?1, R(Ta+5) being resistance at temperature Ta+5° C. and R(Ta?5) being resistance at temperature Ta?5° C., Ta being a temperature higher than a temperature satisfying a relation of (R(T)/R(T?5))>2.

Abstract: Provided is a current collector which has a PTC layer having room for thermal expansion at elevated temperature while securing sufficient conductivity at normal temperature. According to the invention, a current collector comprising a conductive base material, and a resin layer formed on at least one surface of the conductive base material is provided. The resin layer contains an organic resin and conductive particles. A deposition amount of the resin layer on the conductive base material is 0.5 to 20 g/m2. Rz (ten point average roughness) of the surface of the resin layer is 0.4 to 10 ?m. Sm (average spacing of ruggedness) of the surface of the resin layer is 5 to 200 ?m. An average of resistance of the resin layer measured by the two-terminal method is 0.5 to 50 ?.

Abstract: The present invention provides a current collector having a conductive layer which is excellent in adhesion strength and can exhibit a PTC function for stably contributing to safety, when used for an electrode structure for non-aqueous electrolyte batteries or for electrical storage devices. A current collector, including a metal foil and a conductive layer formed on at least one side of the metal foil, the conductive layer being formed partially or entirely on the surface of the metal foil; is provided. Here, the conductive layer contains core shell particles including core particles 114 having insulating crystalline polymer as a main component, and a shell layer 116 having conductivity, the shell layer 116 being formed on the surface of the core particles 114.

Abstract: Provided are a current collector which has an excellent high-rate property and exerts a sufficient safety function when employed in a secondary battery or a capacitor, as well as an electrode, a secondary battery or a capacitor in which said current collector is employed. According to the invention, a current collector is provided which comprises: metal foil; and a conductive layer with a film thickness of 0.1 ?m to 10 ?m formed on a surface of said metal foil. Here, said conductive layer includes a conductive material and a binder material. A melting point of said binder material is 80° C. to 150° C. Further, said binder material shows, in differential scanning calorimetry (DSC) in a range from room temperature to 200° C., one or more endothermic peaks in the heating-up process. In a case where said binder material shows two or more endothermic peaks, each difference between said peaks is 15° C. or more. Moreover, said binder material shows one or more exothermic peaks in the cooling-down process.

Abstract: Provided is a current collector which can secure safety by certainly exhibiting the PTC function when used for an electrode structure of an electrical storage device such as non-aqueous electrolyte batteries, electrical double layer capacitors, lithium ion capacitors, and the like. Here, the current collector shall also be capable of being used for high-speed charge/discharge, having long life, being high in safety, and having excellent productivity. According to the present invention, a current collector 1 including a substrate 3, and a resin layer 5 formed on at least one side of the substrate 3, the resin layer 5 having conductivity, is provided. The current collector 1 satisfies the following conditions of: (1) a degree of swelling of the resin layer 5 with a non-aqueous electrolyte solution is 1% or more and 1000% or less at a PTC realization temperature, and (2) the PTC realization temperature is in the range from 65° C. to 200° C.

Abstract: The present invention provides a current collector foil; and an electrode structure, lithium secondary battery or an electrical double layer capacitor using the current collector foil, which can achieve superior high rate characteristics. Provided is a current collector foil for forming thereon an active material layer containing active material particles, wherein: the current collector foil is provided with a roughened portion; a cross sectional curve of the roughened portion has a box counting dimension of 1.1 or higher; and an average length of waviness motif AW of the cross-sectional curve of the roughened portion is longer than twice of D10, D10 being a particle diameter of the active material particle in particle size cumulative distribution, the active material particle being used for the active material layer formed on the current collector foil.

Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

Abstract: A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.

Abstract: A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.