Abstract: The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.

Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.

Abstract: A wafer-processing tape, having a removable adhesive layer(2), and an adhesive layer (3), formed on a substrate film(1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.

Abstract: The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.

Abstract: A wafer-processing tape (10), having an intermediate resin layer (2), a removable adhesive layer (3), and, if necessary, an adhesive layer (4), which are laminated in this order on a substrate film (1), wherein a storage elastic modulus at 80° C. of the intermediate resin layer is larger than a storage elastic modulus at 80° C. of the removable adhesive layer.

Abstract: A wafer-processing tape, which has an adhesive layer (1) and a removable adhesive layer (2) formed on a surface of a base film (3), and which has an area where B>A, and an area where A>B, in which a peeling force between the base film (3) and the adhesive layer (1) is designated as A, and peeling forces between a target to be bonded (4) and the adhesive layer (1) and between a target to be bonded (5) and the removable adhesive layer (2) are designated as B, wherein the adhesive layer (1) is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer (2) is not transferred onto the target to be bonded (5) in the area where A>B during peeling off the tape.

Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.