Abstract: The present invention aims at preventing deterioration of flatness of a substrate and contamination of a substrate-holding surface of a substrate holder, which are caused by a resist leaking into the back surface of the substrate.

Abstract: The present invention aims at reducing the number of scanning exposure and at enhancing throughput.

Abstract: A liquid crystal display device includes: an array substrate; a counter substrate facing the array substrate; and a liquid crystal layer interposed between the array substrate and the counter substrate, wherein the array substrate includes: a plurality of pixel electrodes arranged in a matrix in a display region; a plurality of gate lines; a plurality of source lines which cross the plurality of gate lines; an insulating layer provided between the plurality of gate lines and the plurality of source lines; a plurality of switching elements respectively connected to respective ones of the plurality of the gate lines, the plurality of source lines, and the plurality of pixel electrodes; and a short ring, a plurality of first inspection signal voltage input terminals and a plurality of depletion-type thin film transistors (DTFT) provided in a peripheral region adjacent the display region, and wherein each of the plurality of gate lines and the plurality of source lines is connected to the short ring via respectiv

Abstract: An isomer mixture of 4-trifluoromethyl-2-nitrobenzoic acid and 4-trifluoromethyl-3-nitrobenzoic acid, which is a novel compound, is obtained by nitrating a compound represented by ##STR1## (Z is COY or CY.sub.3, and Y is a halogen atom) with a nitrating agent comprising nitric acid and simultaneously hydrolyzing the radical Z. Each of the two isomers is easily isolated by treating the mixture with a basic neutralizing agent to obtain a solution containing the 2-nitro isomer and a precipitate containing the 3-nitro isomer.

Abstract: In order to effectively detect unwanted residual organic compounds such as photoresist pieces left on a semiconductor substrate after a photolithography step during its fabrication process, the substrate surface is irradiated by an ultraviolet light beam and the fluorescent light emitted by the residual organic compounds is detected by a light-receiving element and converted into an electrical signal.