Abstract: Because it is possible to cool down a column member at a higher speed than natural cooling, throughput can be improved further. Especially, when the tubular body M42 and the column part M43 are made of different metals and the column part M43 is pressed into the tubular body M42, a distortion will occur in the column member M42 and M43 and the top board M41 fixed to the column member M42 and M43 due to the difference in thermal expansion coefficients between them, but the cooling paths P1 and P2 can absorb a distortion caused by the difference in thermal expansion coefficients of these metals. In particular, when the top board M41 is used as a mold for resin molding, it is possible to perform resin molding precisely because distortion caused by the difference in thermal expansion coefficients does not easily occur.

Abstract: A method of producing a liquid crystal polyester composition, the twin-screw extruder including a cylinder having a supply port for supplying the liquid crystal polyester, a first addition port for adding the filler other than fibrous fillers and a second addition port for adding a fibrous filler which are provided downstream of the supply port, and a screw provided with kneading portions on the upstream side and downstream side of the first addition port, a resin temperature (T1) of the liquid crystal polyester after kneading in the nearest upstream kneading portion satisfying formula (1), and a resin temperature (T2) of the liquid crystal polyester after kneading in the nearest downstream kneading portion satisfying formula (2): FT?100(° C.)?T1?FT+20(° C.)??(1) FT?100(° C.)?T2?FT+30(° C.)??(2) wherein FT represents the flow starting temperature of the liquid crystal polyester.

Abstract: In a package wherein a lead part coupled to a semiconductor element by wire bonding, an element retention member to retain the semiconductor element on the top face side and radiate heat on the bottom face side, and an insulative partition part to partition the lead part from the element retention member with an insulative resin appear, a creeping route ranging from the top face to retain the semiconductor element to a package bottom face on a boundary plane between the element retention member and an insulative partition part includes a bent route having a plurality of turns. Consequently, it is possible to inhibit an encapsulation resin to seal a region retaining the semiconductor element from exuding toward the bottom face side of the package.

Abstract: The present invention provides a resin composition comprising a liquid crystal polyester and a titanium oxide filler, wherein when a value obtained by converting the content of aluminum in the titanium oxide filler to the content of aluminum oxide is A (% by weight) and the volume average particle diameter of the titanium oxide filler is B (?m), A and B satisfy the formula (I): A?0.1 and the formula (II): A/B2?25, a reflective board obtained by molding the resin composition, and a light-emitting apparatus comprising the reflective board and a light-emitting element. According to the resin composition of the present invention, a reflective board having high reflectance and high heat resistance can be obtained. Furthermore, a light-emitting apparatus which is excellent in properties such as luminance can be obtained by using the reflective board.

Abstract: A method is provided for manufacturing a liquid crystal polyester molded body by molding a liquid crystal polyester composition using a molding machine containing a cylinder, a screw and a heater. The screw is provided inside the cylinder, and is composed of a feed section, a compression section, and a metering section, the feed section and the compression section of the screw are composed of a single flight, the heater is provided on the outer periphery of the cylinder. The liquid crystal polyester composition contains a liquid crystal polyester and a polyamide resin. The method for manufacturing the polyester molded body includes: a step of melting and metering the liquid crystal polyester composition, a step of tightening a mold and performing mold clamping, a step of injecting the melted liquid crystal polyester composition into the mold, and a step of extracting the solidified resin from inside the mold.

Abstract: A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1<S2 is satisfied.

Abstract: In a package wherein a lead part coupled to a semiconductor element by wire bonding, an element retention member to retain the semiconductor element on the top face side and radiate heat on the bottom face side, and an insulative partition part to partition the lead part from the element retention member with an insulative resin appear, a creeping route ranging from the top face to retain the semiconductor element to a package bottom face on a boundary plane between the element retention member and an insulative partition part includes a bent route having a plurality of turns. Consequently, it is possible to inhibit an encapsulation resin to seal a region retaining the semiconductor element from exuding toward the bottom face side of the package.

Abstract: The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.

Abstract: An object is to provide a method for producing a liquid crystal polyester composition which is excellent in mechanical strength and has semiconductivity. The present invention provides a method for producing a liquid crystal polyester composition, which includes the step of melt-kneading a liquid crystal polyester in the amount of 85 to 99 parts by mass and a nanostructured hollow-carbon material in the amount of 1 to 15 parts by mass, based on 100 parts by mass in total of the liquid crystal polyester and the nanostructured hollow-carbon material, under shear rate of 1,000 to 9,000/second, the nanostructured hollow-carbon material including a carbon part and a hollow part, and having such a structure that a part or all of the hollow part is surrounded by the carbon part.

Abstract: A method of producing a liquid crystal polyester composition, the twin-screw extruder including a cylinder having a supply port for supplying the liquid crystal polyester, a first addition port for adding the filler other than fibrous fillers and a second addition port for adding a fibrous filler which are provided downstream of the supply port, and a screw provided with kneading portions on the upstream side and downstream side of the first addition port, a resin temperature (T1) of the liquid crystal polyester after kneading in the nearest upstream kneading portion satisfying formula (1), and a resin temperature (T2) of the liquid crystal polyester after kneading in the nearest downstream kneading portion satisfying formula (2): FT?100(° C.)?T1?FT+20(° C.)??(1) FT?100(° C.)?T2?FT+30(° C.)??(2) wherein FT represents the flow starting temperature of the liquid crystal polyester.

Abstract: The present invention provides a method for producing a liquid crystal polyester composition, the method comprising feeding a liquid crystal polyester and a polyhydric alcohol fatty acid ester into an extruder having a vent portion, followed by melt-kneading in a state where the degree of decompression of the vent portion is ?0.06 MPa or less in terms of a gauge pressure. The composition obtained by the method can provide a molded article having a thin wall portion and complicated shape.

Abstract: The present invention provides a method for producing a thermoplastic resin composition, the method comprising a step of melt-kneading 5 to 55 parts by weight of an aromatic polycarbonate resin and 95 to 45 parts by weight of an aromatic polysulfone resin while shearing at a sharing speed of 1,000 to 9,000/sec. By the method, a thermoplastic resin composition excellent heat resistance and transparency can be obtained.

Abstract: The present invention provides a resin composition comprising a liquid crystal polyester and a titanium oxide filler, wherein when a value obtained by converting the content of aluminum in the titanium oxide filler to the content of aluminum oxide is A (% by weight) and the volume average particle diameter of the titanium oxide filler is B (?m), A and B satisfy the formula (I): A?0.1 and the formula (II): A/B2?25, a reflective board obtained by molding the resin composition, and a light-emitting apparatus comprising the reflective board and a light-emitting element. According to the resin composition of the present invention, a reflective board having high reflectance and high heat resistance can be obtained. Furthermore, a light-emitting apparatus which is excellent in properties such as luminance can be obtained by using the reflective board.

Abstract: The present invention provides a method for producing a composition, the method feeding a liquid crystalline polyester and mica into an extruder having a vent section, and melt-kneading them under the conditions where the degree of pressure reduction of the vent section is ?0.06 MPa or less in terms of a gauge pressure. The production method can provide a composition containing a liquid crystalline polyester and mica, the composition being less likely to cause blister event at a high temperature.

Abstract: The present invention provides a composition comprising a liquid crystalline polyester, a plate-like filler and a carbon black having a number average particle size of more than 20 nm and 45 nm or less. The composition is less likely to cause blister even at a high temperature.

Abstract: The present invention provides a method for producing a liquid crystalline polyester, the method comprising the steps of reacting monomers to obtain a polycondensate corresponding thereto, granulating the polycondensate to obtain a granule, and subjecting the granule to solid-phase polymerization to obtain a liquid crystalline polyester, wherein the content of iron in the granule to be subjected to the step (C) is 5 ppm by weight or less. According to the present invention, a liquid crystalline polyester having high whiteness and excellent heat resistance can be produced with satisfactory operability.

Abstract: Because it is possible to cool down a column member at a higher speed than natural cooling, throughput can be improved further. Especially, when the tubular body M42 and the column part M43 are made of different metals and the column part M43 is pressed into the tubular body M42, a distortion will occur in the column member M42 and M43 and the top board M41 fixed to the column member M42 and M43 due to the difference in thermal expansion coefficients between them, but the cooling paths P1 and P2 can absorb a distortion caused by the difference in thermal expansion coefficients of these metals. In particular, when the top board M41 is used as a mold for resin molding, it is possible to perform resin molding precisely because distortion caused by the difference in thermal expansion coefficients does not easily occur.

Abstract: A method for fusion bonding a molded article of a liquid crystalline polymer and a glass substrate to each other, comprising bringing the molded article into contact with the glass substrate; and setting the temperature of a contact portion of the molded article in contact with the glass substrate, at a predetermined temperature, wherein when the predetermined temperature of the contact portion is represented by T1(° C.), a flow initiation temperature of the liquid crystalline polymer is represented by T2(° C.) and a decomposition initiation temperature of the liquid crystalline polymer is represented by T3(° C.), the following relation is satisfied: T3(° C.)>T1(° C.)?T2(° C.)+80° C.

Abstract: The method for producing a resin package according to the present invention includes a step of forming a copper oxide layer by oxidizing the surface of a lead frame in which at least the surface is made of copper, and a step of forming a resin package main unit by allowing a resin to adhere to the copper oxide layer on the lead frame surface by resin molding for package, and then removing a predetermined area of the copper oxide layer with an acidic solution.

Abstract: A pressure loss section H1 (H2) extends from a position corresponding to a corner of a resin package, and S1 is the minimum value of the opening area of the pressure loss section H1 (H2) perpendicular to the direction of resin flow (X axis) in the pressure loss section H1 (H2) during resin molding, while S2 is the average value of the opening areas of excess resin reservoirs H3 to H5 perpendicular to the direction of resin flow (Y axis) within excess resin reservoir H3 to H5 during molding. In this lead frame, S1<S2 is satisfied.