Patents by Inventor Yasuo Miyadera

Yasuo Miyadera has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7781896
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: August 24, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 7771559
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: August 10, 2010
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Patent number: 7528488
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: May 5, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20080290529
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Application
    Filed: June 13, 2008
    Publication date: November 27, 2008
    Applicant: Hitachi Chemical Co., Ltd.
    Inventors: Shinji TAKEDA, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 7387914
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: June 17, 2008
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 7258918
    Abstract: An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: August 21, 2007
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20060263599
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20060260744
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): wherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R1 represents an alkyl group, a fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R1 is 0 to 4, X represents O or N—R3, provided that R3 represents one of the following groups, Y represents SO2 or Co and n represents a number of repeating units in the polymer, as a pressure-sensitive conductive polymer at least partially between electrodes opposed to each other; and applying a pressure to fix the both electrodes, a surface-treated wiring board comprising polyphthalide represented by the formula (I) formed on at least part of the surface of the electrode part, an adhesive film comprising an adhesive and polyphthalide represented by the formula (I), and an electrode-connected structure using the same.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 23, 2006
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20060180903
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Application
    Filed: April 24, 2006
    Publication date: August 17, 2006
    Applicant: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 7078094
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: July 15, 2004
    Date of Patent: July 18, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 7057265
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: June 6, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 7012320
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: March 14, 2006
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 6855579
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: February 15, 2005
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Publication number: 20040253770
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Application
    Filed: July 15, 2004
    Publication date: December 16, 2004
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Patent number: 6825249
    Abstract: Provided are a laminating method and machine for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe. leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position B by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2. It is therefore possible to bond a film-shaped organic die-bonding material under compression on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: November 30, 2004
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Yasuo Miyadera, Mituo Yamasaki, Iwao Maekawa, Akio Kotato, Yuusuke Miyamae, Tadaji Satou, Makoto Saitou, Tooru Kikuchi, Akira Kageyama, Aizou Kaneda
  • Patent number: 6717242
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 Mpa or less at a temperature of 259° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: April 6, 2004
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Publication number: 20030178138
    Abstract: The present invention relates to a method for connecting electrodes comprising: interposing the polyphthalide represented by the formula (I): 1
    Type: Application
    Filed: January 16, 2003
    Publication date: September 25, 2003
    Inventors: Isao Tsukagoshi, Yasushi Gotou, Masami Yusa, Yasuo Miyadera
  • Publication number: 20030160337
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Application
    Filed: May 2, 2003
    Publication date: August 28, 2003
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Publication number: 20010035533
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Application
    Filed: February 20, 2001
    Publication date: November 1, 2001
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda
  • Publication number: 20010016384
    Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.
    Type: Application
    Filed: February 20, 2001
    Publication date: August 23, 2001
    Inventors: Shinji Takeda, Takashi Masuko, Masami Yusa, Tooru Kikuchi, Yasuo Miyadera, Iwao Maekawa, Mitsuo Yamasaki, Akira Kageyama, Aizou Kaneda