Abstract: A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices.

Abstract: A laminating method and a machine are provided for successively heating and compression-bonding a film-shaped organic die-bonding material on a leadframe with good productivity but without voids and further to avoid package cracking upon mounting a chip. A leadframe 7 is placed on a travelling table 8 and is heated there. A film-shaped organic die-bonding material 2 is punched out and the resulting film is tack-bonded to a die pad on the leadframe. The leadframe with the film tack-bonded thereon is then moved to a position b by the travelling table. After the film is pressed by a compression-bonding element at the position B, a chip is mounted on the film-shaped organic die-bonding material 2.

Abstract: Related to a liquid-crystal alignment film that can align liquid-crystal molecules without resort to the rubbing.The liquid-crystal alignment film of the present invention comprises a resin (e.g., a polyimide) containing a photoisomerizable and dichroic structural unit (e.g., a stilbene derivative), and is furnished with the ability to align liquid-crystal molecules when a film formed of the resin is irradiated with linearly polarized light; the ability to align liquid-crystal molecules being held and fixed.The liquid-crystal alignment film of the present invention is used in electric-filed driven type liquid-crystal display devices.

Abstract: The present invention is directed to a sheet-form environment purifying material comprising particles of metal and/or metal oxide consisting essentially of at least one member being selected from the group consisting of manganese, copper, zinc, iron, vanadium, nickel, titanium, palladium, platinum, manganese oxide, copper oxide, zinc oxide, iron oxide, vanadium oxide, nickel oxide, titanium oxide, palladium oxide, and platinum oxide, adsorbent particles consisting essentially of at least one member selected from the group consisting of activated carbon, zeolite, silica gel, sepiolite, activated alumina and activated clay, thermoplastic resin particles being selected from ultrahigh-molecular weight polyethylene, polyethylene, polycarbonate, polyamide acrylonitrile-butadiene-styrene resins, polyimide, polyvinyl chloride, cellulose acetate, polysulfone, polystyrene phthalate and polypropylene, and an air-permeable sheet of fibrous.

Abstract: An electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; and (B) an electrically conductive filler. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Abstract: A polyimide obtained by reacting an acid dianhydride such as catechol bistrimellitate dianhydride, bisphenol A bistrimellitate dianhydride, etc. with a diamine such as 4,4'-diamino-3,3',5,5'-tetraisopropyl-diphenylmethane, etc. has high solubility in organic solvents and good moldability at low temperatures, and can provide a thermosetting resin composition together with a polymaleimide.

Abstract: Described is an electrically conductive bonding film useful in bonding an IC or LSI with a lead frame. The film comprises (A) a polyimide resin obtained by reacting a tetracarboxylic dianhydride component, in which the content of a tetracarboxylic dianhydride represented by the following formula (I): ##STR1## wherein n stands for an integer of 2-20 amounts to at least 70 mole %, with a diamine; (B) an electrically conductive filler, and a thermoset resin. Optionally, the film may further comprises a thermosetting resin or an imide compound having at least two thermally-crosslinking imido groups per molecule.

Abstract: An alignment film for liquid crystal is provided which comprises a polyimide comprising a repeating unit of the general formula (I): ##STR1## wherein n is an integer of from 2 to 16 and R.sup.1 represents a divalent organic group. This polyimide is obtained for example, from a reaction between ethylene glycol bis(trimellitate dianhydride) and 4,4'-diaminodiphenyl ether. This polyimide or a varnish of a precursor thereof is coated on a plate, and dried to obtain an alignment film for liquid crystal, which stably exhibits a high pretilt angle, irrespective of curing temperatures. The present invention further provides a liquid crystal-sandwiched panel and a liquid crystal display module prepared using the alignment film as well as a material for the preparation of the alignment film.

Abstract: The surface of a polyimide molded article such as polyimide film is treated with a solution containing a basic compound, further treated with a solution containing a silane coupling agent and then subjected to a heat treatment. This greatly improves the adhesiveness of the polyimide molded article surface to the polyimide adhesive layer formed thereon. This invention can be applied to the production of substrates for flexible wiring boards having a polyimide film/polyimide adhesive/copper foil structure.

Abstract: A polymide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

Abstract: A polyimide comprises structural units represented by the following formula: ##STR1## wherein Ar is a group consisting of 10-90 mole % of a first specific structural sub-unit and 90-10 mole % of a second particular structural sub-unit. A process for the production of the polyimide and a thermosetting resin composition comprising the polyimide and a particular polymaleimide are also disclosed.

Abstract: A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

Abstract: A fluorine-containing polyimide having a low dielectric constant, low water absorption and excellent heat resistance and moisture resistance and a precursor thereof such as a fluorine-containing polyamide-acid, can be prepared by reacting an acid anhydride with an aromatic diamine having perfluoroalkyl group.

Abstract: A fluorine-containing aromatic polyamide obtained by reacting an aromatic dicarboxylic acid having a perfluoroalkenyloxy group with a diamine is excellent in water repellency, water resistance, heat resistance, etc.

Abstract: Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

Abstract: 3,4-Dihydroxyphenylalanine wherein the amino group is protected with a 9-fluorenylmethyloxycarbonyl group, or a derivative thereof can be produced by reacting 3,4-dihydroxyphenylalanine with a boron compound or phosphorus compound to stabilize the hydroxyl groups, followed by introduction of a 9-fluorenylmethyloxycarbonyl group thereinto.

Abstract: A heat curable resin composition comprising (A) a polyimide and (B) a polymaleimide is excellent in heat resistance and suitable for use as a film-shaped adhesive, a laminate or a molding material.

Abstract: An epoxy resin composition for a copper-clad laminate comprising an epoxy resin having at least two epoxy groups in one molecule, a phenolic compound having at least two functional groups in one molecule as a hardener, an imidazole compound having a masked imino group as a hardening accelerator, and one or more of nitrogen compounds selected from the group consisting of urea derivatives represented by the formula R.sup.1 --NH--CO--NH.sub.2, wherein R.sup.1 is hydrogen or an organic group; acid amide compounds; and guanidine derivatives, which is advantageously used for the material of a copper-clad laminate. Accordingly, the copper-clad laminate is especially used for the production of printed circuit boards, and its drilling property, peeling resistance of the copper foil, adhesive property, and heat resistance are improved remarkably. In addition, this epoxy resin composition has an excellent storing stability.

Abstract: A polyamino-bis-maleimide prepolymer solution obtained by the reaction of 1 mol of N,N'-4,4'-diphenyl methane-bis-maleimide with 0.25 to 0.4 mol of 4,4'-diaminodiphenyl methane in an alkyleneglycol monoalkyl ether as a solvent at elevated temperatures. This solution can be impregnated with a substrate to form a prepreg. The prepreg can be laminated to form heat resistant laminate.

Abstract: A polyamino-bis-maleimide prepolymer solution obtained by the reaction of 1 mole of N,N'-4,4'-diphenyl methane-bis-maleimide with 0.25 to 0.4 mol of 4,4'-diaminodiphenyl methane in an alkyleneglycol monoalkyl ether as a solvent at elevated temperatures. This solution can be impregnated with a substrate to form a prepreg. The prepreg can be laminated to form heat resistant laminate.