Abstract: An analysis device including a flow channel member, a suction mechanism, and a measurement unit. The flow channel member includes a flow channel; The suction mechanism is connected to a first end of the flow channel member and is configured to introduce a liquid sample from a second end of the flow channel member to the flow channel and hold the liquid sample between fluid layers in a part of the flow channel. The measurement unit includes a light irradiation unit a light reception unit configured to receive light from the part of the flow channel and the contents of the part of the flow channel when irradiated by the light irradiation unit. The measurement unit includes an aperture member to limit light from the light irradiation unit and includes an opening having an opening width shorter than the length of the part of the flow channel.

Abstract: An analysis device 1 is provided with: a flow channel 12c; a suction mechanism connected to one end of the flow channel, the suction mechanism being configured to introduce a trace amount of a liquid sample L from the other end of the flow channel 12c into an inside of the flow channel 12c and hold the liquid sample L in a part of the flow channel 12c; and a measurement unit 40 configured such that a light irradiation unit 41 for irradiating the liquid sample L held by the part of the flow channel member 12 with light and a light reception unit for receiving the light from the liquid sample L are disposed around the liquid sample L. The measurement unit 40 is provided with an aperture member 46 to limit the light directed from the light irradiation unit 41 toward the liquid sample L, the aperture member 46 including an opening having an opening width L2 shorter than a liquid length L1 of the liquid sample L held by the flow channel 12c in the flow channel 12c.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A liquid sample is dropped onto the upper surface of a transparent and cylindrical light-transmitting body (22), and the liquid sample is maintained as a droplet by the surface tension. From above the liquid sample, a transparent cover plate (25) is lowered down to the position where the lower surface thereof touches a spacer (23) in order that the liquid sample is held in the small gap formed between the upper surface of the light-transmitting body (22) and the lower surface of the transparent cover plate (25). A measurement light is provided into the liquid sample held in this manner from immediately above it, and passes through the liquid sample. The transmitted light emitted downwards through the light-transmitting body (22) is introduced into a spectro-detecting unit to be spectro-measured. The measurement optical path length can be adjusted by the height of the spacer (23). This enables an easy transmission spectro-measurement of an extremely small amount of liquid sample.

Abstract: In a spectrophotometer for measuring transmitted light of a trace liquid sample, four sample holders 12 are provided on a disk-like sample plate 11 while spaced apart by 90 degrees. The sample plate 11 is driven to rotate so that each of the sample holders 12 is sequentially moved to a sample supply position U1, a measuring position U2, a wiping position U3 and a waiting position U4. At the sample supply position U1, a trace amount of the liquid sample is dropped into a groove of the sample holder 12. Then at the measuring position U2, a window plate 22 is lowered onto the groove so as to determine the optical path length. Next, measurement of the transmitted light is performed. Further, while the sample holder 12 moves from the measuring position U2 to the waiting position U4, the liquid sample is absorbed and removed by contact with a cleaning pad 26. The liquid sample attached to the window plate 22 is wiped out by another pad.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A liquid sample is dropped onto the upper surface of a transparent and cylindrical light-transmitting body (22), and the liquid sample is maintained as a droplet by the surface tension. From above the liquid sample, a transparent cover plate (25) is lowered down to the position where the lower surface thereof touches a spacer (23) in order that the liquid sample is held in the small gap formed between the upper surface of the light-transmitting body (22) and the lower surface of the transparent cover plate (25). A measurement light is provided into the liquid sample held in this manner from immediately above it, and passes through the liquid sample. The transmitted light emitted downwards through the light-transmitting body (22) is introduced into a spectro-detecting unit to be spectro-measured. The measurement optical path length can be adjusted by the height of the spacer (23). This enables an easy transmission spectro-measurement of an extremely small amount of liquid sample.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Abstract: Disclosed is a spectrophotometry for a spectral transmission measurement of an extremely small volume of sample solution. A sampler 15 is formed of a flat plate member formed with a sample-holding hole 152 which penetrates the flat plate member in its thickness direction and has a reverse truncated cone shape, and a target sample solution is dropped into the sample-holding hole 152 of the sampler 15 positioned approximately horizontally and held in the hole 152 based on a surface tension of the sample solution in the form of a droplet S. Then, a measurement light is emitted to the held droplet S from directly above. A transmitted light getting out of the droplet S downward is introduced to a diffraction grating 19 through a window plate 17 and a slit 18, and dispersed in a wavelength dependent manner. The resulting light with dispersed wavelength components is detected by a multichannel detector 20 approximately simultaneously.

Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Abstract: A substrate polishing apparatus polishes a substrate to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed, a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate, a fluid supply passage for supplying a measurement fluid, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the measurement fluid to the fluid chamber.

Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Abstract: In a spectrophotometer for measuring transmitted light of a trace liquid sample, four sample holders 12 are provided on a disk-like sample plate 11 while spaced apart by 90 degrees. The sample plate 11 is driven to rotate so that each of the sample holders 12 is sequentially moved to a sample supply position U1, a measuring position U2, a wiping position U3 and a waiting position U4. At the sample supply position U1, a trace amount of the liquid sample is dropped into a groove of the sample holder 12. Then at the measuring position U2, a window plate 22 is lowered onto the groove so as to determine the optical path length. Next, measurement of the transmitted light is performed. Further, while the sample holder 12 moves from the measuring position U2 to the waiting position U4, the liquid sample is absorbed and removed by contact with a cleaning pad 26. The liquid sample attached to the window plate 22 is wiped out by another pad.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a light-receiving unit for receiving reflected light from the surface of the workpiece, a spectroscope unit for dividing the reflected light received by the light-receiving unit into a plurality of light rays having respective wavelengths, and light-receiving elements for accumulating the detected light rays as electrical information.

Abstract: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device. The table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.