Abstract: A receiver optical module to facilitate the assembling is disclosed. The receiver optical module includes an intermediate assembly including the optical de-multiplexer and the optical reflector each mounted on the upper base, and the lens and the PD mounted on the sub-mount. The latter assembly is mounted on the bottom of the housing; while, the former assembly is also mounted on the bottom through the lower base. The upper base is apart from the bottom and extends in parallel to the bottom to form a surplus space where the amplifying circuit is mounted.

Abstract: A fluid separation apparatus is described, including a casing and a separation module. The casing includes a mixed fluid inlet, a separated fluid outlet through which a selectively separated fluid is discharged, and a residual fluid outlet. The separation module has a set of serially arranged separation elements disposed therein and is insertable into the casing from an end of the casing. The separation module includes a first connection jig disposed between adjacent separation elements second connection jigs disposed at two ends of the set of serially arranged separation elements, and a coupling jig coupling the first and the second connection jigs to each other.

Abstract: A light receiving device includes a microlens 21 located in each of regions corresponding to pixels, the microlens being disposed on a rear surface of an InP substrate 1. The microlens is formed by using a resin material having a range of a transmittance of light in the wavelength region between 0.7 and 3 ?m of 25% or less, the transmittance being 70% or more.

Abstract: A method to assemble a transmitter optical module is disclosed, where the optical module installs two lenses, one of which concentrates an optical beam emitted from a laser diode, while, the other collimates the optical beam concentrated by the former lens. The method has a feature that the first lens is firstly positioned in a point to collimate the optical beam coming from the laser diode, then, moved to a point, which is apart from the former point with respect to the laser diode, to concentrate the optical beam. The process performs the steps to position the lens by a jig to extract the optical beam passing through the first lens outside of the housing.

Abstract: A receiver optical module to receive a wavelength multiplexed light is disclosed. The optical module installs an optical demultiplexer to demultiplex the wavelength multiplexed light. The optical demultiplexer includes a wavelength selective filters each supported by a base substrate. A feature of the base substrate is that the base substrate in the plane shape thereof is a parallelogram with two sides forming an angle substantially equal to an incident angle of the wavelength multiplexed light input to the wavelength selective filter.

Abstract: A light receiving device includes a microlens 21 located in each of regions corresponding to pixels, the microlens being disposed on a rear surface of an InP substrate 1. The microlens is formed by using a resin material having a range of a transmittance of light in the wavelength region between 0.7 and 3 ?m of 25% or less, the transmittance being 70% or more.

Abstract: An optical transceiver is disclosed, where the optical transceiver includes an optical subassembly (OSA) with a bottom plate for dissipating heat and connected to an electronic circuit with a flexible printed circuit (FPC). The FPC is soldered with the side electrodes of the OSA as forming a solder fillet in the plane electrode, or the FPC is soldered with the plane electrodes of the OSA as forming the solder fillet in the side electrodes, and leaving a limited room for receiving the curved FPC in peripheries of the OSA.

Abstract: An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.

Abstract: An optical module is disclosed where an optical coupling efficiency between an optical device and an external fiber may be improved. The optical module includes an optical receptacle and a device unit assembled with the optical receptacle only via a stub as forming a gap to isolate these two components. The gap is filled with insulating resin or tightly covered by an insulating ring to reinforce the stub to be hard for an increased moment by the optical assemblies in the device unit.

Abstract: An optical module with an arrangement is disclosed in which the module has the LD, the TEC, and the lens with the lens carrier also mounted on the TEC. The signal light from the LD is concentrated by the lens and reflected by the mirror each assembled with the lens carrier mounted on the TEC. The TEC is mounted on the bottom metal that covers the bottom of the ceramic package, the first layer of which is widely cut to set the TEC therein. The FPC is coupled in at least two edges of the first ceramic layer left from the cut.

Abstract: An optical subassembly (OSA) with a newly arranged optical device is disclosed. The OSA provides a ceramic package that installs a semiconductor optical device, a joint portion welded to a lid of the ceramic package, and an optical coupling portion that receives an external optical fiber. In the OSA, the seal ring put between the top of the multi-layered ceramic package and the lid is isolated from the optical device; accordingly, the lid, the joint portion and the optical coupling portion are electrically isolated from the semiconductor optical device even when the OSA is installed in an optical apparatus such as an optical transceiver.

Abstract: The invention provides a method for manufacturing a optical subassembly even when the assembly involves the positional deviation of the components that induces the discrepancy in the direction of the optical output beam from the optical device. The method first determines the position (x1, y1, z1) of the stub where the optical coupling between the stub and the optical device becomes the maximum. Next, the direction of the optical output beam from the optical device is calculated based on the position above, and, finally, the inclined direction of the end surface of the stub is aligned with the direction of the optical output beam evaluated in the previous step.

Abstract: The present invention provides a receiving optical subassembly (ROSA) with a co-axial shape and a stem for mounting semiconductor devices thereon that improves the high frequency performance of the ROSA. The ROSA mounts a photodiode (PD) and a pre-amplifier on a stem and the stem has a hollow the PD and the pre-amplifier are mounted therein. Since the hollow has a depth substantially equal to a thickness of the pre-amplifier, the bonding wire from the pre-amplifier to the surface of the stem may become shortest to reduce the parasitic inductance of the bonding wire and to enhance the high frequency performance of the ROSA.

Abstract: The present invention is to provide an optical subassembly with a co-axial package that enables to sense the temperature of the devices mounted within the subassembly with a relatively inexpensive chip thermistor. The subassembly includes a co-axial package and a FPC board to connect the subassembly to the outer circuit. The thermistor is mounted on the FPC board such that one electrode thereof is connected to a pattern formed on a surface opposite to a surface facing the subassembly and the other electrode is soldered to a via hole connecting two surfaces of the FPC board and this via hole is soldered directly to the subassembly.

Abstract: The invention provides a method for manufacturing a optical subassembly even when the assembly involves the positional deviation of the components that induces the discrepancy in the direction of the optical output beam from the optical device. The method first determines the position (x1, y1, z1) of the stub where the optical coupling between the stub and the optical device becomes the maximum. Next, the direction of the optical output beam from the optical device is calculated based on the position above, and, finally, the inclined direction of the end surface of the stub is aligned with the direction of the optical output beam evaluated in the previous step.

Abstract: The present invention is to provide an optical subassembly with a co-axial package that enables to sense the temperature of the devices mounted within the subassembly with a relatively inexpensive chip thermistor. The subassembly includes a co-axial package and a FPC board to connect the subassembly to the outer circuit. The thermistor is mounted on the FPC board such that one electrode thereof is connected to a pattern formed on a surface opposite to a surface facing the subassembly and the other electrode is soldered to a via hole connecting two surfaces of the FPC board and this via hole is soldered directly to the subassembly.

Abstract: A planar optical waveguide is formed with an optical circuit having an inclined groove. A reflection filter is installed on the inside of the inclined groove 3 crossing a plurality of optical waveguides. Reflected light from the reflection filter is detected by an array of photodetectors to monitor the optical intensity of the signal light. The photodetector array is held by a sub-mounting substrate disposed at the top side of the optical circuit so that a mounting face of the photodetector array is inclined at an angle a (0°<?<90°) with respect to the top surface of the optical circuit such that the reflected light from the reflection filter is made incident onto a light incident face of the photodectors at a predetermined angle ?. The optical waveguide module is capable of monitoring the optical intensity correctly regardless of the polarization state of the signal light.

Abstract: The present invention provides a receiving optical subassembly (ROSA) with a co-axial shape and a stem for mounting semiconductor devices thereon that improves the high frequency performance of the ROSA. The ROSA mounts a photodiode (PD) and a pre-amplifier on a stem and the stem has a hollow the PD and the pre-amplifier are mounted therein. Since the hollow has a depth substantially equal to a thickness of the pre-amplifier, the bonding wire from the pre-amplifier to the surface of the stem may become shortest to reduce the parasitic inductance of the bonding wire and to enhance the high frequency performance of the ROSA.

Abstract: In a planar optical waveguide type optical circuit 1, a reflection filter 4 is installed on the inside of a inclined groove 3, which is formed so as to cross optical waveguides 2n. Reflected light from the reflection filter 4 is detected by photodetectors 61n of a photodetector array 60, thereby the optical intensity of the signal light is monitored. As for the photodetectors 61n, there is adopted a constitution such that a sub-mounting substrate 70 is disposed at the top side of the optical circuit 1 to hold the photodetector array 60 with a photodetector mounting face 71, which is inclined at an angle ? (0°<?<90°) with respect to the top surface of the optical circuit 1 such that the reflected light from the reflection filter 4 is made incident onto a light incident face 63 of the photodetectors 61n in the photodetector array 60 at a predetermined angle ?.

Abstract: An optical device 1 has a substrate 2, whereas bare fibers 5 exposed from a coated optical fiber tape 3 by removing a coating 4 from its middle part are secured to the upper face part of the substrate 2. In the substrate 2, a transverse groove 8 is formed obliquely with respect to an axis of the bare fibers 5 so as to traverse core parts 5a of the bare fibers. An optical member 9 for reflecting a part of signal light transmitted through the bare fibers 5 is inserted in the transverse groove 8. A support member 10 is provided on the upper side of the bare fibers 5, whereas a support surface 10a of the support member 10 is provided with photodetectors 11 for detecting light reflected by the optical member 9. The support surface 10a of the support member 10 is inclined with respect to the upper face of the substrate 2, whereby the light entrance surface 13 of each photodetector 11 is inclined by a predetermined angle with respect to the upper face of the substrate 2.