Abstract: A method and an apparatus, which enable mirror-polishing a peripheral chamfered portion of a semiconductor wafer effectively, are disclosed. Mirror-polishing a peripheral side surface of the chamfered portion of the wafer, beveled surfaces thereof, and rounded edges formed between the peripheral side surface and each of the beveled surfaces, are individually carried out.

Abstract: A method and apparatus for polishing chamfers made along the periphery; of a semiconductor wafer designed such that when the wafer is once picked up by a rotatory suction cup of a transportation robot, arm, the wafer is not released from the suction cup until the entire polishing operation is completed; in an embodiment, a circular turn table having six wafer suction cups is employed which is adapted to turn step-wise, each step consisting of a turn through an angle of 60.degree. to transfer the wafers.

Abstract: An apparatus for bevelling the edge of a wafer, comprising a framework, a table rotatably mounted to the framework and capable of holding down the wafer, a buff rotatably mounted to the framework opposite the table and having a formed groove for bevelling the wafer edge, an air cylinder assembly mounted to the framework and pressing the buff by different forces on the orientation flat, the circular edge and the round joints of the wafer held down by the table, a sensor sensing the orientation flat, the circular edge and the round joints of the wafer held down by the table and producing corresponding signals, and a control controlling the air cylinder assembly to select between the forces in response to the signals. The apparatus may comprise a grooving cutter assembly removably held by the table, a lock locking the rotation of the table when the apparatus produces the formed groove in the buff, and a stopper stopping the air cylinder assembly and positioning the cutter assembly relative to the buff.

Abstract: An apparatus for polishing the periphery portion of a wafer, by which improvement on the polishing velocity may be effected and besides a more efficient spatial usage of the working layer of an abrasive tape is capable, comprising a tape holding fixed abrasive grains thereon; a feed reel for feeding the tape stored by winding itself; a take-up reel for taking up the tape by winding itself; a rotary drum inside of which both of the reels are equipped in such a manner that they are mountable or demountable, where a portion of the tape in the way from the feed reel to the take-up reel is adaptive to wind the rotary drum around the outer cylindrical surface thereof in close contact in the shape of a helicoid and one of the main faces of the wafer is positioned to be in a plane intersecting the central axis of the rotary drum at an angle.

Abstract: A wafer chamfer polishing apparatus with a rotary circular dividing table, wherein the vacuum pump for pneumatically activating the wafer suction cups is mounted on an integral part of the rotary circular dividing table and the drive motors for dynamically activating the wafer suction cups are installed on an independent stationary body.