Abstract: A novel imidazole compound that yields a surface treatment liquid that is very effective at suppressing migration and oxidation of a wiring surface; a metal surface treatment liquid that contains the imidazole compound; a metal surface treatment method that uses the metal surface treatment liquid; and a laminate production method that uses the surface treatment liquid. A metal is surface-treated using the surface treatment liquid which includes a saturated fatty acid or a saturated fatty acid ester of a specific structure, in which a prescribed position is substituted by an aromatic group of a prescribed structure and an imidazolyl group that may have a substituent group.

Abstract: Provided is a solvent for organic transistor production. The solvent has excellent solubility for organic semiconductor materials and enables formation of an organic transistor having high crystallinity. The solvent according to the present invention for organic transistor production includes a solvent A represented by Formula (a). In the formula, Ring Z represents a ring selected from an aromatic carbon ring, a 5- to 7-membered alicyclic carbon ring, and a 5- to 7-membered heterocyclic ring; R1 represents a group selected from oxo, thioxy, —ORa, —SRa, —O(C?O)Ra, —RbO(C?O)Ra, and substituted or unsubstituted amino; and R2 represents a group selected from hydrogen, C1-C7 alkyl, aryl, and —ORa, where R1 and R2 may be linked to each other to form a ring with one or more carbon atoms constituting Ring Z.

Abstract: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently represents a hydrogen atom or an organic group, but at least one represents an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 represents a single bond or an organic group. R4 to R9 each independently represents a hydrogen atom, an organic group, etc., but R6 and R7 are not hydroxyl groups. R10 represents a hydrogen atom or an organic group.

Abstract: A novel vinyl-group-containing fluorene compound and a method for producing the same, a polymerizable monomer and cross-linking agent including this compound, a leaving-group-containing fluorene compound, a monovinyl-group-containing fluorene compound, and methods for producing the same. This vinyl-group-containing fluorene compound is represented by formula (1). In the formula, W1 and W2 represent a group represented by formula (2), a group represented by formula (4), a hydroxyl group, or a (meth)acryloyloxy group, R3a and R3b represent a cyano group, a halogen atom, or a monovalent hydrocarbon, and n1 and n2 are integers of 0-4. In formulas (2) and (4), a ring (Z) is an aromatic hydrocarbon ring, X is a single bond or a group represented by —S—, R1 is a single bond or a C1-4 alkylene group, R2 is a specific substituent group such as a monovalent hydrocarbon, and m is an integer of 0 or greater.

Abstract: Provided is a high-purity crystal of an unsaturated carboxylic acid amide compound which is useful as or for fine chemicals such as pharmaceuticals, agricultural chemicals, polymeric materials, functional materials, and intermediates of them. The crystal includes an unsaturated carboxylic acid amide compound represented by Formula (1) in an amount of 95 percent by area or more. In X-ray diffraction, the crystal exhibits peaks at 2? in the range of 29.0 to 30.0 and in at least one range selected from 6.0 to 8.0, 12.0 to 13.5, and 16.5 to 17.5 and exhibits approximately no peak at 2? in the range of 14.0 to 15.0.

Abstract: Provided is a solvent or solvent composition for organic transistor production. The solvent or solvent composition allows an organic semiconductor material to dissolve therein with high solubility and can form a highly crystalline organic transistor. The solvent or solvent composition for organic transistor production according to the present invention is a solvent or solvent composition for dissolution of an organic semiconductor material and includes a solvent A represented by Formula (A). In Formula (A), R1 is selected from C1-C4 alkyl, C1-C4 acyl, a C5-C6 cycloalkane ring, a C5-C6 cycloalkene ring, C6-C12 aryl, and a group including two or more of them bonded to each other. R2, R3, R4, and R5 are, identically or differently in each occurrence, selected from hydrogen, C1-C4 alkyl, and C1-C4 acyl. R6 is selected from C1-C4 alkyl and C1-C4 acyl. R1 and R3 may be linked to each other to form a ring with the adjacent oxygen atom and carbon atom; n represents 1 or 2; and m represents an integer from 0 to 2.

Abstract: Provided is a high-purity crystal of an unsaturated carboxylic acid amide compound which is useful as or for fine chemicals such as pharmaceuticals, agricultural chemicals, polymeric materials, functional materials, and intermediates of them. The crystal includes an unsaturated carboxylic acid amide compound represented by Formula (1) in an amount of 95 percent by area or more. In X-ray diffraction, the crystal exhibits peaks at 2? in the range of 29.0 to 30.0 and in at least one range selected from 6.0 to 8.0, 12.0 to 13.5, and 16.5 to 17.5 and exhibits approximately no peak at 2? in the range of 14.0 to 15.0.

Abstract: Provided is a solvent or solvent composition for organic transistor production that is excellent in solubility of an organic semiconductor material and that can form an organic transistor high in crystallinity. The solvent or solvent composition for organic transistor production according to the present invention is a solvent or solvent composition for organic semiconductor material dissolution, including a solvent A represented by the following formula (A). In the formula (A), R1 to R4 are the same or different, and represent a C1-2 alkyl group. R1 and R4 may be bound to each other to form a ring together with —N(R2)—C(?O)—N(R3)— in the formula.

Abstract: A novel compound suitable for obtaining a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure. The compound is represented by the following formula (1). In the formula, R1 and R2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R1 and R2 may be bonded to form a ring structure and may contain a hetero atom bond. R3 indicates a single bond or an organic group. R4 to R9 each independently indicate a hydrogen atom, an organic group, etc., but R6 and R7 are never hydroxyl groups. R10 indicates a hydrogen atom or an organic group.