Abstract: It is made possible to provide a battery-integrated semiconductor module containing a small built-in battery having satisfactory output characteristics. A battery-integrated semiconductor module includes: an insulating substrate; a semiconductor device provided on the insulating substrate; a nonaqueous electrolyte battery for driving the semiconductor device, which is provided in and/or on the insulating substrate and comprises a positive electrode, a negative electrode, a separator for separating the positive electrode and the negative electrode from each other, and a nonaqueous electrolyte containing an ionic liquid as a main component, with which the positive electrode, the negative electrode, and the separator are impregnated; and a sealing resin provided to cover the semiconductor device and the nonaqueous electrolyte battery, wherein any one of the positive electrode, the negative electrode, and the separator is in contact with the insulating substrate and the sealing resin.

Abstract: An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

Abstract: Disclosed is a wiring member comprising a sheet-like porous substrate provided with a large number of open-cells which are three-dimensionally branched and opened to a first major surface as well as to a second major surface of the porous substrate, and a conductive portion formed on the first major surface of the porous substrate and formed at least partially an inter-penetrating structure together with the porous substrate at an interface of the porous substrate. The apertures of the open-cells on the first major surface have an average diameter and an average number of the apertures, at least one of which is smaller than that of the second major surface.

Abstract: According to one embodiment, there is provided a method of manufacturing a magnetic recording media including depositing a magnetic layer on a substrate and processing the magnetic layer to form protruded magnetic patterns, depositing a planarizing layer in recesses between the magnetic patterns and on the magnetic patterns, and forming steps on a surface of the planarizing layer.

Abstract: A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.

Abstract: A liquid crystal display includes a pair of substrates having main surfaces respectively, the main surfaces facing on each other; a polymer layer interposed between the pair of substrates, the polymer layer including a block copolymer having a liquid crystalline side chain and having a periodic structure in a perpendicular direction to the main surfaces; and a controller that controls a light reflectance of the polymer layer by applying a voltage to the polymer layer.

Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc?No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.

Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc?No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.

Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc-No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.

Abstract: A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer.

Abstract: A mask used for exposing a porous substrate to form a first region and a second region, the first region being filled with a conductive material piercing through the entire thickness of the porous substrate to constitute an interfacial conductive portion, the second region being filled with a conductive material not piercing the entire thickness of the porous substrate to constitute a non-interfacial conductive portion. The mask includes a first light-transmitting region for exposing the first region, and a second light-transmitting region for exposing the second region, said second light-transmitting region including an aggregation of fine patterns of which an average aperture ratio is not more than 50% of an average aperture ratio of the first light-transmitting region and a size of said fine patterns of the second light-transmitting region being in the range of 0.1 ?m to 10 ?m.

Abstract: Disclosed is a method of manufacturing a composite member having a conductive pattern, comprising (1) forming on a surface of an insulating body a photosensitive layer containing both a photosensitive compound forming an ion-exchange group upon irradiation with an energy beam and a crosslinkable compound having a crosslinkable group, (2) forming a pattern of ion-exchange groups by selectively exposing the photosensitive layer to an energy beam so as to form an ion-exchange group in the exposed portion, (3) crosslinking the crosslinkable compound contained in at least the exposed portion of the photosensitive layer, (4) allowing metal ions, or a metal colloid to be adsorbed on the pattern of ion-exchange groups formed by the selectively exposing, and (5) forming a composite member having conductive pattern by depositing a conductive material on the pattern of ion-exchange groups having the metal ions, or the metal colloid adsorbed thereon using an electroless plating.

Abstract: According to one aspect of the invention, a contact sheet for testing electronic parts, comprising an insulating porous layer; and a connection electrode which is disposed on the insulating porous layer and electrically connect the electrode or terminal of the electronic parts and the terminal of a test apparatus; wherein the connection electrode is embedded below at least one main surface of the insulating porous layer.

Abstract: The present invention provides a composite material such as a passive element, a passive element composite component, a substrate with a built-in passive element and a composite wiring substrate which are free from, for example, a layer peeling problem and enables high density packaging with ease. In the present invention, a porous base material is divided into plural functional regions and a material having different electromagnetic characteristics is filled in a pore of the porous base material of each functional region, to form a passive element or a wiring substrate. Among the aforementioned plural functional regions, at least one functional region is a conductive material region filled with a conductive material and other regions are filled with a high-dielectric material, a high-permeability material or a low-dielectric material.

Abstract: A semiconductor test unit comprises a test circuit for inputting/outputting a test signal to/from an examined electronic product, a test signal wiring electrically connected to the test circuit, a contact board electrically connected to an electrode of the examined electronic product and provided with an electrically conductive via to which the test signal is transmitted, a multilayer circuit board electrically connected to the conductive via and the test signal wiring, located under the bottom face of the contact board, and provided with at least one through-hole, and a vacuum attachment mechanism for attaching thereto and holding the examined electronic product, the contact board, and the multilayer circuit board by vacuum. The contact board is made of an insulative material, has top and bottom faces, and is provided with at least one through-hole.

Abstract: A method of manufacturing an electronic circuit satisfying demands for cost reduction, diversified small-quantity production, and a shorter cycle of design, manufacture, evaluation, correction, and so on is provided. The method includes at least forming a first pattern or forming a second pattern. Forming the first pattern comprises: forming a visible image on an electrostatic latent image formed on a photosensitive base, by the adhesion of charged particles essentially made of a resin; transferring the visible image onto the intermediate transfer base by the contact and pressurization of the visible image; heating/softening on the intermediate transfer base; and transferring a heated/softened resin layer onto a base material by the contact and pressurization of the resin layer.

Abstract: Disclosed is a wiring member comprising a sheet-like porous substrate provided with a large number of open-cells which are three-dimensionally branched and opened to a first major surface as well as to a second major surface of the porous substrate, and a conductive portion formed on the first major surface of the porous substrate and formed at least partially an inter-penetrating structure together with the porous substrate at an interface of the porous substrate. The apertures of the open-cells on the first major surface have an average diameter and an average number of the apertures, at least one of which is smaller than that of the second major surface.

Abstract: An electronic device module comprises a wiring substrate having an insulating substrate with a porous structure including continuous pores and wiring conductors selectively formed in the porous structure; and an electronic device directly connected to said wiring conductors formed in the porous structure.

Abstract: Disclosed is a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulator. The method comprises the steps of forming a photosensitive composition layer containing a compound forming an ion-exchange group upon irradiation with light having a wavelength not shorter than 280 nm within or on the surface of an insulator, exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm, forming an ion-exchange group in the exposed portion, and bonding a metal or metal ions to the ion-exchange group formed in the exposed portion of the photosensitive composition layer.

Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc−No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.