Abstract: An electronic device connecting method according to a first aspect of the present invention includes: mounting an electronic device having at least one electrode portion on a sheet-like porous member having a hole therein so that the electrode portion is close to the porous member; selectively irradiating a predetermined region of the porous member, on which the electronic device is mounted, with energy lines to form a latent image in an irradiated or non-irradiated portion of the porous member, the predetermined region including a portion close to the electrode portion; after irradiating with the energy lines, filling a conductive material in a hole of the latent image of the porous member to form a conductive portion; and bonding and integrating the porous member, in which the conductive portion is formed, to and with the electronic device.

Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc−No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.

Abstract: Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20)} to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.

Abstract: The present invention provides a composite material such as a passive element, a passive element composite component, a substrate with a built-in passive element and a composite wiring substrate which are free from, for example, a layer peeling problem and enables high density packaging with ease. In the present invention, a porous base material is divided into plural functional regions and a material having different electromagnetic characteristics is filled in a pore of the porous base material of each functional region, to form a passive element or a wiring substrate. Among the aforementioned plural functional regions, at least one functional region is a conductive material region filled with a conductive material and other regions are filled with a high-dielectric material, a high-permeability material or a low-dielectric material.

Abstract: A pattern forming material contains a block copolymer or graft copolymer and forms a structure having micro polymer phases, in which, with respect to at least two polymer chains among polymer chains constituting the block copolymer or graft copolymer, the ratio between N/(Nc−No) values of monomer units constituting respective polymer chains is 1.4 or more, where N represents total number of atoms in the monomer unit, Nc represents the number of carbon atoms in the monomer unit, No represents the number of oxygen atoms in the monomer unit.

Abstract: Molded products may be made by a process comprising preparing a structure comprising a block copolymer or a graft copolymer having two or more phases, wherein each phase is comprised of polymer chains, decomposing the polymer chains of at least one phase of the structure, and cleaning the structure with a supercritical fluid or a sub-critical fluid, thereby removing the decomposed polymer chains from the structure. Molded products made by this method have very low levels of residual solvents, can be manufactured at a relatively low temperature in a short period of time without using large amounts of organic solvents, and without discharging large amounts of liquid waste.

Abstract: Disclosed is a method of manufacturing a composite member having a conductive pattern, comprising (1) forming on a surface of an insulating body a photosensitive layer containing both a photosensitive compound forming an ion-exchange group upon irradiation with an energy beam and a crosslinkable compound having a crosslinkable group, (2) forming a pattern of ion-exchange groups by selectively exposing the photosensitive layer to an energy beam so as to form an ion-exchange group in the exposed portion, (3) crosslinking the crosslinkable compound contained in at least the exposed portion of the photosensitive layer, (4) allowing metal ions, or a metal colloid to be adsorbed on the pattern of ion-exchange groups formed by the selectively exposing, and (5) forming a composite member having conductive pattern by depositing a conductive material on the pattern of ion-exchange groups having the metal ions, or the metal colloid adsorbed thereon using an electroless plating.

Abstract: Disclosed is a method for manufacturing a composite member comprising a porous substrate, a via, and a wiring. The method comprises exposing a first region and a second region in the porous substrate to a exposure beam through a mask, the second region exposed by the exposure beam not more than 50% of the exposure of the first region, the exposure beam having the wavelength that an average size of voids of the porous substrate is, as expressed by a radius of gyration, {fraction (1/20)} to 10 times, and forming the via and the wiring by infiltrating a conductive material into the first region and the second region respectively.

Abstract: Disclosed is a three dimensional structure comprising a porous body and a plurality of regions having a substance loaded in the porous body. An average period of a part of the plural regions loaded with the substance is 0.1 to 2 &mgr;m to form a photonic band.

Abstract: A curing catalyst comprising at least one of a cationic curing catalyst component and an organo-metallic compound component. At least one of these components is capable of reversibly repeating the dissolution and precipitation through heating and cooling. The cationic curing catalyst component includes in its molecule at least one substituted or unsubstituted hydrocarbon group having 10 or more carbon atoms, or at least one cyclic organic structure having a substituted or unsubstituted hydrocarbon group having 10 or more carbon atoms.

Abstract: Molded products may be made by a process comprising preparing a structure comprising a block copolymer or a graft copolymer having two or more phases, wherein each phase is comprised of polymer chains, decomposing the polymer chains of at least one phase of the structure, and cleaning the structure with a supercritical fluid or a sub-critical fluid, thereby removing the decomposed polymer chains from the structure. Molded products made by this method have very low levels of residual solvents, can be manufactured at a relatively low temperature in a short period of time without using large amounts of organic solvents, and without discharging large amounts of liquid waste.

Abstract: Disclosed is a method of manufacturing a composite member in which a conductive portion is selectively formed in an insulator. The method comprises the steps of forming a photosensitive composition layer containing a compound forming an ion-exchange group upon irradiation with light having a wavelength not shorter than 280 nm within or on the surface of an insulator, exposing selectively the photosensitive composition layer to light having a wavelength not shorter than 280 nm, forming an ion-exchange group in the exposed portion, and bonding a metal or metal ions to the ion-exchange group formed in the exposed portion of the photosensitive composition layer.

Abstract: A resin composition comprising (a) an epoxy compound, (b) a curing agent comprising a polysiloxane resin having a phenolic hydroxyl group on its side chain, and (c) an inorganic filler. The mixing ratio of the inorganic filler should preferably be 10 to 95% by weight based on the entire resin composition.

Abstract: A polyphenylene sulfide resin composition, which comprises, in addition to a polyphenylene sulfide resin and an inorganic filler, at least one whisker selected from the group consisting of titania whisker and aluminum borate whisker.

Abstract: Disclosed is a resin composition excellent in mechanical and electrical properties. The composition contains an inorganic filler such as fused silica or silicon nitride having the surface covered with a substance resulting from decomposition of a polysilane compound and a base resin such as an epoxy resin or a maleimide resin.