Abstract: Provided is a composition for bonding that forms, after bonding, an adhesive layer that is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test; also provided are an optical adhesive and an adhesive for pressure sensors, both of which comprise the composition. The composition for bonding comprises resin particles. The resin particles have a recovery rate of 20% or less, and a cured product of the composition with a thickness of 250±50 ?m has a moisture permeability of 90 g/m2-24 h or less. An adhesive layer formed from the composition for bonding is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test.

Abstract: Provided is a dimming laminate which can effectively suppress occurrence of color unevenness and light omission. The dimming laminate according to the present invention includes a first transparent base material, a second transparent base material, and a dimming layer disposed between the first transparent base material and the second transparent base material. In this dimming laminate, the dimming layer includes a resin spacer, the resin spacer is a plurality of resin particles, and the resin spacer does not contain resin particles having a particle diameter of 1.4 times or more an average particle diameter of the resin particles or contains 0.0006% or less of the resin particles having a particle diameter of 1.4 times or more the average particle diameter of the resin particles, relative to 100% of the whole number of the resin particles.

Abstract: Provided is a composition for bonding that forms, after bonding, an adhesive layer that is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test; also provided are an optical adhesive and an adhesive for pressure sensors, both of which comprise the composition. The composition for bonding comprises resin particles. The resin particles have a recovery rate of 20% or less, and a cured product of the composition with a thickness of 250±50 ?m has a moisture permeability of 90 g/m2-24 h or less. An adhesive layer formed from the composition for bonding is less likely to undergo shape deformation, and can maintain high adhesion after a reliability test.

Abstract: A conductive noise suppressor for suppressing worsening of noise due to the frequency of conductive common mode noise is suppressed is provided in an embodiment of the disclosure. The suppressor includes a first coil part for detecting a noise current in a common mode flowing through a power supply line for supplying an alternating current, coils serially inserted on the power supply line, a second coil part including a coupling coil magnetically coupled to the coils and a current supplier for supplying a noise current detected by the first coil part and a current set for a voltage generated across the coupling coil to the coupling coil.

Abstract: Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm2 or more and 2000 N/mm2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: Disclosed herein is an air conditioner including: a rectifier including a plurality of capacitors connected in series to each other, a switching device configured to control a flow of current supplied to the respective capacitors to charge or discharge the plurality of capacitors, a voltage detector configured to detect an output voltage of the plurality of capacitors, and a current detector configured to detect the current; and an inverter configured to generate alternating current by receiving an output voltage of the rectifier.

Abstract: Display device includes a flexible substrate, a plurality of pixels disposed on a first surface of flexible substrate, and a plurality of alignment marks disposed along one side of the flexible substrate and identified each other. The plurality of alignment marks may be arranged in the same layer. When the plurality of pixels includes thin film transistor, the plurality of alignment marks may be formed of the same metal layer as the metal layer forming thin film transistor.

Abstract: A virtual image display device includes a virtual image position selector, a vision measurement interface, a display information acquirer, a display image generator, and a projection processor. The virtual image position selector selects either a first virtual image position or a second virtual image position as a display position of the virtual image. The vision measurement interface measures a vision of a user based on a user's response to a vision measurement image projected as a virtual image at the display position. The display information acquirer acquires information to be shown. The display image generator generates a display image showing an image corresponding to the information acquired by the display information acquirer in a size determined by the vision acquired by the vision measurement interface. The projection processor performs a projection process of projecting the display image generated by the display image generator as a virtual image.

Abstract: Provided is a composite particle capable of effectively suppressing the occurrence of color unevenness in a light-modulating material and effectively enhancing the light-modulating performance. The composite particle according to the present invention contains a pigment and has a particle diameter of 10 ?m or more and 100 ?m or less.

Abstract: Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more and 15000 N/mm2 or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: A converter includes a converter circuit including a rectifying section to rectify an alternating current (AC) voltage and a smoothing section to smooth a direct current (DC) voltage rectified by the rectifying section, a diagnostic device configured to diagnose an abnormality of the converter circuit, an inrush current preventing section configured to prevent inrush current from being supplied to the smoothing section, and a switching section configured to supply the AC voltage to the converter circuit through a path different from a voltage supply path of the inrush current preventing section, wherein the diagnostic device determines an abnormal region of the converter circuit by controlling the inrush current preventing section and the switching section.

Abstract: A converter includes a converter circuit including a rectifying section to rectify an alternating current (AC) voltage and a smoothing section to smooth a direct current (DC) voltage rectified by the rectifying section, a diagnostic device configured to diagnose an abnormality of the converter circuit, an inrush current preventing section configured to prevent inrush current from being supplied to the smoothing section, and a switching section configured to supply the AC voltage to the converter circuit through a path different from a voltage supply path of the inrush current preventing section, wherein the diagnostic device determines an abnormal region of the converter circuit by controlling the inrush current preventing section and the switching section.

Abstract: A tube unit includes an inner tube that is elastically deformable and has a tubular shape, and a pressurized space forming portion that forms a pressurized space in contact with an outer peripheral surface of the inner tube between the inner tube and the pressurized space forming portion. The inner tube is operable between a minimum pressure state and a maximum pressure state. The inner tube has a cross-section having a non-circular shape perpendicular to an axial direction in the minimum pressure state. A transport apparatus includes the tube unit and a pressure controller.

Abstract: There is provided a light control laminate in which the gap between base materials can be controlled with high precision. The light control laminate according to the present invention includes a first transparent base material, a second transparent base material, and a light control layer arranged between the first transparent base material and the second transparent base material, and the light control layer contains plural resin spacers.

Abstract: In a case in which a predetermined condition is satisfied, the scan control unit sets a vertical scan speed held when a first region in which a content is present in the display image data is scanned in a vertical direction to a first speed that is lower than a constant speed that is set when a frame scan time required to display one frame is a constant time with the vertical scan speed held constant. The scan control unit sets a vertical scan speed held when a second region in which no content is present in the display image data is scanned in a vertical direction to a second speed that is higher than the constant speed so that the frame scan time is the constant time.

Abstract: Disclosed herein is an air conditioner including: a rectifier including a plurality of capacitors connected in series to each other, a switching device configured to control a flow of current supplied to the respective capacitors to charge or discharge the plurality of capacitors, a voltage detector configured to detect an output voltage of the plurality of capacitors, and a current detector configured to detect the current; and an inverter configured to generate alternating current by receiving an output voltage of the rectifier.

Abstract: Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more and 15000 N/mm2 or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: Provided is an adhesive for semiconductor sensor chip mounting that can reduce detection of noise and can increase heat resistance and thermal cycle resistance characteristics. An adhesive for semiconductor sensor chip mounting according to the present invention is an adhesive used for mounting a semiconductor sensor chip and contains a silicone resin and a spacer, the 10% compressive elasticity modulus of the spacer being 10 N/mm2 or more and 2000 N/mm2 or less, the compression recovery rate of the spacer being 20% or less, and the average particle diameter of the spacer being 10 ?m or more and 200 ?m or less.

Abstract: A conduction noise filtering circuit configured to inhibit conduction noise is provided. The conduction noise filtering circuit includes a first coil part configured to be supplied with alternating current (AC) power, a second coil part configured to be connected to the first coil part in series, a detector configured to detect common mode noise from at least one selected from the first coil part and the second coil part, and a capacitor configured to supply a current offsetting common mode noise between power lines connecting the first coil part and the second coil part in series.

Abstract: Particles that can suppress the occurrence of cracking during a stress load in a connection part that connects two members to be connected are provided. The particles according to the present invention are particles used to obtain a connecting material for forming the connection part that connects two members to be connected, and the particles are used for forming the connection part such that thickness of the connection part after connection exceeds twice the average particle diameter of the particles before connection, or the particles have an average particle diameter of 0.1 ?or more and 15 ?m or loss, the particles have a 10% K value of exceeding 3000 N/mm2 and 20000 K/mm2 or less, and the particles have a particle diameter CV value of 50% or less.