Abstract: The object of the present invention is to provide a method for burning a burner which has NOx reduction effects and has practical value, and a device therefore; the present invention provide A method for burning a burner in a heating furnace including a step of: periodically changing at least one of a flow rate of a fuel fluid and a flow rate of an oxidizing agent fluid which are supplied to the burner while periodically changing an oxygen concentration in the oxidizing agent fluid, thereby an oxygen ratio which is calculated by dividing an amount of oxygen supplied by a theoretical necessary amount of oxygen is periodically changed, and the periodical change of the oxygen ratio is made different from the periodical change of the oxygen concentration to cause combustion in periodically vibrational conditions.

Abstract: A burner for production of inorganic spheroidized particles according to the present invention includes a first raw material supply path (1A) through which a raw material powder is supplied together with a carrier gas; a fuel supply path (4A) disposed around the outer circumference of the first raw material supply path (1A), through which a fuel gas is supplied; a primary oxygen supply path (5A) disposed around the outer circumference of the fuel supply path (4A), through which an oxygen-containing gas is supplied; a second raw material supply path (6A) disposed around the outer circumference of the primary oxygen supply path (5A), through which a raw material powder is supplied together with a carrier gas; and a secondary oxygen supply path (7A) disposed around the outer circumference of the second raw material supply path (6A), through which an oxygen-containing gas is supplied.

Abstract: A method for producing inorganic spheroidized particles according to the present invention includes a step of producing the inorganic spheroidized particles by means of a diffusion type burner (12), wherein the burner (12) comprises a first raw material supply path (1A), a fuel supply path (4A), a raw material diffusion chamber (9), a primary oxygen supply path (5A), a second raw material supply path (6A), a secondary oxygen supply path (7A), and a combustion chamber (8).

Abstract: The present invention provides a method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 ?m to 5 ?m; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove.

Abstract: A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.

Abstract: A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.

Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

Abstract: A metallized aluminum substrate for mounting a semiconductor device such as LD or LED is provided and a metallized aluminum nitride substrate having excellent dimensional accuracy and high bonding strength of a wiring pattern. An intermediate material substrate is provided, comprising a sintered aluminum nitride substrate having on its surface a wiring pattern constituted of a conductor layer composed of a composition containing at least high-melting point metal powder, aluminum nitride powder and a sintering auxiliary agent for aluminum nitride is prepared. Then, the intermediate material substrate is fired while the sintered aluminum nitride obtained by sintering using a sintering auxiliary agent of the same kind as that of the sintering auxiliary agent contained in the composition is placed so as to be brought into contact with the conductor layer on the surface of the intermediate material substrate or so as to be present in the vicinity of the conductor layer.

Abstract: An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

Abstract: The object of the present invention is to provide a method for cutting with gas which uses a cutting tip including a preheating hole for forming a preheating flame with a fuel gas and an oxygen gas for preheating, and an oxygen gas hole for cutting a workpiece by injecting oxygen gas for cutting, and which can decrease an amount of hydrogen gas used by supply a fuel gas to the preheating hole, which is appropriate in both heating and cutting the workpiece, and an apparatus for cutting with gas, and the present invention provides an apparatus for cutting with gas (30) which supplies an oxygen gas, and a fuel gas to a cutting tip (20) including a preheating hole (23) and an oxygen gas hole for cutting (22), wherein the apparatus (30) includes a supply circuit for oxygen gas (50), a supply circuit for hydrogen gas (41), a supply circuit for hydrocarbon-based gas (45), and a gas supply control means (60), and the gas supply control means (60) can alter a ratio of the hydrogen gas and the hydrocarbon-based gas whi

Abstract: A method for producing inorganic spheroidized particles according to the present invention includes a step of producing the inorganic spheroidized particles by means of a diffusion type burner (12), wherein the burner (12) comprises a first raw material supply path (1A), a fuel supply path (4A), a raw material diffusion chamber (9), a primary oxygen supply path (5A), a second raw material supply path (6A), a secondary oxygen supply path (7A), and a combustion chamber (8).

Abstract: A burner for production of inorganic spheroidized particles according to the present invention includes a first raw material supply path (1A) through which a raw material powder is supplied together with a carrier gas; a fuel supply path (4A) disposed around the outer circumference of the first raw material supply path (1A), through which a fuel gas is supplied; a primary oxygen supply path (5A) disposed around the outer circumference of the fuel supply path (4A), through which an oxygen-containing gas is supplied; a second raw material supply path (6A) disposed around the outer circumference of the primary oxygen supply path (5A), through which a raw material powder is supplied together with a carrier gas; and a secondary oxygen supply path (7A) disposed around the outer circumference of the second raw material supply path (6A), through which an oxygen-containing gas is supplied.

Abstract: An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 ?m. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted.

Abstract: An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

Abstract: According to a reception passive intermodulation measurement method of the present invention, a device under test is set to the mismatching condition, and a standing wave is generated on a transmission line where the sample is connected. Since the tip of the transmission line is short-circuited using the sample, the sample is positioned at the anti-node of the standing wave, and test signals are applied at a high current density. System noise is calibrated with the tip of the transmission line being open. Since impedance matching is not required and terminators are not employed, a large measurement dynamic range is obtained without being affected by passive intermodulation that is generated in terminators. The sample is very small, and an arbitrary shape can be selected. The property measurement is enabled for a wide range of materials, regardless of a conductive material, an insulating material and a magnetic material.

Abstract: A ceramic substrate for mounting a light emitting element. The ceramic substrate has a placement surface for placing a light emitting element having an electrode; and an electrode electrically-connected with the electrode of the light emitting element, wherein the ceramic substrate comprises a substrate body consisting of a nitride ceramics; and a coat layer coating at least a part of a surface of the substrate body and consisting of a ceramics different from the nitride ceramics forming the substrate body; and the coat layer has an optical reflectance of 50% or more for any light having a wavelength of from 300 to 800 nm, which can increase a luminance of the light emitting element by reflecting the light emitted from the element efficiently with certainty, and which has a high heat radiation property; and a manufacturing method therefor.

Abstract: An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

Abstract: A fabrication method for metallized a ceramics substrate including the steps of: forming a first conductive paste layer containing metallic powder on a sintered ceramics substrate; forming a second conductive paste layer containing metallic powder of which average particle diameter is different from that of metallic powder constituting the first conductive paste layer; and forming a first conductive layer and a second conductive paste layer. The surface roughness of the first conductive layer and the second conductive layer is different. By this method, it is possible to secure airtightness of the metallized ceramics substrate even if it is a multilayered substrate having a plurality of metallized layers.

Abstract: A burner for production of inorganic spheroidized particles according to the present invention includes a raw material powder supply path that supplies raw material powder by using oxygen or an oxygen-enriched air as a carrier gas; a powder diffusion plate having a plurality of fine holes, which is provided at a downstream end of the raw material powder supply path; a raw material diffusion chamber that is formed in a diffusion pipe provided at a downstream end of the powder diffusion plate; a fuel supply path disposed around the outer circumference of the raw material powder supply path; an oxygen supply path disposed around the outer circumference of the fuel supply path; and a combustion chamber disposed at a downstream side of the raw material diffusion chamber, which has an inside diameter increasing along the downstream direction and communicates with the fuel supply path and the oxygen supply path.

Abstract: A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. In a light-emitting element storing package includes: an insulating substrate consisting of a ceramic board, a reflector frame composed of a ceramic material, joined to the upper surface of the substrate along its outer edge and having an inner wall surface defining a light-reflecting surface, and a wiring pattern layer formed on the upper surface of the substrate for connection with a light-emitting element, a light-emitting element storing concave portion, which is defined by the substrate and the reflector frame, and in which the light-emitting element is mounted on the wiring pattern layer, the reflector frame is mainly composed of nitride ceramics and its light-reflecting surface is composed of white ceramics.