Abstract: A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a reflector frame; a method for manufacturing the above package for housing a light-emitting element which comprises the steps of separately providing a green sheet for the substrate and a green sheet for the frame, causing a paste containing a ceramic powder to be present between the two green sheets to bind them, and subjecting them to degreasing and sintering, to thereby integrate them.

Abstract: A method for manufacturing a substrate chip including the steps of: setting the thickness of at least a part of a metal wiring pattern unit provided on the raw substrate to be 0.1 ?m to 5 ?m; forming a groove for creating at least a crack in the surface of the ceramic substrate along a planned cutting line which passes through the part of the metal wiring pattern unit by using a cutting wheel having a cutter blade being formed into substantially V shape in cross section along the circumferential portion of the disk rotating wheel; and cutting the raw substrate by giving load from just behind of the groove. When manufacturing metallized ceramic substrate chips by cutting (dividing) the ceramic substrate on the surface of which wiring patterns made of a metal film is formed, the method is capable of effectively using the base material, inhibiting defects in the metallized portion, and efficiently manufacturing the substrate chips in high yield.

Abstract: A method for manufacturing metallized aluminum nitride substrate. The method includes: Step A for forming a high-melting point metal layer over a sintered aluminum nitride substrate; Step B for forming over the high-melting point metal layer an intermediate metal layer of at least one selected from the group of: nickel, copper, copper-silver, copper-tin, and gold by plate processing; and Step C for forming a surface metal layer containing silver as a main component over the intermediate metal layer by coating a silver paste whose glass component content is 1 mass % or less and firing under nonoxidizing atmosphere. By this method, it is capable of forming a glass component-free silver layer which is adhered at a high degree of adhesion strength onto the high-melting point metal layer formed over the aluminum nitride substrate as a top face by thick-film method using a silver paste which makes thick-membrane forming easier.

Abstract: A method for manufacturing a ceramic substrate having a via hole(s) and a surface wiring pattern electrically connected to the via hole(s). The method includes: preparing a sintered ceramic substrate having a via hole(s); forming over the sintered ceramic substrate a sintered ceramic layer having a hole(s) or opening(s) whose bottom is configured to be at least a part of an exposed end surface of the via hole(s) by post-firing method; forming inside the hole(s) or opening(s) a conductive portion which electrically connects the surface of the sintered ceramic layer and the via hole(s); and forming over the surface of the sintered ceramic layer a surface wiring pattern electrically connected to the conductive portion.

Abstract: A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity.

Abstract: An insulating material high both in thermal conductivity and light reflectance, and a submount high in heat radiatability for mounting an LED element thereon, capable of raising a light utilization factor and quickly radiating heat generated from the element. For example, used as a substrate material of a submount is a nitride sintered body having a reflectance of light in the wavelength region of from 350 nm to 800 nm of 50% or more and a reflectance of light with a wavelength of 700 nm of 60% or more, obtained by sintering a preform consisting of a composition containing 100 parts by mass of aluminum nitride powder and 0.5 to 10 parts by mass of a compound containing an alkaline earth metal such as 3CaO×Al2O3 in an inert atmosphere containing a specific quantity of carbon vapor, or by burning a coat of a nitride paste applied on a base substrate having a heat resistance at a predetermined temperature.

Abstract: An element-mounting substrate includes a ceramic substrate, an electrode layer formed on the substrate and a ceramic coating layer which is formed on a part of the electrode layer and has a thickness of 5 to 50 ?m. A process for producing the element-mounting substrate includes the steps of forming an electrode precursor layer in the shape of a pattern of an electrode layer on a ceramic plate or a green sheet of a large diameter, forming a ceramic coating precursor layer on a part of the electrode precursor layer and then firing the resulting precursor. In this process, it is preferable to form the ceramic coating layer so as to cover the electrode layer on a predetermined cutting line of the firing product. According to the element-mounting substrate in which a part of the electrode layer is covered with a ceramic, a failure in mounting an element attributable to the thickness of the ceramic coating layer can be prevented when the element is mounted.

Abstract: The process for producing a metallized ceramic substrate of the present invention comprises a step (A) of preparing a raw material substrate comprising a ceramic substrate which may have on its surface a conductive layer or a conductor paste layer, a step (B) of preparing a metallized ceramic substrate precursor, said step (B) comprising a step of forming a ceramic paste layer on the raw material substrate and a step of forming a conductive paste layer on the ceramic paste layer, and a step (C) of firing the metallized ceramic substrate precursor obtained in the previous step. In the step (B), formation of a ceramic paste layer and formation of a conductive paste layer may be alternately repeated plural times. According to the present invention, running or spreading of the conductive paste is prevented, and a metallized ceramic substrate which has a high degree of freedom of wiring design and high reliability and has a fine metallization pattern can be produced.

Abstract: A package for housing a light-emitting element wherein a via hole for wiring provided so as to pass through an insulating substrate is arranged in such a manner that it is positioned under a reflector frame; a method for manufacturing the above package for housing a light-emitting element which comprises the steps of separately providing a green sheet for the substrate and a green sheet for the frame, causing a paste containing a ceramic powder to be present between the two green sheets to bind them, and subjecting them to degreasing and sintering, to thereby integrate them.

Abstract: A metallized aluminum substrate for mounting a semiconductor device such as LD or LED is provided and a metallized aluminum nitride substrate having excellent dimensional accuracy and high bonding strength of a wiring pattern. An intermediate material substrate is provided, comprising a sintered aluminum nitride substrate having on its surface a wiring pattern constituted of a conductor layer composed of a composition containing at least high-melting point metal powder, aluminum nitride powder and a sintering auxiliary agent for aluminum nitride is prepared. Then, the intermediate material substrate is fired while the sintered aluminum nitride obtained by sintering using a sintering auxiliary agent of the same kind as that of the sintering auxiliary agent contained in the composition is placed so as to be brought into contact with the conductor layer on the surface of the intermediate material substrate or so as to be present in the vicinity of the conductor layer.

Abstract: A light-emitting element storing package which ensures the efficient reflection of light emitted by a light-emitting element by a reflector frame and thereby improves the brightness of the emitted light, and a method of manufacturing the same are provided. The light-emitting element storing package includes: an insulating substrate consisting of a ceramic board, a reflector frame composed of a ceramic material, joined to the upper surface of the substrate along its outer edge and having an inner wall surface defining a light-reflecting surface, and a wiring pattern layer formed on the upper surface of the substrate for connection with a light-emitting element, a light-emitting element storing concave portion, which is defined by the substrate and the reflector frame, and in which the light-emitting element is mounted on the wiring pattern layer, the reflector frame is mainly composed of nitride ceramics and its light-reflecting surface is composed of white ceramics.

Abstract: A ceramic substrate for mounting a light emitting element. The ceramic substrate has a placement surface for placing a light emitting element having an electrode; and an electrode electrically-connected with the electrode of the light emitting element, wherein the ceramic substrate comprises a substrate body consisting of a nitride ceramics; and a coat layer coating at least a part of a surface of the substrate body and consisting of a ceramics different from the nitride ceramics forming the substrate body; and the coat layer has an optical reflectance of 50% or more for any light having a wavelength of from 300 to 800 nm, which can increase a luminance of the light emitting element by reflecting the light emitted from the element efficiently with certainty, and which has a high heat radiation property; and a manufacturing method therefor.

Abstract: A plating solution including a copper salt, an organic phosphonic acid compound, and at least one compound or ions selected from an amine, ?-amino acid, ammonium ions, carbonic acid ions, carboxylic acid ions, dicarboxylic acid ions, sulfuric acid ions, and thiosulfuric acid ions and a method of treating the surface of a conductive material using this plating solution.

Abstract: There is disclosed an interface device which can prevent the freezing of an information processing system caused occupation of a system bus even when a wait signal outputted from the PC card is kept asserted. When the wait signal outputted from the PC card, is asserted, a timer portion 201 is activated. When the timer portion 201 detects that the wait signal is kept asserted for more than a predetermined period of time, it asserts a wait mask signal. Upon assertion of the wait mask signal, a mask portion 202 masks the wait signal from the PC card so that the wait signal to the CPU is negated even when the wait signal is kept asserted. Further, when the timer portion 201 asserts the wait mask signal, an interrupt control block/card status register 210 asserts an interrupt signal to the CPU.

Abstract: An entertainment apparatus comprising a peripheral device and a controller for controlling the peripheral device. The peripheral device and the controller are connected each other by an address bus and a data bus. The peripheral device which receives a DMA acknowledge signal from the controller carries out 32-bit DMA transfer using lower 16 bits of the address bus and the data bus, during assertion of the DMA acknowledge signal.

Abstract: An entertainment apparatus is configured to enable a program for an older version of the apparatus to be executed. In a normal mode, a main processing unit (MPU) operates as a main CPU, a graphics processor (GP) operates as a graphics processor, and an input/output subprocessor (IOP) operates as a subprocessor for input and output. In a compatible mode in which a program for an older version of the apparatus is executed, the IOP capable of executing the program for the older version of the apparatus operates as a main CPU, and the MPU and GP emulate a graphics processor for the older version of the apparatus.

Abstract: In a game system such as a television game system, a television game machine main unit includes a protocol controller and each game operation device connected to the television game machine unit via a serial port also has a protocol controller. The television game machine main unit when connected to a game operation device which has a unique identifier, combines a communication protocol that transmits and receives data for each character with a communication protocol which transmits or receives data for two or more characters in a row and switches the communication protocol which corresponds to that game operation device based on the identifier thereof to minimize the amount of information required between the television game machine main unit and the game operation device.

Abstract: Terminals have their elastically deformable contact portions, and main body portions bent in perpendicular directions to the contact portions. The main body portions have lengths set to be effective for filtering to shut out external signals that otherwise might have invaded from electronic circuits on a main substrate, causing noises.

Abstract: A first bus 11 and a second bus 12 are connected through a bus repeater 13 having a buffer memory, and DMA (Direct Memory Access) controllers 22, 27 are respectively connected to the buses 11 and 12. The bus repeater 13 can issue DMA request to the respective DMA controllers 22, 27, and these DMA requests can be masked by respective CPUs 22, 27. The DMA controller 22 carries out DMA transfer of data on the bus 11 between the DMA controller 22 and the buffer memory within the bus repeater 13, and the DMA controller 27 carries out DMA transfer between the buffer memory and the bus 12. The CPU 22 masks DMA request of the bus repeater 13 to directly access the buffer, thereby making it possible to check DMA function. Thus, debugging of the system for carrying out DMA transfer through buffer between different buses is easily carried out.

Abstract: An entertainment apparatus comprising a peripheral device and a controller for controlling the peripheral device. The peripheral device and the controller are connected each other by an address bus and a data bus. The peripheral device which receives a DMA acknowledge signal from the controller carries out 32-bit DMA transfer using lower 16 bits of the address bus and the data bus, during assertion of the DMA acknowledge signal.