Abstract: An all-in-one card connector is comprised of a base, two plate-like members, and a plurality of terminals. The base has an opening formed at a front end thereof, two lateral sections formed respectively at bilateral sides of the opening, a concavity formed at one lateral section, a movable guide member mounted in the concavity for upward and downward movement respectively for blocking a large width card and a small width card, and a springy member mounted between the guide member and the base for generating resilience keeping movement of the guide member. The base is mounted closely between the two plate-like members. Each of the terminals is mounted on the plate-like member and extends into the opening to be electrically connected with contact pads of an inserted electronic card.

Abstract: A structurally sealed heat sink is composed of a main body, at least one sealing member, and at least one solder unit. The main body includes a chamber inside, a capillary layer adhered to a peripheral surface of said chamber, and at least one opening having a predetermined depth to define a peripheral wall of a predetermined height. The sealing member that is identical to the opening in number includes an intersection intersected with the opening for the predetermined depth, a solder ditch formed between the sealing member and the main body, and an annular groove formed between the peripheral wall and an outer periphery of the sealing member. The solder unit that is identical to the opening in number is disposed inside the solder ditch.

Abstract: Lead-wire terminals each are formed of an electroconductive curvy wire. The curvy wire includes a first U-shaped yoke, a second U-shaped yoke, a connecting potion connected between the first and second yokes, and a contact portion extending downwards and then parallel from a distal end of the second yoke, wherein each of the first and second yokes has an opening facing towards the same direction. Accordingly, the two yokes clamp the card connector by the two yokes to be securely positioned on the card connector.

Abstract: An improved card connector is composed of a base having a receiving space at a midsection thereof, an insertion slot at a front end thereof for inserting a memory card inside, and two guide sections recessed therefrom respectively at two sides of the receiving space; a cover member mounted on the base; a plurality of terminals disposed on the base and extend into the receiving space; at least one resilient contact member mounted at a side of the base; and a lateral biasing member mounted at the other side of the base to face the resilient contact member and has a part extending into the receiving space. Accordingly, the inserted memory card can be pushed to touch the resilient contact member to enable the resilient contact member of the card connector to certainly detect the write protection of the memory card.

Abstract: Lead-wire terminals each are formed of an electroconductive curvy wire. The curvy wire includes a first U-shaped yoke, a second U-shaped yoke, a connecting potion connected between the first and second yokes, and a contact portion extending downwards and then parallel from a distal end of the second yoke, wherein each of the first and second yokes has an opening facing towards the same direction. Accordingly, the two yokes clamp the card connector by the two yokes to be securely positioned on the card connector.

Abstract: A card adapter for accommodating a memory card and connecting an external device is composed of a frame member, two cover plates covered on the frame member, an internal frame disposed inside the frame member and having a plurality of terminals, a lateral section and a rear section that both define a reception space together with a front edge and a lateral edge of the frame member, two guide grooves respectively disposed on the lateral edge of the frame member and the lateral section of the internal frame, an adapting circuit board electrically connected with the terminals of the internal frame, and an terminal connector mounted at a rear end of the frame member and is connected with the adapting circuit board. Accordingly, the card adapter of the present invention is structurally simplified and low in production cost.

Abstract: An improved heat-conductive structure includes a heat-conductive plate. The heat-conductive plate has a base plate, two support members extending upwards respectively from bilateral sides of the base plate for a predetermined breadth and height, a channel formed between the base plate and the two support members, two wing portions horizontally extending outwards respectively from the two support members, and a recession formed at a midsection of a bottom side of the base plate. The base plate is relatively thin and of low thermal resistance at the midsection thereof corresponding to the recession to attain effective and rapid heat conduction.

Abstract: A bottom fixation type integrated circuit chip cooling structure device. The device is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between the top and bottom plate member, and connecting members are provided between the top and bottom plate members each having a bottom end passed through a respective through hole in the bottom plate member and a bottom screw hole in the bottom end for mounting. A heat sink is bonded to the top surface of the top plate member, and an internally sintered metal capillary wick is provided within the vapor chamber.

Abstract: An electronic card-ejectable card connector is disclosed to include a base frame, a cover shell, two units of contact pins, and a card ejecting device. The card ejecting device includes a guide member having a guide recess, a positioning bar, and a biasing member. A receiving space is formed between the base frame and the cover shell for accommodating at least two kinds of electronic cards. While an electronic card is inserted into the card connector, the electronic card is stopped in a ready position by the positioning bar held in the guide recess. While ejecting the card, the card is pushed once again to allow the positioning bar to get away from the ready position. Meanwhile, the biasing member provides rebounding resilience to bring the guide member back, thereby pushing the card outwards at a predetermined distance for the user to take it out easily.

Abstract: An electronic card-ejectable card connector is disclosed to include a base frame, a cover shell, two units of contact pins, and a card ejecting device. The card ejecting device includes a guide member having a guide recess, a positioning bar, and a biasing member. A receiving space is formed between the base frame and the cover shell for accommodating at least two kinds of electronic cards. While an electronic card is inserted into the card connector, the electronic card is stopped in a ready position by the positioning bar held in the guide recess. While ejecting the card, the card is pushed once again to allow the positioning bar to get away from the ready position. Meanwhile, the biasing member provides rebounding resilience to bring the guide member back, thereby pushing the card outwards at a predetermined distance for the user to take it out easily.

Abstract: An improved heat sink is composed of a base member, a cover member, at least one capillary layer, a plurality of hollow columns, a plurality of cooling fins, and a predetermined amount of solder. The base member is provided with an external wall extending upwards and outwards from a peripheral fringe thereof. The cover member is provided with a skirt portion extending downwards and outwards from a peripheral fringe thereof. A vapor chamber is formed between the cover member and the base member. The capillary layer, which is mounted in the vapor chamber, includes at least one plate member and a plurality of convex portions and is spaced apart from the skirt portion at a predetermined distance. The hollow columns are connected with the cover member and communicate with the vapor chamber. Each of the hollow columns is fitted with a capillary pipe inside.

Abstract: An improved heat sink is composed of a base member, a cover member, at least one capillary layer, a plurality of hollow columns, a plurality of cooling fins, and a predetermined amount of solder. The base member is provided with an external wall extending upwards and outwards from a peripheral fringe thereof. The cover member is provided with a skirt portion extending downwards and outwards from a peripheral fringe thereof. A vapor chamber is formed between the cover member and the base member. The capillary layer, which is mounted in the vapor chamber, includes at least one plate member and a plurality of convex portions and is spaced apart from the skirt portion at a predetermined distance. The hollow columns are connected with tile cover member and communicate with the vapor chamber. Each of the hollow columns is fitted with a capillary pipe inside.

Abstract: A bottom fixation type integrated circuit chip cooling structure is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between said top and bottom plate member, connecting members provided between the top and bottom plate members each having a bottom end passed through a respective through hole in the bottom plate member and a bottom screw hole in the bottom end for mounting, a heat sink bonded to the top surface of the top plate member, and an internally sintered metal capillary wick provided within the vapor chamber.

Abstract: An integrated circuit chip cooling structure is constructed to include a top plate member and a bottom plate member bonded together and defining a vapor chamber between said top and bottom plate member, the top and bottom plate members each having a plurality of through holes connecting members supported between the top and bottom plate members, each connecting member having a center through hole, a heat sink bonded to the top surface of the top plate member, the heat sink having a plurality of mounting holes for connection to the through hole of each connecting member and respective mounting holes of an external circuit board by respective screw bolts, and an internally sintered metal capillary wick provided within the vapor chamber.

Abstract: A heat dissipating device includes a heat-dissipating fin module disposed in a base frame that is mounted on a circuit board and in heat-conductive contact with an electronic component on the circuit board. A fan module includes parallel positioning members connected to a fan. Each positioning member has a positioning end portion connected to the base frame. An operating member is coupled pivotally to a coupling end portion of each positioning member, and has opposite engaging end portions, and an intermediate pressing portion that is operable so as to rotate the engaging end portions to engage the base frame such that an abutting portion of each positioning member is pulled toward and applies pressure on the fin module, thereby enabling the fin module to contact tightly the electronic component.

Abstract: An engagement securing device includes a support member disposed below a motherboard and having supporting and surrounding portions. The supporting portion is disposed closer to the motherboard than the surrounding portion. A first spacer member is disposed on the supporting portion and abuts against a lower side of the motherboard opposite to a central processing unit mounted on an upper side of the motherboard. Second spacers are disposed on the surrounding portion and abut against the lower side of the motherboard. A plurality of elongate tightening members are extended through tightening holes in the surrounding portion and tightening holes in the motherboard, and tightening holes in the heat sink.

Abstract: A heat dissipating device includes a base unit adapted to contact and to be in thermal communication with a heat-generating source. A plurality of parallel heat-dissipating fin units are provided on the base unit, each of which is spaced apart from each other and includes a mounting portion connected integrally to the base unit, two extensions extending respectively and integrally from opposite sides of the mounting portion, and a plurality of elongated parallel fin plates extending from an upper end of the mounting portion and from upper and lower ends of the extensions along a direction that is perpendicular to a bottom surface of the base unit.

Abstract: A clamping device has an elongated main body which is provided at the longitudinal ends with an insertion portion which is in turn provided with a foot portion. The foot portion is provided with a hooked portion. The clamping device is used to fasten a cooling fan to a cooling device such that the hooked portion catches a retaining hole of one of the cooling fins of the cooling device, and that the insertion portion is removably inserted into one of retaining recesses of the cooling fan.

Abstract: A device is designed to retain a cooling piece. The device comprises a main body provided with a press portion having two elastic portion on both side, on end of each said elastic portion extend downward to form a leg portion with a retaining portion; one leg portion stretches inward and upward to form a hook, and the leg portion has an operation hole located on the upside of the hook.

Abstract: A device is designed to retain a cooling piece of a computer CPU. The device comprises a main body which is provided in two segments thereof with two legs opposite to each other. The legs are provided with a hook extending outwards and upwards, and a retainer of a curved construction. The main body is provided with two winged portions which are located at both ends thereof and provided with a through hole.