Patents by Inventor Yaw-Huey Lai

Yaw-Huey Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6189363
    Abstract: A molding tool is designed to make a cooling device and is formed of a lower mold, a lower mold housing, a punching head, and an urging plate. The lower mold is provided with a plurality of through holes. The lower housing is provided with a molding hole and is fixed on the lower mold such that the molding hole is corresponding in location to the through holes of the lower mold. The punching head is fastened with the bottom of the upper mold seat of a punching machine and is provided with a plurality of cavities and ribbed slots. The urging plate is provided with an opening and is disposed under the upper mold seat of the punching machine such that the punching head is put through the opening. The urging plate is further provided with an insertion slot extending along the edge of the opening.
    Type: Grant
    Filed: October 13, 1999
    Date of Patent: February 20, 2001
    Inventor: Yaw-Huey Lai
  • Patent number: 5509465
    Abstract: A heat-dissipating device for a central processing unit chip includes a plurality of heat-dissipating fins. Each fin has at least one through-hole, a lower edge, and a flange connected perpendicularly to the lower edge. At least one rod member passes through the through-hole of the fins so that the fins can be stacked together and spaced apart from one another by the flanges of the fins, with the lower edges of the fins being co-planar. Two connecting members are connected detachably to the two outermost fins. Two ends of the rod member pass through the connecting members. Each of the connecting members has a clamping portion which clamps onto the lower face of the chip so that the upper face of the chip can abut the lower edges of the fins.
    Type: Grant
    Filed: March 10, 1995
    Date of Patent: April 23, 1996
    Assignee: Bioli Corporation
    Inventor: Yaw-Huey Lai