Abstract: The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: providing a substrate (1) to be packaged, and a package cover plate (2); forming an inorganic protective frame (11) in a round at the edges of the substrate (1); manufacturing an OLED element (12) on the substrate (1) inside the inorganic protective frame (11); pasting a solid glue film (21) on the package cover plate (2); forming an adhesive (22) in a round on the package cover plate (2) corresponding to a location of the inorganic protective frame (11); oppositely attaching the substrate (1) and the package cover plate (2), and the substrate (1) and the package cover plate (2) are affixed together by the solid glue film (21) and the adhesive (22) to accomplish the package to the substrate (1) with the package cover plate (2).

Abstract: A packaging structure includes a substrate; a displaying component positioned on the substrate; a packaging cover plate arranged opposite to and spaced from the substrate; a loop of first enclosing resin arranged between the substrate and the packaging cover plate to enclose the displaying component and bond the substrate and the packaging cover plate together, where the first enclosing resin contains no spacer particle; and a loop of a second enclosing resin formed on an external circumferential area of the first enclosing resin and located between the substrate and the packaging cover plate, where the second enclosing resin is arranged to have a width smaller than a width of the first enclosing resin and contains therein spacer particles that are sized to define a predetermined spacing distance between the substrate and the packaging cover plate.

Abstract: The present invention provides an OLED package method and an OLED package structure. The method comprises steps of: step 1, providing a package cover plate (1), and a substrate (5), and the package cover plate (1) is formed with a spreading location (8) for spreading sealant (2); step 2, manufacturing a seal ring (7 or 7?) on the package cover plate (1) outside the spreading location (8); step 3, spreading the sealant (1) in a round on the spreading location (8) of the package cover plate (1); step 4, oppositely attaching the package cover plate (1) and the substrate (5); step 5, employing an UV light source to irradiate and curing the sealant (2) to accomplish the package to the substrate (5) with the package cover plate (1).

Abstract: The present invention discloses a method for packaging an organic light emitting diode: allocating a position for attaching a glass cloth tape on the packaging substrate; attaching the glass cloth tape on the position; bonding an organic light emitting diode substrate to the packaging substrate; melting the glass cloth tape, so that the organic light emitting diode substrate welds together with the packaging substrate. The present invention can avoid the presence of a welding gap, so that external gas cannot enter into an internal part of the packaging body, thereby increasing the service life of the OLED device.

Abstract: The present invention provides a packaging method of a substrate and a packaging structure. The method includes: (1) providing a substrate and a packaging cover plate; (2) coating a loop of first enclosing resin on the packaging cover plate; (3) coating a loop of second enclosing resin on an external circumferential area of the first enclosing resin on the packaging cover plate; (4) laminating the packaging cover plate and the substrate together; (5) applying ultraviolet (UV) light to irradiate the first enclosing resin and the second enclosing resin for curing; and (6) carrying out cutting operations on the substrate and the packaging cover plate to remove portions of the substrate and the packaging cover plate that contact the second enclosing resin so as to achieve packaging of the substrate with the packaging cover plate.

Abstract: A quantum dot light emitting diodes display is provided. The quantum dot light emitting diodes display comprises a first electrode, a hole injection layer, a hole transmission layer, a quantum dot light emitting layer, an electron transporting layer, and a second electrode. The quantum dot light emitting layer comprises a plurality of pixel units including red sub-pixels, green sub-pixels, and blue sub-pixels. At least one color of the sub-pixels of the pixel units is formed by mixing at least two quantum dots with different peak emission wavelengths corresponding to different colors.

Abstract: A sealant curing system and a method of curing a sealant using the same are disclosed. The sealant curing system includes a curing room and a UV light outputting panel. The curing room is used for receiving a display panel having the sealant which is ready to be cured. The UV light outputting panel is used for displaying a sealant curing image according to a preset displaying data, and is used for producing a UV light. The UV light is used for irradiating and curing the sealant of the display panel. The present invention is capable of eliminating a process in which different masks are replaced for display panels of different sizes.

Abstract: The present invention provides an OLED material vacuum thermal evaporating mask plate, comprising a mask frame (1), a quickset (3) fixed on the mask frame (1) and a mask (5) fixed on the quickset (3); the mask frame (1) comprises four edges, and the four edges surround to form an opening corresponding to the mask (5); each edge of the mask frame (1) comprises a groove (11) dented at the upper surface; the quickset (3) is fixed in the groove (11); the mask (5) is fixed on the quickset (3) by point weld, and welding points (7) are on the quickset (3). When the mask deforms and the replacement is necessary, only the quickset is extracted for polishing or is replaced. The mask frame can be repeatedly used to diminish the waste amount and to raise the availability of the mask frame. Meanwhile, the spare amount of the mask frame can be reduced to save material and production cost.

Abstract: The present invention provides an OLED display substrate and a manufacture method thereof. The OLED display substrate comprises a substrate (10), a TFT (90) located on the substrate (10), a passivation layer (50) located on the TFT (90), a flat layer (60) located on the passivation layer (50), a connecting electrode (80) being located on the flat layer (60) and contacting the TFT (90), an anode (70) being located on the flat layer (60) and covering the connecting electrode (80), an organic emitting layer (71) located on the anode (70) and a cathode (72) located on the organic emitting layer (71); the connecting electrode (80) contacts the TFT (90) via the contact hole (81) penetrating the flat layer (60) and the passivation layer (50); the anode (70) is electrically connected to the TFT (90) via the connecting electrode (80); the short circuit between the cathode and anode of the OLED display substrate can be prevented for avoiding the current concentration and ensuring the normal illumination of the OLED.

Abstract: The present invention provides a flexible OLED display device and a manufacturing method thereof. The OLED display device includes a flexible substrate (1) and a flexible packaging lid (2) opposite to the flexible substrate (1), a TFT layer (3) formed on the flexible substrate (1), an OLED thin-film device (4) formed on the TFT layer (3), a passivation layer (5) formed on the OLED thin-film device (4) and enclosing the OLED thin-film device (4), and an organic packaging film (6) arranged on the side of the flexible packaging lid (2) that is close to the flexible substrate (1) to bond the flexible packaging lid (2) and the flexible substrate (1) to each other. The flexible substrate (1) is one of a thin metal sheet and a sheet of ultra-thin glass and the flexible packaging lid (2) is another one of the thin metal sheet and the ultra-thin glass that is different from the one of the flexible substrate (1).

Abstract: The present invention provides an OLED package method and an OLED package structure. The OLED package method, comprising steps of: step 1, providing a package cover plate (1) and a substrate (2) having an OLED element (21), and a circle of glue coating area (10) is pre-formed on the package cover plate (1); step 2, implementing surface roughening treatment to the glue coating area (10) of the package cover plate (1) to obtain a circle of roughened surface (11); step 3, coating a circle of seal (12) on the roughened surface (11); step 4, coating a liquid dryer layer (13) on the package cover plate (1) at an inner side of the seal (12); step 5, oppositely laminating the package cover plate (1) and the substrate (2) and curing the seal (12) to bond the package cover plate (1) and the substrate (2) for accomplishing the package to the OLED element. The method can significantly promote the bonding force between the package cover plate and the substrate and raise the tightness.

Abstract: The present invention provides a double side OLED display device and a manufacture method thereof. The double side OLED display device comprises a first, a second substrates (11, 21) oppositely located, a first OLED display element (12) located at a side of the first substrate (11) facing the second substrate (21), a second OLED display element (22) located at a side of the second substrate (21) facing the first substrate (11) and a face seal thin film (30), being located between the first, the second substrates (11, 21) and completely covering the first, the second OLED display elements (12, 22); both the first, the second OLED display elements (12, 22) are bottom emitting light type OLED display elements, and the two are oppositely located, and respectively emit light toward the first, the second substrates (11, 21); the face seal thin film (30) bonds the first, the second substrates (11, 21) together, and packages the first, the second OLED display elements (12, 22).

Abstract: The present invention provides a method of packaging OLED (Organic Light-Emitting Diode) and an OLED packaging structure. The surface of a packaging area at a TFT (Thin Film Transistor) substrate is produced into an uneven rough surface. The contacting area between sealant and the TFT substrate is increased. The adhesion between a packaging cover and the TFT substrate is enhanced. A sealing film is disposed inside the OLED packaging structure to cover OLED devices and to fill out the internal area enclosed by the sealant. The sealing of the OLED packaging structure is improved. Oxygen and moisture permeated into the interior OLED is reduced. The performance of OLED devices is improved. The life span of OLED devices is extended.

Abstract: The present invention provides a curved liquid crystal display device, which includes a curved backplane (3), a light guide plate (31) arranged on the curved backplane (3), a mold frame (2) mounted to the curved backplane (3), and a liquid crystal panel (1) bonded to the mold frame (2). The curved backplane (3) is in the form of a shell, which has two opposite inside walls that are respectively provided with a plurality of raised sections (32). The mold frame (2) includes two coupling sections (21) respectively formed at two opposite sides of a top portion thereof and a plurality of recessed grooves (22) formed in two opposite sides of a bottom portion thereof and having openings facing outward. The liquid crystal panel (1) is bonded to the coupling sections (21). The plurality of raised sections (32) are respectively received and retained in the plurality of recessed grooves (22) so as to fix the mold frame (2) to the curved backplane (3).

Abstract: The present invention provides a WOLED display device and a manufacture method thereof. By locating a thickness of a part of the insulative layers correspondingly positioned above the bottom layer wiring in the white sub pixel area is larger than a thickness of other part of the insulative layers in the white sub pixel area to increase a vertical distance from the first electrode to the bottom layer wiring in the white sub pixel area, and meanwhile, by locating the first electrode and the bottom layer wiring in the white sub pixel area to be spaced with a distance in the horizontal direction to make a larger space between the first electrode and the bottom layer wiring, and thus, the bad phenomenon of the short circuit, the overcurrent caused by impurity substance between the first electrode and the bottom layer wiring can be avoided.

Abstract: The present invention provides a knockdown mask and a manufacturing method thereof. The knockdown mask includes a mask frame (1), a plurality of first shielding plates (2), and a plurality of second shielding plates (3). The plurality of first shielding plates (2) and the plurality of second shielding plates (3) intersect each other to form a grid like structure that includes a plurality of film forming holes (4). Thicknesses of the plurality of first shielding plates (2) and the plurality of second shielding plates (3) are identical. The first shielding plates (2) each have first troughs (21) formed therein to extend completely through the width of the first shielding plate (2) at intersections thereof with the second shielding plates (3). The second shielding plates (3) each have second troughs (31) formed therein to extend completely through the width of the second shielding plate (3) at intersections thereof with the first shielding plates (2).

Abstract: Provided is an OLED device packaging method, which includes: providing an OLED substrate that includes an OLED unit formed on surface thereof; attaching an insulation material to the surface of the OLED substrate to form a first frame having frame members located outside and circumferentially surround arranged the OLED unit; providing a packaging cover having a surface; attaching a low-temperature metal conductive adhesive tape directly on the surface of the packaging cover to form a second frame having frame members corresponding to and having a width smaller than the frame members of the first frame; laminating the packaging cover and the OLED substrate together in a vacuum environment with the frame members of first and second frames stacked on each other; and (6) melting the second frame securely bond the packaging cover and the OLED substrate together. Also provided is an OLED device formed with such a packaging method.

Abstract: The present invention provides an OLED device packaging method and an OLED device packaged with the method.

Abstract: The present invention provides a 2D/3D switchable display device, comprising a backlight module (2) and a liquid crystal panel (1) located on the backlight module (2); the liquid crystal panel (1) comprises a plurality of element images (11) sequentially aligned, and the backlight module (2) comprises a plurality of light-emitting elements (21) corresponding to the plurality of element images (11), and each light-emitting element (21) comprises a middle region (211) in a middle position and a surrounding region (212) at periphery of the middle region (211), and the middle regions (211) of the plurality of light-emitting elements (21) respectively correspond to the plurality of element images (11), and the middle region (211) and the surrounding region (212) are respectively controlled by different circuits to be lightened or dimmed; as the middle region (211) and the surrounding region (212) are lightened at the same time, the display device shows a 2D display mode, and as the middle region (211) is lightened

Abstract: The present invention provides an OLED package structure and an OLED packaging method. The OLED package structure includes a substrate (1), a package lid (2) arranged opposite to the substrate (1), an OLED device (11) arranged between the substrate (1) and the package lid (2) and mounted to the substrate (1), and enclosure rein (3) located between the substrate (1) and the package lid (2) and bonding the substrate (1) and the package lid (2) together. The package lid (2) includes a recess (21) formed therein at a location corresponding to the OLED device (11). The recess (21) includes therein a plurality of corrugation projection structures (212) arranged therein and extending outwards from a bottom of the recess (21). Desiccant (211) is attached to the bottom of the recess (21) in an area between two adjacent ones of the corrugation projection structures (212).