Patents by Inventor Ye-Chung Chung

Ye-Chung Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190244906
    Abstract: Semiconductor packages are provided. A semiconductor package includes a substrate including a first bonding region, a chip region, and a second bonding region. Moreover, the substrate includes first and second surfaces that are opposite to each other. The semiconductor package includes a pad group including a pad on the first surface in the chip region. The semiconductor package includes a semiconductor chip on the pad group. The semiconductor package includes a wire connecting the pad and the second bonding region. The wire includes a portion that extends along the second surface of the substrate. Related display devices are also provided.
    Type: Application
    Filed: October 25, 2018
    Publication date: August 8, 2019
    Inventors: Ji Ah MIN, Ye Chung CHUNG
  • Publication number: 20190122943
    Abstract: A display device including a film substrate including first and second surfaces, the first surface being opposite to the second surface; a semiconductor chip disposed on the first surface and including an input terminal and a test terminal, which are arranged in a first direction; a first wire extending from the input terminal on the first surface along a second direction, which intersects the first direction; and a second wire including a first extended portion, which extends along the first surface, a second extended portion, which extends along the second surface, and a first via, which penetrates the film substrate and connects the first extended portion and the second extended portion, wherein the first extended portion extends from the test terminal in the second direction and is connected to the first via, and the second extended portion extends from the first via to an edge of the second surface.
    Type: Application
    Filed: August 29, 2018
    Publication date: April 25, 2019
    Inventors: So Young LIM, Ye Chung CHUNG
  • Patent number: 10163942
    Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: December 25, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ye-chung Chung, Hee-seok Lee, Yun-seok Choi, Keung-beum Kim
  • Publication number: 20180049324
    Abstract: Provided are a semiconductor package and a display device including the same. In some aspects, the semiconductor package may include a film substrate including a base film including cavities and a wiring layer on the base film, a semiconductor chip connected to the wiring layer and mounted on a surface of the base film, and passive devices accommodated in the cavities of the base film and electrically connected to the semiconductor chip through the wiring layer. According to other aspects a base film having at least one recess may be provided. A wiring layer may be on the base film, and a semiconductor chip may be connected to the wiring layer and mounted on a surface of the base film. At least one passive device may be in the at least one recess of the base film and electrically connected to the semiconductor chip via the wiring layer.
    Type: Application
    Filed: March 1, 2017
    Publication date: February 15, 2018
    Inventors: Jung-eun Koo, Ye-chung Chung, Yong-hoon Kim
  • Publication number: 20170092663
    Abstract: According to example embodiments, an image display panel assembly includes a flexible printed circuit (FPC), an image display panel, at least one gate driver integrated circuit (IC) package, and at least one source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The at least one gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and configured to provide the gate driving signal to gate lines of the plurality of pixels.
    Type: Application
    Filed: December 12, 2016
    Publication date: March 30, 2017
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ye-chung CHUNG, Hee-seok LEE, Yun-seok CHOI, Keung-beum KIM
  • Patent number: 9557616
    Abstract: An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: January 31, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ye-Chung Chung, Hee-seok Lee, Yun-Seok Choi, Keung-Beum Kim
  • Patent number: 9129972
    Abstract: Provided is a semiconductor package including a substrate and a semiconductor chip formed on the substrate. The semiconductor chip may include a chip alignment mark on a surface of the semiconductor chip, and wiring patterns formed on a surface of the substrate, wherein the chip alignment mark is bonded to the wiring patterns. Accordingly, the surface area of the semiconductor chip may be reduced.
    Type: Grant
    Filed: July 6, 2009
    Date of Patent: September 8, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young-sang Cho, Dong-han Kim, Dae-woo Son, Ye-chung Chung
  • Patent number: 8222089
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Grant
    Filed: February 23, 2011
    Date of Patent: July 17, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
  • Publication number: 20120138968
    Abstract: Provided are a semiconductor package with a reduced lead pitch, and a display panel assembly having the semiconductor package. The semiconductor package includes a film having a hole formed therein, a plating pattern formed under the film and forming a wire; a semiconductor chip placed in the hole and electrically connected to the plating pattern; and a first passivation layer formed at a side opposite to the semiconductor chip about the plating pattern and protecting the plating pattern.
    Type: Application
    Filed: September 22, 2011
    Publication date: June 7, 2012
    Inventors: Na-Rae Shin, So-Young Lim, Chul-Woo Kim, Ye-Chung Chung
  • Publication number: 20120075268
    Abstract: An image display panel assembly includes a flexible printed circuit (FPC), an image display panel, a gate driver integrated circuit (IC) package, and a source driver IC package. The FPC is configured to receive gate and source driving signals. The image display panel is electrically connected to the FPC, and includes a gate driving signal transfer pattern along a first edge of the image display panel, a source driving signal transfer pattern along a second edge adjacent to the first end, and a plurality of pixels. The gate driver integrated circuit (IC) package is configured to receive the gate driving signal through the gate driving signal transfer pattern and provide the gate driving signal to the plurality of pixels. The source driver IC package is configured to receive the source driving signal through the source driving signal transfer pattern and provide the source driving signal to the plurality of pixels.
    Type: Application
    Filed: September 23, 2011
    Publication date: March 29, 2012
    Inventors: Ye-Chung Chung, Hee-seok Lee, Yun-Seok Choi, Keung-Beum Kim
  • Publication number: 20120021600
    Abstract: A method of fabricating a film circuit substrate and a method of fabricating a chip package. The method of fabricating a film circuit substrate can include providing a base film including a chip packaging area to package a chip and a separation area to separate the two chip packaging areas from each other, the separation area including a cut area and an uncut area; forming a reserve interconnection pattern having a first height on the base film; and forming an interconnection pattern having a second height that is lower than the first height on the out area by selectively etching the reserve interconnection pattern of the cut area.
    Type: Application
    Filed: July 18, 2011
    Publication date: January 26, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang-Uk Han, Dae-Woo Son, Kwan-Jai Lee, Ye-Chung Chung, Jeong-Kyu Ha, Yun-Young Kim
  • Patent number: 7999341
    Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.
    Type: Grant
    Filed: February 17, 2010
    Date of Patent: August 16, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ye-chung Chung, Sa-yoon Kang
  • Publication number: 20110143625
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Application
    Filed: February 23, 2011
    Publication date: June 16, 2011
    Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
  • Patent number: 7915727
    Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.
    Type: Grant
    Filed: April 17, 2009
    Date of Patent: March 29, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-sei Choi, Byung-seo Kim, Young-jae Joo, Ye-chung Chung, Kyong-soon Cho, Sang-heui Lee, Si-hoon Lee, Sa-yoon Kang, Dae-woo Son, Sang-gui Jo, Jeong-kyu Ha, Young-sang Cho
  • Patent number: 7902647
    Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.
    Type: Grant
    Filed: November 30, 2009
    Date of Patent: March 8, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ye-chung Chung, Sa-yoon Kang
  • Publication number: 20100141617
    Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.
    Type: Application
    Filed: February 17, 2010
    Publication date: June 10, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ye-chung CHUNG, Sa-yoon KANG
  • Patent number: 7732933
    Abstract: A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.
    Type: Grant
    Filed: January 9, 2008
    Date of Patent: June 8, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ye-Chung Chung, Dong-Han Kim, Sa-Yoon Kang
  • Publication number: 20100072607
    Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.
    Type: Application
    Filed: November 30, 2009
    Publication date: March 25, 2010
    Inventors: Ye-chung Chung, Sa-yoon Kang
  • Patent number: 7683471
    Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.
    Type: Grant
    Filed: July 18, 2006
    Date of Patent: March 23, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ye-chung Chung, Sa-yoon Kang
  • Patent number: 7652366
    Abstract: Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: January 26, 2010
    Assignee: Samsung Electronics Co. Ltd.
    Inventors: Ye-Chung Chung, Si-Hoon Lee