Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.

Abstract: A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.

Abstract: Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.

Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

Abstract: Provided is a semiconductor package including a substrate and a semiconductor chip formed on the substrate. The semiconductor chip may include a chip alignment mark on a surface of the semiconductor chip, and wiring patterns formed on a surface of the substrate, wherein the chip alignment mark is bonded to the wiring patterns. Accordingly, the surface area of the semiconductor chip may be reduced.

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract: A wiring substrate may include a base film, a plurality of wires, a first insulation member and a second insulation member. The base film may have a chip-mounting region where a semiconductor chip may be mounted thereon. The wires may extend from the chip-mounting region and the wires may include adhesive end portions that may be electrically connected to the semiconductor chip. The first insulation member may cover portions of the wires outside the chip-mounting region thereof. The second insulation member may cover portions of the wire inside the chip-mounting region, the adhesive end portion of the wire being exposed by the second insulation member.

Abstract: Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.

Abstract: Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size.

Abstract: A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

Abstract: The following invention is directed to a tape substrate having a reinforcement layer for tape packages and a method of fabricating the same. In an example embodiment, a tape substrate for tape packages may include a base film, a circuit pattern formed on the base film, and at least one reinforcement layer formed over a surface of the base film. The base film may have sprocket holes formed at regular intervals in the surface of the base film along at least one outer edge of the base film. The at least one reinforcement layer may have guide holes corresponding to the sprocket holes of the base film that are larger than the sprocket holes. The example embodiment may also include at least one reinforcement being set back from the outer edge of the base film.

Abstract: A semiconductor chip, having an active surface including a peripheral area and a central area, presents a connection area formed on a portion of the peripheral area. The semiconductor chip includes output pads formed in the peripheral area of the active surface and input pads formed in the central area of the active surface. The input pads may be connected to wiring patterns of a TAB tape passing over the connection area.

Abstract: A tape package in which a test pad is formed on a reverse surface is provided. The test pad is disposed on a reverse surface of a base film through a through hole of the base film. Accordingly, shapes of the test pads are standardized so that a universal probe card can be used. A pitch between the test pads is wide so that the accuracy in an electric test of the tape package is increased. A total length of the tape package is reduced.

Abstract: The following invention is directed to a tape substrate having a reinforcement layer for tape packages and a method of fabricating the same. In an example embodiment, a tape substrate for tape packages may include a base film, a circuit pattern formed on the base film, and at least one reinforcement layer formed over a surface of the base film. The base film may have sprocket holes formed at regular intervals in the surface of the base film along at least one outer edge of the base film. The at least one reinforcement layer may have guide holes corresponding to the sprocket holes of the base film that are larger than the sprocket holes. The example embodiment may also include at least one reinforcement being set back from the outer edge of the base film.

Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.

Abstract: Provided are a flexible film package module and a method of manufacturing the same that can be adapted for manufacture at lower cost and/or to adapt the characteristics of the flexible film package module for specific applications. The lower-cost flexible film package module includes a tape film that combines both a first insulating substrate, typically formed from a higher-cost polyimide material, and a second insulating substrate, typically formed from an insulating material or materials that are less expensive and/or provide modified performance when compared with the first insulating material. Both the first and second substrates will include complementary circuit patterns that will be electrically and physically connected to allow the composite substrate to function as a unitary substrate. The first and second substrates will also include connection regions that may be adapted for connection to printed circuit boards and/or electronic devices such as liquid crystal displays.

Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.