Patents by Inventor Yen-Chu Chen
Yen-Chu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20240144305Abstract: A method for allocating perishable products based on machine learning, includes using a sales estimation model to evaluate estimated sales of a plurality of perishable products in a predetermined period, using a rating model to calculate a predetermined rate of the plurality of perishable products in the predetermined period according to the estimated sales, using an allocation model to adjust an allocation ratio of the plurality of perishable products in a plurality of marketing channels according to the estimated sales and the predetermined rate if a current rate is lower than the predetermined rate, and determining the numbers of perishable products allocated to the plurality of marketing channels according to the allocation ratio.Type: ApplicationFiled: December 27, 2022Publication date: May 2, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
-
Publication number: 20240139262Abstract: The present disclosure relates to a complex probiotic composition and a method for improving exercise performance of a subject with low intrinsic aerobic exercise capacity. The complex probiotic composition, which includes Lactobacillus rhamnosus GKLC1, Bifidobacterium lactis GKK24 and Clostridium butyricum GKB7, administered to the subject with the low intrinsic aerobic exercise capacity in a continuation period, can effectively reduce serum lactic acid and serum urea nitrogen after aerobic exercise, reduce proportion of offal fat and/or increase liver and muscle glycogen contents, thereby being as an effective ingredient for preparation of various compositions.Type: ApplicationFiled: October 13, 2023Publication date: May 2, 2024Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
-
Publication number: 20240119473Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.Type: ApplicationFiled: December 27, 2022Publication date: April 11, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
-
Patent number: 11944659Abstract: The invention provides a method for improving sarcopenia of a subject in need thereof by using Phellinus linteus, in which the method includes administering an effective dose of composition to the subject, and the composition includes Phellinus linteus (NITE BP-03321 and BCRC 930210) as an effective substance. By using the aforementioned composition including an extract of a fermented product of the Phellinus linteus and/or its derivative, diameters of myotubes, amounts of muscles and muscle muscular endurance can be maintained, thereby improving sarcopenia.Type: GrantFiled: October 12, 2021Date of Patent: April 2, 2024Assignee: GRAPE KING BIO LTDInventors: Chin-Chu Chen, I-Chen Li, Tsung-Ju Li, Ting-Yu Lu, Yen-Po Chen
-
Patent number: 11929260Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: GrantFiled: August 24, 2021Date of Patent: March 12, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Felix Deng, Sai Kumar Kodumuri, Ananthkrishna Jupudi, Nuno Yen-Chu Chen
-
Publication number: 20230394014Abstract: A method for retrieving data on a web page includes performing a simulated user operation on a target web page to generate a result web page, retrieving a source code of the result web page, creating a data table according to the source code, and performing a data cleaning operation with the data table to generate cleaned data and store the cleaned data in a database. Each temporary row of the data table is corresponding to a quotation plan.Type: ApplicationFiled: August 5, 2022Publication date: December 7, 2023Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
-
Patent number: 11610807Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: GrantFiled: April 11, 2021Date of Patent: March 21, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada, Clinton Goh
-
Publication number: 20230061379Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: ApplicationFiled: August 24, 2021Publication date: March 2, 2023Inventors: Fang Jie LIM, Chin Wei TAN, Jun-Liang SU, Felix DENG, Sai Kumar KODUMURI, Ananthkrishna JUPUDI, Nuno Yen-Chu CHEN
-
Patent number: 11569122Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: GrantFiled: March 30, 2021Date of Patent: January 31, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada, Clinton Goh
-
Patent number: 11375584Abstract: Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.Type: GrantFiled: August 20, 2019Date of Patent: June 28, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Tuck Foong Koh, Yueh Sheng Ow, Nuno Yen-Chu Chen, Ananthkrishna Jupudi, Preetham P. Rao
-
Publication number: 20210233802Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: ApplicationFiled: April 11, 2021Publication date: July 29, 2021Inventors: Felix DENG, Yueh Sheng OW, Tuck Foong KOH, Nuno Yen-Chu CHEN, Yuichi WADA, Sree Rangasai V. KESAPRAGADA, Clinton GOH
-
Publication number: 20210217656Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: ApplicationFiled: March 30, 2021Publication date: July 15, 2021Inventors: Felix DENG, Yueh Sheng OW, Tuck Foong KOH, Nuno Yen-Chu CHEN, Yuichi WADA, Sree Rangasai V. KESAPRAGADA, Clinton GOH
-
Patent number: 10991617Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: GrantFiled: May 6, 2019Date of Patent: April 27, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V Kesapragada, Clinton Goh
-
Publication number: 20210059017Abstract: Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.Type: ApplicationFiled: August 20, 2019Publication date: February 25, 2021Inventors: TUCK FOONG KOH, YUEH SHENG OW, NUNO YEN-CHU CHEN, ANANTHKRISHNA JUPUDI, PREETHAM P. RAO
-
Publication number: 20210001520Abstract: Methods and apparatus for curing a substrate or polymer using variable microwave frequency are provided herein. In some embodiments, a method of curing a substrate or polymer using variable microwave frequency includes: contacting a substrate or polymer with a plurality of predetermined discontinuous microwave energy bandwidths or a plurality of predetermined discontinuous microwave energy frequencies to cure the substrate or polymer.Type: ApplicationFiled: July 2, 2020Publication date: January 7, 2021Inventors: Tuck Foong KOH, Chien-Kang HSIUNG, Yueh Sheng OW, Felix DENG, Yue CUI, Nuno Yen-Chu CHEN, Ananthkrishna JUPUDI, Clinton GOH, Vinodh RAMACHANDRAN
-
Publication number: 20200206775Abstract: Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.Type: ApplicationFiled: May 31, 2019Publication date: July 2, 2020Inventors: Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng
-
Publication number: 20190355616Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: ApplicationFiled: May 6, 2019Publication date: November 21, 2019Inventors: FELIX DENG, YUEH SHENG OW, TUCK FOONG KOH, NUNO YEN-CHU CHEN, YUICHI WADA, SREE RANGASAI V KESAPRAGADA, CLINTON GOH
-
Patent number: 9379043Abstract: Disclosed is a TSV structure having insulating layers with embedded voids, including a chip layer, a dielectric liner and a conductive filler. There is at least a via reentrant from one surface of the semiconductor body of the chip layer. A plurality of air-gap cavities are formed on the sidewall of the via where the cavities have a depth-to-width ratio not less than one. The dielectric liner covers the sidewall of the via without filling into the air-gap cavities. The conductive filler is disposed in the via without filling into the air-gap cavities due to the isolation of the dielectric liner so as to form an air insulating layer with a plurality of enclosed voids embedded between the semiconductor body and the dielectric liner. Accordingly, RC Delay of the TSV structure can be improved.Type: GrantFiled: February 10, 2015Date of Patent: June 28, 2016Assignee: POWERTECH TECHNOLOGY INC.Inventors: Ming-Yi Wang, Chao-Shun Chiu, Yen-Chu Chen
-
Patent number: 9162294Abstract: The present invention provides a drilling apparatus and a method thereof capable of providing an adjustable active backup force to a composite workpiece to effectively reduce the delamination of the workpiece during drilling such that the application of the active backup force in terms of its force magnitude and its application location on the workpiece can adjustably counter the drill thrust force to retard the onset of delamination growth and reduce delamination damage at the drill exit in the workpiece, in particular in situation where large feed rate with short cycle time is desired for drilling of composite materials. A critical drill thrust force of the drilling apparatus and the method of the present invention is advantageously obtained in relation to said active backup force and the application of the active backup force to reduce the crack propagation of the delamination occurred in the composite workpiece.Type: GrantFiled: September 14, 2012Date of Patent: October 20, 2015Inventors: Hong Hocheng, Chung-chen Tsao, Yen Chu Chen
-
Patent number: D1007449Type: GrantFiled: May 7, 2021Date of Patent: December 12, 2023Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Kirankumar Neelasandra Savandaiah, Jiao Song, Madan Kumar Shimoga Mylarappa, Yue Cui, Nuno Yen-Chu Chen, Mengxue Wu