Patents by Inventor Yen-Chu Chen
Yen-Chu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250014058Abstract: A hotel demand evaluation method includes setting a plurality of keywords, collecting a plurality of texts according to the plurality of keywords, selecting a plurality of valid texts from the plurality of texts, performing a semantic analysis operation to identify at least one time keyword and at least one location keyword in the plurality of valid texts, generating a classification result according to at least the at least one time keyword and the at least one location keyword, classifying each valid text of the plurality of valid texts into a positive impact group, a no impact group or a negative impact group according to the classification result, and generating a hotel demand score of a specific region according to at least one valid text of the positive impact group and/or at least one valid text of the negative impact group.Type: ApplicationFiled: November 13, 2023Publication date: January 9, 2025Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Patent number: 12048948Abstract: Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.Type: GrantFiled: May 31, 2019Date of Patent: July 30, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng
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Publication number: 20240193629Abstract: A method for predicting operational indicators includes performing a training operation according to first data to train a demand model, inputting second data into the demand model to generate predicted demand data, collecting actual demand data, and performing an adjustment operation according to the predicted demand data and the actual demand data to update the demand model.Type: ApplicationFiled: December 27, 2022Publication date: June 13, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240193628Abstract: A method for feature extraction and data prediction based on pre-training, includes building a first neural network, inputting first processed data to the first neural network to perform a first training operation to generate a first trained neural network, inputting second processed data to the first trained neural network and fixing a first portion of neurons of the first trained neural network to perform a second training operation to generate a second trained neural network, and inputting third processed data to the second trained neural network to generate a predicted result. A first portion of neurons of the second trained neural network is the same as the first portion of neurons of the first trained neural network.Type: ApplicationFiled: December 27, 2022Publication date: June 13, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240144305Abstract: A method for allocating perishable products based on machine learning, includes using a sales estimation model to evaluate estimated sales of a plurality of perishable products in a predetermined period, using a rating model to calculate a predetermined rate of the plurality of perishable products in the predetermined period according to the estimated sales, using an allocation model to adjust an allocation ratio of the plurality of perishable products in a plurality of marketing channels according to the estimated sales and the predetermined rate if a current rate is lower than the predetermined rate, and determining the numbers of perishable products allocated to the plurality of marketing channels according to the allocation ratio.Type: ApplicationFiled: December 27, 2022Publication date: May 2, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Publication number: 20240119473Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.Type: ApplicationFiled: December 27, 2022Publication date: April 11, 2024Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Patent number: 11929260Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: GrantFiled: August 24, 2021Date of Patent: March 12, 2024Assignee: APPLIED MATERIALS, INC.Inventors: Fang Jie Lim, Chin Wei Tan, Jun-Liang Su, Felix Deng, Sai Kumar Kodumuri, Ananthkrishna Jupudi, Nuno Yen-Chu Chen
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Publication number: 20230394014Abstract: A method for retrieving data on a web page includes performing a simulated user operation on a target web page to generate a result web page, retrieving a source code of the result web page, creating a data table according to the source code, and performing a data cleaning operation with the data table to generate cleaned data and store the cleaned data in a database. Each temporary row of the data table is corresponding to a quotation plan.Type: ApplicationFiled: August 5, 2022Publication date: December 7, 2023Applicant: DUN-QIAN Intelligent Technology Co., Ltd.Inventors: Yen-Chu Chen, Ling-Jung Lin, Shao-Chen Liu, Hsuan-Wei Chen, Shuh-Shian Tsai
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Patent number: 11610807Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: GrantFiled: April 11, 2021Date of Patent: March 21, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada, Clinton Goh
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Publication number: 20230061379Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.Type: ApplicationFiled: August 24, 2021Publication date: March 2, 2023Inventors: Fang Jie LIM, Chin Wei TAN, Jun-Liang SU, Felix DENG, Sai Kumar KODUMURI, Ananthkrishna JUPUDI, Nuno Yen-Chu CHEN
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Patent number: 11569122Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: GrantFiled: March 30, 2021Date of Patent: January 31, 2023Assignee: APPLIED MATERIALS, INC.Inventors: Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V. Kesapragada, Clinton Goh
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Patent number: 11375584Abstract: Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.Type: GrantFiled: August 20, 2019Date of Patent: June 28, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Tuck Foong Koh, Yueh Sheng Ow, Nuno Yen-Chu Chen, Ananthkrishna Jupudi, Preetham P. Rao
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Publication number: 20210233802Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: ApplicationFiled: April 11, 2021Publication date: July 29, 2021Inventors: Felix DENG, Yueh Sheng OW, Tuck Foong KOH, Nuno Yen-Chu CHEN, Yuichi WADA, Sree Rangasai V. KESAPRAGADA, Clinton GOH
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Publication number: 20210217656Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: ApplicationFiled: March 30, 2021Publication date: July 15, 2021Inventors: Felix DENG, Yueh Sheng OW, Tuck Foong KOH, Nuno Yen-Chu CHEN, Yuichi WADA, Sree Rangasai V. KESAPRAGADA, Clinton GOH
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Patent number: 10991617Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: GrantFiled: May 6, 2019Date of Patent: April 27, 2021Assignee: APPLIED MATERIALS, INC.Inventors: Felix Deng, Yueh Sheng Ow, Tuck Foong Koh, Nuno Yen-Chu Chen, Yuichi Wada, Sree Rangasai V Kesapragada, Clinton Goh
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Publication number: 20210059017Abstract: Methods and apparatus for processing a substrate are provided herein. The apparatus can include, for example, a microwave energy source configured to provide microwave energy from beneath a substrate support provided in an inner volume of the process chamber; a first microwave reflector positioned on the substrate support above a substrate supporting position of the substrate support; and a second microwave reflector positioned on the substrate support beneath the substrate supporting position, wherein the first microwave reflector and the second microwave reflector are positioned and configured such that microwave energy passes through the second microwave reflector and some of the microwave energy is reflected from a bottom surface of the first microwave reflector back to the substrate during operation.Type: ApplicationFiled: August 20, 2019Publication date: February 25, 2021Inventors: TUCK FOONG KOH, YUEH SHENG OW, NUNO YEN-CHU CHEN, ANANTHKRISHNA JUPUDI, PREETHAM P. RAO
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Publication number: 20210001520Abstract: Methods and apparatus for curing a substrate or polymer using variable microwave frequency are provided herein. In some embodiments, a method of curing a substrate or polymer using variable microwave frequency includes: contacting a substrate or polymer with a plurality of predetermined discontinuous microwave energy bandwidths or a plurality of predetermined discontinuous microwave energy frequencies to cure the substrate or polymer.Type: ApplicationFiled: July 2, 2020Publication date: January 7, 2021Inventors: Tuck Foong KOH, Chien-Kang HSIUNG, Yueh Sheng OW, Felix DENG, Yue CUI, Nuno Yen-Chu CHEN, Ananthkrishna JUPUDI, Clinton GOH, Vinodh RAMACHANDRAN
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Publication number: 20200206775Abstract: Methods of curing a polymer layer on a substrate using variable microwave frequency are provided herein. In some embodiments, methods of curing a polymer layer on a substrate using variable microwave frequency include (a) forming a first thin-film polymer layer on a substrate, the first thin-film polymer layer including at least one first base dielectric material and at least one microwave tunable material, (b) applying a variable frequency microwave energy to the substrate and the first thin-film polymer layer to heat the substrate and the first thin-film polymer layer to a first temperature, and (c) adjusting the variable frequency microwave energy applied to the substrate and the first thin-film polymer layer to tune at least one material property of the first thin-film polymer layer.Type: ApplicationFiled: May 31, 2019Publication date: July 2, 2020Inventors: Yueh Sheng Ow, Yue Cui, Arvind Sundarrajan, Nuno Yen-Chu Chen, Guan Huei See, Felix Deng
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Publication number: 20190355616Abstract: Methods and apparatus for cleaving a substrate in a semiconductor chamber. The semiconductor chamber pressure is adjusted to a process pressure, a substrate is then heated to a nucleation temperature of ions implanted in the substrate, the temperature of the substrate is then adjusted below the nucleation temperature of the ions, and the temperature is maintained until cleaving of the substrate occurs. Microwaves may be used to provide heating of the substrate for the processes. A cleaving sensor may be used for detection of successful cleaving by detecting pressure changes, acoustic emissions, changes within the substrate, and/or residual gases given off by the implanted ions when the cleaving occurs.Type: ApplicationFiled: May 6, 2019Publication date: November 21, 2019Inventors: FELIX DENG, YUEH SHENG OW, TUCK FOONG KOH, NUNO YEN-CHU CHEN, YUICHI WADA, SREE RANGASAI V KESAPRAGADA, CLINTON GOH
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Patent number: D1007449Type: GrantFiled: May 7, 2021Date of Patent: December 12, 2023Assignee: APPLIED MATERIALS, INC.Inventors: David Gunther, Kirankumar Neelasandra Savandaiah, Jiao Song, Madan Kumar Shimoga Mylarappa, Yue Cui, Nuno Yen-Chu Chen, Mengxue Wu