Abstract: A method performed by an 8-TX UE for full power transmissions is provided. The method transmits an IE for reporting capability information. The method receives a PUSCH configuration for configuring the 8-TX UE with a CB PUSCH transmission, a full power mode 1, and one of a partial coherent codebook subset with two antenna groups, a partial coherent codebook subset with four antenna groups, and a non-coherent codebook subset. The method receives DCI including an SRI and an additional TPMI for indicating an 8-port SRS resource. The method then performs the CB PUSCH transmission using the full power mode 1. The IE includes a field indicating support for the full power mode 1 and a field indicating support for one of the partial coherent codebook subset with two antenna groups, the partial coherent codebook subset with four antenna groups, and the non-coherent codebook subset.

Abstract: The present disclosure provides a semiconductor light-emitting device and a semiconductor light-emitting component. The semiconductor light-emitting device includes a substrate, a first semiconductor contact layer, a semiconductor light-emitting stack including an active layer, a first-conductivity-type contact structure, a second semiconductor contact layer, a second-conductivity-type contact structure and a first electrode pad. The first-conductivity-type contact structure is electrically connected to the first semiconductor contact layer. The second-conductivity-type contact structure is electrically connected to the second semiconductor contact layer. The first-conductivity-type contact structure has a first bottom surface and a first top surface, and the active layer has a second bottom surface and a second top surface.

Abstract: A method performed by a User Equipment (UE) for Network Energy Saving (NES) is provided. The method receives, from a Base Station (BS), a Radio Resource Control (RRC) message including a Transmission Configuration Indication (TCI) list. The method stores the TCI list in the UE. The method receives, from the BS, a Downlink Control Information (DCI) format. The method then updates the TCI list stored in the UE based on the DCI format.

Abstract: A method for performing codebook-based Physical Uplink Shared Channel (PUSCH) transmission by a User Equipment (UE) is provided. The method receives a Radio Resource Control (RRC) message including a PUSCH configuration indicating a codebook-based PUSCH transmission. The method receives a Downlink Control Information (DCI) format including a first field and a second field. The first field indicates an 8-port Sounding Reference Signal (SRS) resource. The second field indicates an index associated with a Transmission Precoding Matrix Indicator (TPMI) and the number of transmission layers. The method determines the number of codewords to be one or two based on the number of transmission layers. The method determines a codeword-to-layer mapping for spatial multiplexing based on the number of transmission layers and the number of codewords. The method determines a precoding matrix based on the index and the codeword-to-layer mapping.

Abstract: A method for processing semiconductor wafers includes obtaining measurement data of an edge profile of a semiconductor wafer processed by a front-end process tool. The method includes determining an edge profile center point based on the measurement data, generating a raw height profile, and generating an ideal edge profile. The method further includes generating a Gapi edge profile of the semiconductor wafer based on the raw height profile and the ideal edge profile and calculating a Gapi edge value of the semiconductor wafer based on the Gapi edge profile. The generated Gapi edge profile and/or the calculated Gapi edge value may be used to tune the front-end process tool and/or sort the semiconductor wafer for polishing. Systems include at least a front-end process tool, a flatness measurement tool, and a computing device.

Abstract: A method for processing semiconductor wafers includes obtaining measurement data from a surface of a semiconductor wafer processed by a front-end process tool. The method includes determining a center plane of the wafer based on the measurement data, generating raw shape profiles, and generating ideal shape profiles. The method further includes generating Gapi profiles based on the raw shape profiles and the ideal shape profiles, and calculating a Gapi value of the semiconductor wafer based on the Gapi profiles. The generated Gapi profiles and/or the calculated Gapi value may be used to tune the front-end process tool and/or sort the semiconductor wafer for polishing. Systems include at least a front-end process tool, a flatness measurement tool, and a computing device.

Abstract: A beam shaping lens is disclosed. The beam shaping lens has a base on top side, a left wedge lens on bottom left of the base and a right wedge lens on bottom right of the base. Each of the wedge lens extended downwards from the base has a flat inner surface for light beams to enter and has a total internal reflection (TIR) surface for the light beams to reflect. The reflected light beams exit from a top side of the base to illuminate predetermined feature areas of a user's face especially peripheral areas in addition to the central area so that a face recognition system is able to capture features of a user's face in the feature areas.

Abstract: An electronic device able to show light graphic includes a housing, plural light-transmissive plates stacked inside the housing, plural light sources disposed inside the housing, and a control unit disposed inside the housing. Each of the light-transmissive plates includes a light-incident surface, a light output surface and an optical pattern formed on the light output surface thereof. Projection zones of the light output surfaces to the light-transmissive region are overlapped. The light sources are respectively arranged for emitting lights towards the light-incident surfaces. The control unit is electrically connected to the light sources for controlling at least one of the light sources to emit lights towards the light-incident surface of the corresponding light-transmissive plate, so that the lights form a light graphic by the optical pattern of the corresponding light-transmissive plate, and the light graphic is shown on a light-transmissive region.

Abstract: A light-emitting apparatus includes at least one light-emitting unit and a lens. The lens includes an accommodating portion, and at least a part of the light-emitting unit is disposed to the accommodating portion. The accommodating portion has a light incident surface, and the ratio of a distance from the light incident surface to the light-emitting unit to a side length of the light-emitting unit is less than 0.5. Thereby, a backlight module using the light-emitting diode (LED) as the light source can emit uniform light, and also the number of the required LED can be decreased.

Abstract: A Point-Of-Sale (POS) system bracket includes a bracket housing and two mounts. The bracket housing includes two opposite sidewalls having inner surfaces, outer surfaces each having a substantially convex shape, and a plurality of positioning holes formed at different heights in the sidewalls. The mounts have outer sides for fixing respectively of two displays, and inner sides to be attached to the outer surfaces of the respective sidewalls. A plurality of locking elements extend respectively through a selected group of the positioning holes from the inner surfaces of the sidewalls to fasten the mounts to the respective sidewalls. The locking elements can be changed in position from one group to the other group of the positioning holes, so that the mounts can be positioned at different heights on the respective sidewalls, and the displays can be disposed at different inclination angles.

Abstract: A method for inspecting substrate internal defects is disclosed. The method provides at least one light source disposed on a lateral side of a substrate and configured to emit a light beam to the lateral side for correspondingly penetrating the substrate. The method also provides an image capturing module for retrieving an image of the upper surface, wherein an incident angle of the light beam to the respective lateral side is limited within a first predetermined angle to allow the light beam to have a total reflection in the substrate. Thus, the light beam is blocked by internal defects when transmitting within the substrate to generate bright spots to be detected by the image capturing module for locating the defect position. The method provides a better image definition of internal defects images. The present invention further provides an apparatus based on the method for inspecting substrate internal defects.

Abstract: A light emitting device includes a light emitting module and a complex lens, which is disposed on the light emitting module and includes first to fourth lens portions. A first group of light beams emitted from the light emitting module and outputted from the first lens portion travels through the first lens portion with total internal reflection, a second group of light beams emitted from the light emitting module and outputted from the fourth lens portion travels through the second, third and fourth lens portions with total internal reflection, a third group of light beams emitted from the light emitting module and outputted from the fourth lens portion travels through the third and fourth lens portions with total internal reflection, and a fourth group of light beams emitted from the light emitting module is outputted from the fourth lens portion.