Abstract: A method performed by a User Equipment (UE) for reporting Channel State Information (CSI) is provided. The method receives, from a Base Station (BS), a CSI-Reference Signal (CSI-RS) resource set configuration. The method receives, from the BS, a CSI report configuration including a first resource configuration identifier (ID) corresponding to the CSI-RS resource set configuration, a report content configuration, and multiple port indicators, each of the port indicators corresponding to a CSI measurement result based on a subset of antenna ports. The method receives, from the BS, Downlink Control Information (DCI) for triggering an aperiodic CSI report associated with the CSI report configuration. In response to receiving the DCI, the method transmits, to the BS, a CSI report associated with the CSI report configuration.

Abstract: Methods and apparatuses for Uplink (UL) transmission enhancement are provided. The method includes receiving, from a Base Station (BS), a Radio Resource Control (RRC) message including a Physical Uplink Shared Channel (PUSCH) configuration; receiving, from the BS, a Downlink Control Information (DCI) format including at least one of: a first field that indicates an 8-port Sounding Reference Signal (SRS) resource, a second field that includes an index associated with a precoding matrix transmission, a third field that indicates a first set of parameters for transmitting a first codeword, and a fourth field that indicates a second set of parameters for transmitting a second codeword; determining a precoding matrix based on the DCI format and the PUSCH configuration; and performing a codebook-based PUSCH transmission using the precoding matrix.

Abstract: A method for processing semiconductor wafers includes obtaining measurement data from a surface of a semiconductor wafer processed by a front-end process tool. The method includes determining a center plane of the wafer based on the measurement data, generating raw shape profiles, and generating ideal shape profiles. The method further includes generating Gapi profiles based on the raw shape profiles and the ideal shape profiles, and calculating a Gapi value of the semiconductor wafer based on the Gapi profiles. The generated Gapi profiles and/or the calculated Gapi value may be used to tune the front-end process tool and/or sort the semiconductor wafer for polishing. Systems include at least a front-end process tool, a flatness measurement tool, and a computing device.

Abstract: A method for processing semiconductor wafers includes obtaining measurement data of an edge profile of a semiconductor wafer processed by a front-end process tool. The method includes determining an edge profile center point based on the measurement data, generating a raw height profile, and generating an ideal edge profile. The method further includes generating a Gapi edge profile of the semiconductor wafer based on the raw height profile and the ideal edge profile and calculating a Gapi edge value of the semiconductor wafer based on the Gapi edge profile. The generated Gapi edge profile and/or the calculated Gapi edge value may be used to tune the front-end process tool and/or sort the semiconductor wafer for polishing. Systems include at least a front-end process tool, a flatness measurement tool, and a computing device.

Abstract: A beam shaping lens is disclosed. The beam shaping lens has a base on top side, a left wedge lens on bottom left of the base and a right wedge lens on bottom right of the base. Each of the wedge lens extended downwards from the base has a flat inner surface for light beams to enter and has a total internal reflection (TIR) surface for the light beams to reflect. The reflected light beams exit from a top side of the base to illuminate predetermined feature areas of a user's face especially peripheral areas in addition to the central area so that a face recognition system is able to capture features of a user's face in the feature areas.

Abstract: An electronic device able to show light graphic includes a housing, plural light-transmissive plates stacked inside the housing, plural light sources disposed inside the housing, and a control unit disposed inside the housing. Each of the light-transmissive plates includes a light-incident surface, a light output surface and an optical pattern formed on the light output surface thereof. Projection zones of the light output surfaces to the light-transmissive region are overlapped. The light sources are respectively arranged for emitting lights towards the light-incident surfaces. The control unit is electrically connected to the light sources for controlling at least one of the light sources to emit lights towards the light-incident surface of the corresponding light-transmissive plate, so that the lights form a light graphic by the optical pattern of the corresponding light-transmissive plate, and the light graphic is shown on a light-transmissive region.

Abstract: A light-emitting apparatus includes at least one light-emitting unit and a lens. The lens includes an accommodating portion, and at least a part of the light-emitting unit is disposed to the accommodating portion. The accommodating portion has a light incident surface, and the ratio of a distance from the light incident surface to the light-emitting unit to a side length of the light-emitting unit is less than 0.5. Thereby, a backlight module using the light-emitting diode (LED) as the light source can emit uniform light, and also the number of the required LED can be decreased.

Abstract: A Point-Of-Sale (POS) system bracket includes a bracket housing and two mounts. The bracket housing includes two opposite sidewalls having inner surfaces, outer surfaces each having a substantially convex shape, and a plurality of positioning holes formed at different heights in the sidewalls. The mounts have outer sides for fixing respectively of two displays, and inner sides to be attached to the outer surfaces of the respective sidewalls. A plurality of locking elements extend respectively through a selected group of the positioning holes from the inner surfaces of the sidewalls to fasten the mounts to the respective sidewalls. The locking elements can be changed in position from one group to the other group of the positioning holes, so that the mounts can be positioned at different heights on the respective sidewalls, and the displays can be disposed at different inclination angles.

Abstract: A method for inspecting substrate internal defects is disclosed. The method provides at least one light source disposed on a lateral side of a substrate and configured to emit a light beam to the lateral side for correspondingly penetrating the substrate. The method also provides an image capturing module for retrieving an image of the upper surface, wherein an incident angle of the light beam to the respective lateral side is limited within a first predetermined angle to allow the light beam to have a total reflection in the substrate. Thus, the light beam is blocked by internal defects when transmitting within the substrate to generate bright spots to be detected by the image capturing module for locating the defect position. The method provides a better image definition of internal defects images. The present invention further provides an apparatus based on the method for inspecting substrate internal defects.

Abstract: A light emitting device includes a light emitting module and a complex lens, which is disposed on the light emitting module and includes first to fourth lens portions. A first group of light beams emitted from the light emitting module and outputted from the first lens portion travels through the first lens portion with total internal reflection, a second group of light beams emitted from the light emitting module and outputted from the fourth lens portion travels through the second, third and fourth lens portions with total internal reflection, a third group of light beams emitted from the light emitting module and outputted from the fourth lens portion travels through the third and fourth lens portions with total internal reflection, and a fourth group of light beams emitted from the light emitting module is outputted from the fourth lens portion.

Abstract: An omnidirectional LED lamp is designed with a complex lens covering a light source. The light source is a light emitted diode chip or a light emitted diode lamp or package. The complex lens is composed of a top center lens, a wing lens, and a tube lens. The top center lens modifies the light beams to shed lights above the lamp, the wing lens surrounds and connects with the top center lens to modify the light beams to shed lights on side bottom of the lamp, and the tube lens is configured under the wind lens and connects to the wing lens to modify the light beams to shed lights on side top of the lamp. The complex lens modifies light beams from a light source to shed light on full directions.

Abstract: A Point-Of-Sale (POS) system bracket includes a bracket housing and two mounts. The bracket housing includes two opposite sidewalls having inner surfaces, outer surfaces each having a substantially convex shape, and a plurality of positioning holes formed at different heights in the sidewalls. The mounts have outer sides for fixing respectively of two displays, and inner sides to be attached to the outer surfaces of the respective sidewalls. A plurality of locking elements extend respectively through a selected group of the positioning holes from the inner surfaces of the sidewalls to fasten the mounts to the respective sidewalls. The locking elements can be changed in position from one group to the other group of the positioning holes, so that the mounts can be positioned at different heights on the respective sidewalls, and the displays can be disposed at different inclination angles.