Patents by Inventor Yen Fu

Yen Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11174253
    Abstract: Disclosed are compounds of formula (I) below and pharmaceutically acceptable salts thereof: Formula (I), in which each of variables L, R3, R4, Y, Z1, Z2 and Z3 is defined herein. Also disclosed is a method for treating a cancer with a compound of formula (I) or a salt thereof and a pharmaceutical composition containing same.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: November 16, 2021
    Assignee: ALPHALA CO., LTD.
    Inventors: Cheng-Ho Chung, Shi-Liang Tseng, Yen-Fu Chen, Jian-Bin Lee
  • Publication number: 20210330648
    Abstract: Disclosed is a pharmaceutical composition comprising: an active ingredient of the following formula (I) or a pharmaceutically acceptable salt or solvate thereof present in an amount of 8 wt % to 30 wt %: and two or more excipients at least including a dispersant and a solubilizer present in an amount of 70 wt % to 92 wt %. Also disclosed are methods for reducing the glycemic level and treating disorders associated with glucagon with the aforesaid pharmaceutical composition.
    Type: Application
    Filed: July 2, 2021
    Publication date: October 28, 2021
    Inventors: Chi-Jen HONG, Yen-Fu CHEN, Cheng-Ho CHUNG
  • Publication number: 20210242172
    Abstract: A semiconductor package includes a semiconductor die, an encapsulant, a first and second dielectric layer, a through via, an extension pad, and a routing via. The semiconductor die includes a contact post. The first dielectric layer extends on the encapsulant. The through via extends through the first dielectric layer and has one end contacting the contact post. The extension pad is disposed on the first dielectric layer, contacting an opposite end of the through via with respect to the contact post. The extension pad has an elongated shape, a first end of the extension pad overlaps with the contact post and the through via, and a second end of the extension pad overlaps with the encapsulant. The second dielectric layer is disposed on the first dielectric layer and the extension pad. The routing via extends through the second dielectric layer to contact the second end of the extension pad.
    Type: Application
    Filed: February 2, 2021
    Publication date: August 5, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tsung-Ding Wang, Yen-Fu Su, Hao-Cheng Hou, Jung-Wei Cheng, Chien-Hsun Lee, Hsin-Yu Pan
  • Patent number: 11079356
    Abstract: An ultrasonic sensing apparatus includes an accommodating shell and at least one detection device. The accommodating shell includes a base and a convex portion connected to the base. A side of the base has a first detection opening toward a first direction, and a side of the convex portion has a second detection opening toward a second direction. Each of the at least one detection device is disposed in the base or the convex portion of the accommodating shell and includes a board, a piezoelectric assembly, a housing and a plurality of fixing members. The plurality of fixing members are configured to fix the board on the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the piezoelectric sheet to the bottom wall.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: August 3, 2021
    Assignee: Qian Jun Technology Ltd.
    Inventors: Yu-Yen Fu, Po-Chun Yeh, Dong-Fu Chen
  • Patent number: 11042808
    Abstract: Predicting probable activity consequences is provided. Information is collected from data sources to identify various activities. Patterns of how any identified activity is linked with a corresponding event are detected based on analyzing the information. The patterns are indexed with data having a relationship to a particular event. Activity context information associated with a set of identified activities corresponding to the particular event is extracted from the information. A cognitive model of how the set of identified activities corresponding to the particular event are related to a set of activity consequences is generated. Probable activity consequences with degree of severity corresponding to the activity context information is predicted based on the cognitive model. A recommendation to perform a set of action steps to reduce impact of the probable activity consequences on different aspects of the activity context information associated with the set of identified activities is generated.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: June 22, 2021
    Assignee: International Business Machines Corporation
    Inventors: James E. Bostick, Danny Yen-Fu Chen, Sarbajit K. Rakshit, Keith R. Walker
  • Patent number: 11004812
    Abstract: A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: May 11, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tuan-Yu Hung, Hung-Jui Kuo, Hsin-Yu Pan, Ming-che Ho, Tzu Yun Huang, Yen-Fu Su
  • Publication number: 20210126101
    Abstract: A semiconductor device a method of forming the same are provided. The method includes forming a fin extending from a substrate and forming a gate dielectric layer along a top surface and sidewalls of the fin. A first thickness of the gate dielectric layer along the top surface of the fin is greater than a second thickness of the gate dielectric layer along the sidewalls of the fin.
    Type: Application
    Filed: September 11, 2020
    Publication date: April 29, 2021
    Inventors: Kuei-Lun Lin, Yen-Fu Chen, Po-Ting Lin, Chia-Yuan Chang, Xiong-Fei Yu, Chi On Chui
  • Patent number: 10882837
    Abstract: Disclosed are compounds of formula (I) below and pharmaceutically acceptable salts thereof, in which each of variables R1, R2, L, and Z is defined herein. Also disclosed are methods for reducing the glycemic level and treating glucagon-associated disorders with a compound of formula (I) or a salt thereof and a pharmaceutical composition containing same.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: January 5, 2021
    Assignee: ALPHALA CO., LTD.
    Inventors: Cheng-Ho Chung, Shi-Liang Tseng, Yung-Ning Yang, Yen-Fu Chen
  • Publication number: 20200400740
    Abstract: A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.
    Type: Application
    Filed: June 3, 2020
    Publication date: December 24, 2020
    Applicant: MPI Corporation
    Inventors: Kang-Yen Fu, Ya-Hung Lo, Shou-Jen Tsai, Wei-Cheng Ku
  • Publication number: 20200395529
    Abstract: An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a bottom wall, a top wall and a surrounding side wall connected between the top wall and the bottom wall. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet, wherein at least a portion of the piezoelectric sheet is enclosed by the encapsulating body and has a sensing surface exposed to the encapsulating body and facing the bottom wall. The board is disposed on the top wall of the housing and has a pressing surface facing the encapsulating body and the top wall. The plurality of fixing members is configured to fix the board to the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.
    Type: Application
    Filed: February 20, 2020
    Publication date: December 17, 2020
    Inventors: Chi-Shen Lee, Yu-Yen Fu, Po-Chun Yeh, Dong-Fu Chen, Chih-Wen Cheng, Chi-Lin Huang, Yu-Ping Yen
  • Publication number: 20200393292
    Abstract: An ultrasonic sensing device includes a housing, a piezoelectric assembly, a board and a plurality of fixing members. The housing includes a connecting board being a metal board and a supporting shell being a plastic member. The supporting shell includes a bottom wall opposite to a disposing opening of the connecting board and a surrounding side wall integrally surrounding and connecting to the bottom wall. The surrounding side wall encloses a portion of the connecting board. The piezoelectric assembly includes an encapsulating body and a piezoelectric sheet enclosed by the encapsulating body. The encapsulating body is disposed on the bottom wall and surrounded by the surrounding side wall. The piezoelectric sheet has a sensing surface exposed to the encapsulating body and facing the bottom wall. The fixing members fix the board on the connecting board, thereby pressing the sensing surface of the piezoelectric sheet to the bottom wall.
    Type: Application
    Filed: April 14, 2020
    Publication date: December 17, 2020
    Inventors: Yu-Yen Fu, Po-Chun Yeh, Dong-Fu Chen
  • Publication number: 20200393413
    Abstract: An ultrasonic sensing apparatus includes an accommodating shell and at least one detection device. The accommodating shell includes a base and a convex portion connected to the base. A side of the base has a first detection opening toward a first direction, and a side of the convex portion has a second detection opening toward a second direction. Each of the at least one detection device is disposed in the base or the convex portion of the accommodating shell and includes a board, a piezoelectric assembly, a housing and a plurality of fixing members. The plurality of fixing members are configured to fix the board on the top wall of the housing to press the board to the encapsulating body of the piezoelectric assembly, thereby pressing the piezoelectric sheet to the bottom wall.
    Type: Application
    Filed: April 14, 2020
    Publication date: December 17, 2020
    Inventors: Yu-Yen Fu, Po-Chun Yeh, Dong-Fu Chen
  • Patent number: 10852950
    Abstract: A computer system, operated on a system platform, includes memories and a controller circuit. The memories include a first memory and a second memory, in which the first memory include s a first storage space and a second storage space, and a size of a total storage space of the second memory is the same as a size of the first storage space. The memories are coupled in parallel with the controller circuit, and the controller circuit assigns at least one first data zone to the first storage space and the second memory based on a kernel of the system platform, and assigns a second data zone to the second storage space. A data access frequency of the second data zone is lower than a data access frequency of the at least one first data zone.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: December 1, 2020
    Assignee: REALTEK SEMICONDUCTOR CORPORATION
    Inventors: Yi-Cheng Chen, Yen-Fu Lai, Kun-Wei Wang
  • Publication number: 20200319514
    Abstract: A backlight apparatus includes a circuit board, a control board, and a connection cable connecting the above components. A first light source driver and a second light source driver are disposed on the circuit board and are electrically connected to a plurality of first light sources and a plurality of second light sources respectively. A connector is disposed on the circuit board. The first and second light source drivers are individually electrically coupled in series to the connector. The control board outputs electrical power, a first data stream, and a second data stream. The first light source driver controls the first light sources to light individually according to the first data stream. The second light source driver controls the second light sources to light individually according to the second data stream. Thereby, the circuit board can control the operation of the light sources individually.
    Type: Application
    Filed: June 23, 2020
    Publication date: October 8, 2020
    Inventors: Ming-Yen Wu, Yen-Fu Chou, Wen-Jui Chiang
  • Patent number: 10739639
    Abstract: A backlight apparatus includes a circuit board, a control board, and a connection cable connecting the above components. A first light source driver and a second light source driver are disposed on the circuit board and are electrically connected to a plurality of first light sources and a plurality of second light sources respectively. A connector is disposed on the circuit board. The first and second light source drivers are individually electrically coupled in series to the connector. The control board outputs electrical power, a first data stream, and a second data stream. The first light source driver controls the plurality of first light sources to light individually according to the first data stream. The second light source driver controls the plurality of second light sources to light individually according to the second data stream. Thereby, the circuit board can control the operation of the light sources individually.
    Type: Grant
    Filed: January 7, 2019
    Date of Patent: August 11, 2020
    Assignee: DARFON ELECTRONICS CORP.
    Inventors: Ming-Yen Wu, Yen-Fu Chou, Wen-Jui Chiang
  • Publication number: 20200172531
    Abstract: Disclosed are compounds of formula (I) below and pharmaceutically acceptable salts thereof: Formula (I), in which each of variables L, R3, R4, Y, Z1, Z2 and Z3 is defined herein. Also disclosed is a method for treating a cancer with a compound of formula (I) or a salt thereof and a pharmaceutical composition containing same.
    Type: Application
    Filed: August 1, 2018
    Publication date: June 4, 2020
    Inventors: Cheng-Ho CHUNG, Shi-Liang TSENG, Yen-Fu CHEN, Jian-Bin LEE
  • Publication number: 20200167073
    Abstract: A computer system, operated on a system platform, includes memories and a controller circuit. The memories include a first memory and a second memory, in which the first memory include s a first storage space and a second storage space, and a size of a total storage space of the second memory is the same as a size of the first storage space. The memories are coupled in parallel with the controller circuit, and the controller circuit assigns at least one first data zone to the first storage space and the second memory based on a kernel of the system platform, and assigns a second data zone to the second storage space. A data access frequency of the second data zone is lower than a data access frequency of the at least one first data zone.
    Type: Application
    Filed: May 28, 2019
    Publication date: May 28, 2020
    Inventors: Yi-Cheng CHEN, Yen-Fu LAI, Kun-Wei WANG
  • Patent number: 10628627
    Abstract: An embodiment of a thermal estimation device including a temperature model generator, a temperature gradient calculator, and a thermal sensing analyzer is disclosed. The temperature model generator generates a temperature model based on an initial power consumption, an initial area and an initial coordination of a circuit module. The temperature gradient calculator substitutes at least one of a testing area, a testing power or a testing coordinate of the circuit module into the temperature model for correspondingly estimating an temperature estimation function. The thermal sensing analyzer differentiates the temperature estimation function. When an absolute value of a differential result of the temperature estimation function resulted from a constant is closest to zero or is zero, outputting the constant as an optimized parameter.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: April 21, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Yeong-Jar Chang, Ya-Ting Shyu, Juin-Ming Lu, Yao-Hua Chen, Yen-Fu Chang, Jai-Ming Lin
  • Publication number: 20200101122
    Abstract: The present invention provides a method for treating a method for treating an auditory neuropathy spectrum disorder in a subject comprising transferring a transgene via an adeno-associated virus (AAV) vector to the subject; wherein the transgene is selected from the group consisting of Pjvk, PCDH15, GJB2, DIAPH3, PCDH9, SLC17A8, AIFM1, AND OTOF.
    Type: Application
    Filed: September 27, 2019
    Publication date: April 2, 2020
    Inventors: Yen-Fu CHENG, Chen-Chi WU, Ying-Chang LU
  • Publication number: 20200091097
    Abstract: A package structure is provided. The package structure includes a dielectric layer on a die, a RDL structure and a conductive terminal. The RDL structure comprises a redistribution layer in and on the dielectric layer. The redistribution layer comprises a via and a conductive plate. The via is located in and penetrating through the dielectric layer to be connected to the die. The conductive plate is on the via and the dielectric layer, and is connected to the die through the via. The conductive terminal is electrically connected to the die through the RDL structure. The via is ring-shaped.
    Type: Application
    Filed: September 18, 2018
    Publication date: March 19, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tuan-Yu Hung, Hung-Jui Kuo, Hsin-Yu Pan, Ming-che Ho, Tzu Yun Huang, Yen-Fu Su