Abstract: A reticle, a reticle container and a method for discharging static charges accumulated on a reticle are provided. The reticle includes a mask substrate, a reflective multilayer (ML) structure, a capping layer, an absorption structure and a conductive material structure. The mask substrate has a front-side surface and a back-side surface. The reflective ML structure is positioned over the front-side surface of mask substrate. The capping layer is positioned over the reflective ML structure. The absorption structure is positioned over the capping layer. The conductive material structure is positioned over a sidewall surface of the mask substrate and a sidewall surface of the absorption structure.

Abstract: A system is disclosed. The system includes a cleaning device and a scanner device. The cleaning device is configured to clean a mask. The scanner device is coupled to the cleaning device and is configured to receive the mask, a reference image and a real-time image that is captured at the mask. The reference image includes at least one first mark image having a plurality of mapping marks on the mask. The real-time image includes at least one second mark image having the plurality of mapping marks on the mask. The scanner device is configured to map the at least one second mark image in the real-time image with the at least one first image in the reference image, when a lithography exposing process is performed. A method is also disclosed herein.

Abstract: Provided is a real-time detector of a Bragg peak, comprising: an emitter configured to emit a particle beam toward a target region in a first direction, thereby creating emission of electromagnetic radiation in the target region; a first detection module comprising a stack of first scintillators and first photosensors respectively connected to the first scintillators and configured to detect the electromagnetic radiation and convert into a first signal; a second detection module comprising a stack of second scintillators and second photosensors respectively connected to the second scintillators and configured to detect the electromagnetic radiation and convert into a second signal; and a coincidence detection circuit configured to determine an end point of the particle beam with respect to the first direction based on the first signal and the second signal.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: In a power supply having a control circuit for regulating the power supply output and a load switch for connecting the output to a load device, a method for reducing standby power includes determining if a load device is connected to the power supply. If no load device is connected, the load switch is turned off, and the power supply enters a standby mode, which includes alternating first time period of power-saving mode and second time period of regulating mode. In the power-saving mode, the control circuit stops regulating the output of the power supply and turns off one or more functional blocks to allow the output to drop, until the output reaches a pre-set low output limit. In the regulating mode, the control circuit turns on the functional blocks and regulates the power supply to allow the output to increase, until the output reaches a pre-set high output limit.

Abstract: A method of operating a radiation imaging system includes applying a bias voltage to a top electrode, receiving ionization radiation, wherein the ionization radiation penetrates an electrical insulation layer and generate a charge signal, storing the charge signal in a storage capacitor among a plurality of storage capacitors, changing a polarity of a gate line bias voltage of one row of transistors among a plurality of transistors, and integrating charges from storage capacitors connected to each other along orthogonal data lines.

Abstract: A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.

Abstract: A continuous process for producing a surface-metalized polymer article, comprising: (a) continuously immersing a polymer article into a graphene dispersion comprising multiple graphene sheets dispersed in a liquid medium for a period of immersion time and then retreating the polymer article from the dispersion, enabling deposition of graphene sheets onto a surface of the polymer article to form a graphene-attached polymer article; (b) continuously moving the graphene-attached polymer article into a drying or heating zone to enable bonding of graphene sheets to said surface to form a graphene-covered polymer article; and (c) continuously moving the graphene-covered polymer article into a metallization zone where a layer of a metal is chemically, physically, electrochemically or electrolytically deposited onto a surface of the graphene-covered polymer article to form the surface-metalized polymer article. Step (a) may be preceded by a surface treatment of the polymer article.

Abstract: A reagent for performing a chemiluminescent reaction includes luminol or luminol derivatives, an oxidant, an electron mediator, and an enhancer. The enhancer is a nitrogen-containing fused heterocyclic compound having at least two nitrogen atoms. The present disclosure further provides a kit for performing a chemiluminescent reaction comprising the aforesaid reagent.

Abstract: A reticle holding tool is provided. The reticle holding tool includes a housing including a top housing member and a lateral housing member. The lateral housing member extends from the top housing member and terminates at a lower edge. The reticle holding tool further includes a reticle chuck. The reticle chuck is positioned in the housing and configured to secure a reticle. The reticle holding tool also includes a gas delivery assembly. The gas delivery assembly is positioned within the housing and configured to supply gas into the housing.

Abstract: A method of operating a radiation imaging system includes applying a bias voltage to a top electrode, receiving ionization radiation, wherein the ionization radiation penetrates an electrical insulation layer and generate a charge signal, storing the charge signal in a storage capacitor among a plurality of storage capacitors, changing a polarity of a gate line bias voltage of one row of transistors among a plurality of transistors, and integrating charges from storage capacitors connected to each other along orthogonal data lines.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: A radiation imaging system includes a radiation-emitting device and a radiation imaging device. The radiation imaging device has an electrical insulation layer having a top surface and a bottom surface, a top electrode on the top surface of the electrical insulation layer, an array of pixel units electrically coupled to the electrical insulation layer, and an array of transistors connected to the array of pixel units.

Abstract: A packaging device including a first semiconductor device, a thermal dissipating component, an encapsulation layer, a via, and a pad. The first semiconductor device includes a substrate, an active region, and an electrode. The active region is disposed between the substrate and the electrode. The substrate has a first surface opposite to the active region, and the electrode has a second surface opposite to the active region. The thermal dissipating component is disposed on the first surface of the substrate. The encapsulation layer encloses the second surface of the electrode and a part of the thermal dissipating component, such that another part of the thermal dissipating component is exposed by the encapsulation layer. The pad is disposed on the encapsulation layer. The via is disposed in the encapsulation layer and connects the pad to the electrode.

Abstract: A method includes the following operations. A reference image of a mask having a plurality of mapping marks is acquired. A lithography exposing process is performed by a scanner with the mask to a photoresist layer which is formed on a substrate. Performing the lithography exposing process includes mapping a real-time image of the mask with the reference image of the mask.

Abstract: An embodiment of a semiconductor package includes a leadframe and a mold compound partly encasing the leadframe so that leads protrude from the mold compound and at least two die pads have a surface at a first side of the leadframe which is not covered by the mold compound. A laser module is attached to the surface of the at least two die pads which is not covered by the mold compound. A driver die is attached to the leadframe at a second side of the leadframe opposite the first side so that the laser module and the driver die are disposed in a stacked arrangement, the driver die configured to control the laser module. The driver die is in direct electrical communication with the laser module only through the leadframe and any interconnects which attach the laser module and driver die to the leadframe.

Abstract: A method includes the following operations. A reference image of a mask having a plurality of mapping marks is acquired. A lithography exposing process is performed by a scanner with the mask to a photoresist layer which is formed on a substrate. Performing the lithography exposing process includes mapping a real-time image of the mask with the reference image of the mask.

Abstract: A memory management method, a memory control circuit unit and a memory storage device are provided. The method includes recording use information according to each physical erasing unit of a rewritable non-volatile memory module. The method also includes configuring a plurality of super physical units. An address offset value corresponding to a first unavailable physical programming unit of a first physical erasing unit in a first super physical unit is the same as an address offset value corresponding to a first available physical programming unit of a second physical erasing unit in the first super physical unit.

Abstract: The present disclosure relates to a sub-assembly for a medicament delivery device, comprising: a cap having a tubular body provided with a distal opening, the cap being configured to be mounted to a proximal end of a medicament delivery device, and a tubular remover configured to be received in the distal opening of the cap, the remover having a proximal end portion configured to be fixedly attached to the cap, a housing, an internal structure arranged inside the housing and provided with a proximal inclined surface, and wherein the remover has a plurality of radially flexible legs extending longitudinally from a proximal end of the remover to a distal end thereof, each leg having a gripper configured to engage with a delivery member shield of a medicament delivery device, and each leg having a guide finger configured to extend distally beyond the grippers for cooperating with an internal structure of a medicament delivery device to guide radial expansion of the legs when the remover is mounted in a medicamen

Abstract: The present disclosure relates to a cap assembly for a medicament delivery device, having a cap containing a tubular body provided with a distal opening, the cap being configured to be mounted to a proximal end of a medicament delivery device, a tubular remover configured to be received in the distal opening of the cap, the remover having flexible radially inwards extending grippers configured to engage with a delivery member shield, and a tubular remover insert configured to be received by the remover and configured to be fixedly attached to the cap to prevent axial displacement of the remover insert relative to the cap, wherein the remover is axially displaceable relative to the cap and relative to the remover insert, from a first position in which the grippers are pressed radially outwards by an outer surface of the remover insert, to a second position located distally relative to the first position, in which second position the grippers are arranged distally beyond the outer surface of the remover insert,