Abstract: A multi-chip device includes a first material within a substrate. The first material has a first coefficient of thermal expansion different than a second coefficient of thermal expansion of the substrate. A first chip overlies a first portion of the first material and a first portion of the substrate. A second chip overlies a second portion of the first material and a second portion of the substrate. The first material is between the first portion of the substrate and the second portion of the substrate.

Abstract: A method for predicting and compensating frictions of a feed system includes following steps: constantly obtaining current signals and angle-position signals of a motor by a motor driver of a feed system after being activated; calculating frictions of the motor upon each rotating position according to the obtained current signals and angle-position signals and generating multiple records of friction data; creating a friction model according to the multiple records of friction data and the angle-position signals each respectively corresponding to each record of friction data with respect to each rotating position; importing current angle-position signal of the motor to the friction model for predicting a predicted friction; calculating a compensation current based on the predicted friction; and, controlling the motor driver to additionally provide the compensation current to the motor for conquering an upcoming friction of the feed system approximate to the predicted friction.

Abstract: A package structure including an organic interposer substrate, a semiconductor die, conductive bumps, an underfill, and an insulating encapsulation is provided. The organic interposer substrate includes stacked organic dielectric layers and conductive wirings embedded in the stacked organic dielectric layers. The semiconductor die is disposed over and electrically connected to the conductive wirings of the organic interposer substrate, and the semiconductor die includes chamfered edges. The conductive bumps are disposed between the semiconductor die and the organic interposer substrate, and the semiconductor die is electrically connected to the organic interposer substrate through the conductive bumps. The underfill is disposed between the semiconductor die and the organic interposer substrate, wherein the underfill encapsulates the conductive bumps and is in contact with the chamfered edges of the at least one semiconductor die.

Abstract: A millimeter wave radar apparatus determining a fall posture is applied to a human body. The millimeter wave radar apparatus includes a microprocessor and a millimeter wave radar. The millimeter wave radar is electrically connected to the microprocessor. The millimeter wave radar is configured to transmit a radar wave to the human body. The millimeter wave radar is configured to receive a reflected radar wave reflected from the human body based on the radar wave. The microprocessor is configured to obtain a point cloud information based on the reflected radar wave. The microprocessor is configured to utilize the point cloud information to determine whether the human body is in the fall posture.

Abstract: Structures and formation methods of a chip package structure are provided. The chip package structure includes a semiconductor die bonded over an interposer substrate. The chip package structure also includes a warpage release layer structure. The warpage release layer structure includes an organic material layer and an overlying high coefficient of thermal expansion (CTE) material layer with a CTE that is substantially equal to or greater than 9 ppm/° C. The organic material layer is in direct contact with the upper surface of the semiconductor die, and the overlying high CTE material layer covers the upper surface of the semiconductor die.

Abstract: A package structure is provided. The package structure includes a redistribution structure and a first semiconductor die over the redistribution structure. The package structure also includes a wall structure laterally surrounding the first semiconductor die and the wall structure includes a plurality of partitions separated from one another. The package structure also includes an underfill material between the wall structure and the first semiconductor die. The package structure also includes a molding compound encapsulating the wall structure and the underfill material.

Abstract: A support structure for a medicament container is disclosed that is arranged to accommodate an elongated plunger rod, where the support structure has at least one flexible element arranged to be moved in contact with, and to exert a force, on a distal end surface of the medicament container, wherein the at least one flexible element is provided with a contact member arranged to contact an outer surface of the plunger rod and to be moved out of contact with the plunger rod when moved in contact with the medicament container.

Abstract: A semiconductor package structure includes a first electronic component, a conductive element and a first redistribution structure. The first electronic component has a first surface and a second surface opposite to the first surface, and includes a first conductive via. The first conductive via has a first surface exposed from the first surface of the first electronic component. The conductive element is disposed adjacent to the first electronic component. The conductive element has a first surface substantially coplanar with the first surface of the first conductive via of the first electronic component. The first redistribution structure is configured to electrically connect the first conductive via of the first electronic component and the conductive element.

Abstract: An instrument panel including a potentially large display panel which can be recessed away from mis-operations includes mounting surface and air outlet assembly. The display panel is mounted on the mounting surface. The air outlet assembly includes air intake and outlet. The air intake can connect to an air conditioning system. The air outlet is disposed on the mounting surface, and contains the display terminal. A size of the display assembly is freely adjustable, and the structure of the instrument panel reduces a risk of mis-operating the display terminal while driving. Heat generated by the display terminal can be taken away by the air outlet for increasing a lifetime of the display terminal. A vehicle with the instrument panel is also provided.

Abstract: An embodiment of a semiconductor package includes a leadframe having leads, a mold compound partly encasing the leadframe so that the leads protrude from the mold compound, a power transistor die attached to the leadframe at a first side of the leadframe, and a driver die attached to the leadframe at a second side of the leadframe opposite the first side so that the power transistor die and the driver die are disposed in a stacked arrangement. The driver die is configured to control the power transistor die. The driver die is in direct electrical communication with the power transistor die only through the leadframe and any interconnects which attach the power transistor die and the driver die to the leadframe. Corresponding methods of manufacturing the semiconductor package are also described.

Abstract: An anti-theft door lock assembly includes a main locking unit. The main locking unit has a main lock set, a lock tongue disposed inside the main lock set and having one end thereof to protrude out of the main lock set, a pushed member disposed inside the main lock set and connected with another end of the lock tongue, a connection link disposed inside the main lock set and connected with the pushed member, an action member disposed at one end of the main lock set, and a depression rocker arm furnished to the main lock set and connected with the connection link.

Abstract: A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package at least has a semiconductor die and a redistribution layer disposed on an active surface of the semiconductor die and electrically connected with the semiconductor die. The redistribution layer has a wiring-free zone arranged at a location below a corner of the semiconductor die. An underfill is disposed between the semiconductor die and the redistribution layer. The wiring-free zone is located below the underfill and is in contact with the underfill. The wiring-free zone extends horizontally from the semiconductor die to the underfill.

Abstract: Integrated circuit (IC) devices include a metal-insulator-metal (MIM) capacitor having a top electrode plate, a bottom electrode plate, and a plurality of intermediate electrode plates between the top electrode plate and the bottom electrode plate. A plurality of dielectric layers may separate each of the electrode plates of the MIM capacitor from adjacent plates of the MIM capacitor. Each of the intermediate electrode plates may have a thickness that is greater than a thickness of the top electrode plate and the bottom electrode plate. By providing multiple intermediate electrode plates between the top and bottom electrode plates of the MIM capacitor, and allocating the greatest plate thicknesses to the intermediate plates, the capacitance density may be increased in a given area of the IC device, which may provide increased performance for the IC device.

Abstract: A package structure including an organic interposer substrate, a semiconductor die, conductive bumps, an underfill, and an insulating encapsulation is provided. The organic interposer substrate includes stacked organic dielectric layers and conductive wirings embedded in the stacked organic dielectric layers. The semiconductor die is disposed over and electrically connected to the conductive wirings of the organic interposer substrate, and the semiconductor die includes chamfered edges. The conductive bumps are disposed between the semiconductor die and the organic interposer substrate, and the semiconductor die is electrically connected to the organic interposer substrate through the conductive bumps. The underfill is disposed between the semiconductor die and the organic interposer substrate, wherein the underfill encapsulates the conductive bumps and is in contact with the chamfered edges of the at least one semiconductor die.

Abstract: A reticle, a reticle container and a method of lithography process are provided. The reticle container includes: a cover configured to protect a reticle, a baseplate, and a discharging device on the baseplate. The baseplate has: a top surface configured to engage to the cover and a bottom surface opposite to the top surface. The discharging device is configured to neutralize static charges accumulated on the reticle.

Abstract: Disclosed are power machines and systems configured to provide autonomous or augmented control of the machines in a localized positioning environment in which GPS navigation is not available. Also disclosed are methods of providing augmented control of a power machine in such an environment.

Abstract: Described herein are transcriptional relay systems useful for reducing background signal in protein expression and reporter assays. These systems utilize a nucleic acid system wherein a promoter sequence controls expression of a synthetic transcription factor that activates transcription of a reporter molecule.

Abstract: Described herein are methods and systems useful for interrogating protein-protein interactions. These systems utilize non-functional fragments of polypeptides that can complement each other to form a fully functional fragment in vivo. The fully functional polypeptide releases a transcription regulating polypeptide that can bind and activate or repress a reporter element.

Abstract: Provided is a surface-metalized polymer article comprising a polymer component having a surface, a first layer of multiple functionalized graphene sheets having a first chemical functional group, multiple functionalized carbon nanotubes having a second chemical group functional group, or a combination of both, which are coated on the polymer component surface, and a second layer of a plated metal deposited on the first layer, wherein the multiple functionalized graphene sheets contain single-layer or few-layer graphene sheets and/or the multiple functionalized carbon nanotubes contain single-walled or multiwalled carbon nanotubes, and wherein the multiple functionalized graphene sheets or functionalized carbon nanotubes are bonded to the polymer component surface with or without an adhesive resin.

Abstract: A method includes forming a package component comprising forming a dielectric layer, patterning the dielectric layer to form an opening, and forming a redistribution line including a via in the opening, a conductive pad, and a bent trace. The via is vertically offset from the conductive pad. The conductive pad and the bent trace are over the dielectric layer. The bent trace connects the conductive pad to the via, and the bent trace includes a plurality of sections with lengthwise directions un-parallel to each other. A conductive bump is formed on the conductive pad.