Abstract: An electronic apparatus, a voltage detector, and a voltage detection method thereof are provided. The voltage detector includes a rectifying and filtering circuit, a comparison circuit, and a detection signal generator. The rectifying and filtering circuit receives an alternating current input voltage and performs a rectifying and filtering operation on the alternating current input voltage to generate a processed voltage. The comparison circuit compares the processed voltage with a reference voltage to generate a comparison signal. The detection signal generator has a first side and a second side. The first side receives the comparison signal and generates an induction signal according to the comparison signal. The second side receives the indication signal to generate a detection signal. The first side and the second side are isolated.

Abstract: An electronic apparatus, a voltage detector, and a voltage detection method thereof are provided. The voltage detector includes a rectifying and filtering circuit, a comparison circuit, and a detection signal generator. The rectifying and filtering circuit receives an alternating current input voltage and performs a rectifying and filtering operation on the alternating current input voltage to generate a processed voltage. The comparison circuit compares the processed voltage with a reference voltage to generate a comparison signal. The detection signal generator has a first side and a second side. The first side receives the comparison signal and generates an induction signal according to the comparison signal. The second side receives the indication signal to generate a detection signal. The first side and the second side are isolated.

Abstract: An overlay error measurement structure includes a lower-layer pattern disposed over a substrate, and an upper-layer pattern disposed over the lower-layer pattern and at least partially overlapping with the lower-layer pattern. The lower-layer pattern includes a plurality of first sub-patterns extending in a first direction and being arranged in a second direction crossing the first direction. The upper-layer pattern includes a plurality of second sub-patterns extending in the first direction and being arranged in the second direction. At least one of a pattern pitch and a pattern width of at least one of at least a part of the first sub-patterns and at least a part of the second sub-patterns varies along the second direction.

Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A plurality of raw images of the semiconductor wafer are obtained according to GDS information regarding a layout of a target die, by an inspection apparatus. A first image-based comparison is performed on the raw images, so as to provide a comparison result, by a determining circuitry. The comparison result indicates whether an image difference is present between the images. One of the raw images having the image difference is assigned as a defect image. A second image-based comparison is performed on a reference image and the defect image, so as to classify a defect type of the image difference, by the determining circuitry. The layout of the target die includes a circuit with a duplicate layout formed by a plurality of same cells. The number of the plurality of raw images is greater than 2.

Abstract: An envelope tracking supply modulator includes an amplifier circuit and a zero peaking circuit. The amplifier circuit receives an envelope input, generates a modulated supply voltage according to the envelope input, and provides the modulated supply voltage to a power amplifier. The zero peaking circuit is coupled to the amplifier circuit, and applies zero peaking to the amplifier circuit, where the zero peaking inserts a zero at a frequency.

Abstract: A cloud information service integration system is provided. A client side uses a computer or a handheld smart communication device to install and prosecute a corresponding application software and then link to a network system of a cloud server for operation of a client side setting step, a service side setting step, a matching step, a search condition adjustment step, a selection step, and a payment step. In the matching step, a matching list is provided to the client side through active matching and manual matching. In the payment step, the client side pays an amount of money to a bank account of the service side or a third party payment account via the network system of the cloud server.

Abstract: An overlay error measurement structure includes a lower-layer pattern disposed over a substrate, and an upper-layer pattern disposed over the lower-layer pattern and at least partially overlapping with the lower-layer pattern. The lower-layer pattern includes a plurality of first sub-patterns extending in a first direction and being arranged in a second direction crossing the first direction. The upper-layer pattern includes a plurality of second sub-patterns extending in the first direction and being arranged in the second direction. At least one of a pattern pitch and a pattern width of at least one of at least a part of the first sub-patterns and at least a part of the second sub-patterns varies along the second direction.

Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A first raw image, a second raw image, and a third raw image of the semiconductor wafer are obtained by an inspection apparatus according to graphic data system (GDS) information regarding layout of a target die. A first image-based comparison is performed by a determining circuitry on the first, second, and third raw images, so as to provide a comparison result. The comparison result indicates whether an image difference is present between the first, second, and third raw images.

Abstract: A backlight module includes a light guide plate having an upper surface, a lower surface, and light-adjusting structures on the lower surface; an optical sheet disposed opposite to the upper surface of the light guide plate; and a light source disposed adjacent to the light guide plate, wherein a light emitted by the light source has a first brightness distribution in a first direction after passing through the light guide plate, and the first brightness distribution has a first maximum brightness corresponding to a first angle and a second maximum brightness corresponding to a second angle, and an absolute value of the first angle and an absolute value of the second angle are greater than 60 degrees, respectively, wherein an absolute value of a difference between the first maximum brightness and the second maximum brightness is less than or equal to 30% of the first maximum brightness.

Abstract: A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.

Abstract: A polish head of a chemical mechanical polishing system is provided. The polish head includes a carrier head, a membrane mounted to the carrier head, an inner retaining ring mounted to the carrier head and surrounding the membrane, an outer retaining ring mounted to the carrier head and surrounding the inner retaining ring, and an image capturing device. The outer retaining ring is spaced apart from the inner retaining ring. The image capturing device is mounted to the carrier head and between the inner retaining ring and the outer retaining ring.

Abstract: A method includes forming a first overlay feature in a first dielectric layer over a first wafer; forming a second dielectric layer over the first overlay feature and the first dielectric layer; forming an opening in the second dielectric layer by at least using an exposure tool; forming a second overlay feature in the opening of the second dielectric layer, such that a first edge of the first overlay feature is covered by the second dielectric layer; directing an electron beam to the first and second overlay features and the second dielectric layer; detecting the electron beam reflected from the first overlay feature through the second dielectric layer and from the second overlay feature by a detector; obtaining, by a controller, an overlay error between the first overlay feature and the second overlay feature according to the reflected electron beam electrically connected to the detector.

Abstract: In a method for identifying a robot arm responsible for creating a scratch on a wafer, at least one scratch mark on a wafer is detected. A first scratch dimension of the at least one scratch mark is determined. The determined first scratch dimension is compared to a plurality of first robot arm dimensions to generate a plurality of first comparing results, wherein the first comparing results respectively correspond to a plurality of robot arms. One of the robot arms is identified based on the first comparing results.

Abstract: A display device including a backlight module is provided. The backlight module includes: a substrate, a backlight cavity, a plurality of light emitting elements, and an optical adjustment layer. The backlight cavity is located on the substrate. The plurality of light emitting elements is disposed in the backlight cavity. The optical adjustment layer covers the plurality of light emitting elements and fills the remaining space of the backlight cavity. The optical adjustment layer has a refractive index n greater than the refractive index n0 of the air.

Abstract: A display device and a method for manufacturing the same are disclosed. The display device includes a backlight module, a display panel, and a decorative film. The backlight module includes: a reflective layer disposed on the decorative film; a light guide plate disposed on the reflective layer, a set of optical films including a first diffusion layer, and at least one refractive layer. The light guide plate has a first surface facing the reflective layer and a second surface opposite to the first surface, and the first diffusion layer is disposed on the second surface. At least one refractive layer is disposed on at least one of the first surface and the second surface, wherein a refractive index of the refractive layer is between 1.15 and 1.45. The display panel is disposed on one side of the set of optical films far away from the light guide plate.

Abstract: A display device is disclosed, which includes a display panel and a backlight module. The backlight module is disposed corresponding to the display panel, and includes a light guide plate, at least one light emitting unit, a reflector and a first pattern. The light guide plate has a central region and an outer region, and the outer region is disposed around the central region. The at least one light emitting unit is disposed adjacent to the light guide plate. At least a part of the reflector is disposed corresponding to a bottom surface of the light guide plate. The first pattern is disposed corresponding to the outer region, and the reflector and the light guide plate are adhered via the first pattern.

Abstract: Methods and systems for diagnosing a semiconductor wafer are provided. A first raw image, a second raw image, and a third raw image of the semiconductor wafer are obtained by an inspection apparatus according to graphic data system (GDS) information regarding layout of a target die. A first image-based comparison is performed by a determining circuitry on the first, second, and third raw images, so as to provide a comparison result. The comparison result indicates whether an image difference is present between the first, second, and third raw images.

Abstract: An overlay error measurement structure includes a lower-layer pattern disposed over a substrate, and an upper-layer pattern disposed over the lower-layer pattern and at least partially overlapping with the lower-layer pattern. The lower-layer pattern includes a plurality of first sub-patterns extending in a first direction and being arranged in a second direction crossing the first direction. The upper-layer pattern includes a plurality of second sub-patterns extending in the first direction and being arranged in the second direction. At least one of a pattern pitch and a pattern width of at least one of at least a part of the first sub-patterns and at least a part of the second sub-patterns varies along the second direction.

Abstract: A method for performing DBO measurements utilizing apertures having a single pole includes using a first aperture plate to measure X-axis diffraction of a composite grating. In some embodiments, the first aperture plate has a first pair of radiation-transmitting regions disposed along a first diametrical axis and on opposite sides of an optical axis that is aligned with a center of the first aperture plate. Thereafter, in some embodiments, a second aperture plate, which is complementary to the first aperture plate, is used to measure Y-axis diffraction of the composite grating. By way of example, the second aperture plate has a second pair of radiation-transmitting regions disposed along a second diametrical axis and on opposite sides of the optical axis. In some cases, the second diametrical axis is substantially perpendicular to the first diametrical axis.

Abstract: A display device is provided. The display device includes a backlight module and a display panel. The backlight module includes a light guiding plate, a first light source component and a reflection component. The light guiding plate has a first side, a second side, a third side and a fourth side, wherein the first side is disposed opposite to the third side, and the second side is disposed opposite to the fourth side. The first light source component is disposed adjacent to the first side of the light guiding plate. The reflection component is disposed opposite to the light guiding plate. The first light source component is attached to the light guiding plate or the reflection component. The light guiding plate is disposed between the display panel and the reflection component.