Patents by Inventor Yen-Ru LEE

Yen-Ru LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    Publication number: 20130082309
    Abstract: A method for fabricating a semiconductor device is disclosed. A strained material is formed in a cavity of a substrate and adjacent to an isolation structure in the substrate. The strained material has a corner above the surface of the substrate. The disclosed method provides an improved method for forming the strained material adjacent to the isolation structure with an increased portion in the cavity of the substrate to enhance carrier mobility and upgrade the device performance. The improved formation method is achieved by providing a treatment to redistribute at least a portion of the corner in the cavity.
    Type: Application
    Filed: October 4, 2011
    Publication date: April 4, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Lilly SU, Pang-Yen TSAI, Tze-Liang LEE, Chii-Horng LI, Yen-Ru LEE, Ming-Hua YU
  • SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
    Publication number: 20130084682
    Abstract: A method for fabricating a semiconductor device is disclosed. A strained material is formed in a cavity of a substrate and adjacent to an isolation structure in the substrate. The strained material has a corner above the surface of the substrate. The disclosed method provides an improved method for forming the strained material adjacent to the isolation structure with an increased portion in the cavity of a substrate to enhance carrier mobility and upgrade the device performance. In an embodiment, the improved formation method is achieved using an etching process to redistribute the strained material by removing at least a portion of the corner to be located in the cavity.
    Type: Application
    Filed: September 29, 2011
    Publication date: April 4, 2013
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Ru LEE, Ming-Hua YU, Tze-Liang LEE, Chii-Horng LI, Pang-Yen TSAI, Lilly SU, Yi-Hung LIN, Yu-Hung CHENG