Patents by Inventor Yen-Seine Wang

Yen-Seine Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160369043
    Abstract: Amino benzoates have been found to be useful curing agents for epoxy resins particularly para amino benzoates containing at least two primary amine groups and at least two carboxyl moieties, the amino benzoates are particularly useful as curatives in prepregs.
    Type: Application
    Filed: February 6, 2015
    Publication date: December 22, 2016
    Inventors: Chris Mason, Martin Simmons, Yen-Seine Wang
  • Publication number: 20160362528
    Abstract: Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafunctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl) oxyphenyl] 4-aminobenzoate (3-ABOAB), as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.
    Type: Application
    Filed: August 4, 2016
    Publication date: December 15, 2016
    Inventors: Yen-Seine Wang, Chris Mason, Martin Simmons
  • Patent number: 9200125
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high compression strength under hot and wet conditions, as well as, high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes polyamide particles which are composed of the polymeric condensation product of a methyl derivative of bis(4-aminocyclohexyl)methane and an aliphatic dicarboxylic acid.
    Type: Grant
    Filed: August 26, 2012
    Date of Patent: December 1, 2015
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Maureen Boyle
  • Patent number: 9187636
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes a mixture of polyamide 12 particles and polyamide 11 particles.
    Type: Grant
    Filed: February 13, 2014
    Date of Patent: November 17, 2015
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Maureen Boyle
  • Publication number: 20150252182
    Abstract: Uncured epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising difunctional epoxy resin, trifunctional epoxy resin and/or tetrafuctional epoxy resin and a sufficient amount of [3-(4-aminobenzoyl)oxyphenyl]4-aminobenzoate (3-ABOAB, as a curing agent, such that the uncured resin can be stored at room temperature of at least 6 weeks and wherein the uncured resin can be fully cured in no more than 2 hours at a temperature of between 175° C. and 185° C.
    Type: Application
    Filed: March 7, 2014
    Publication date: September 10, 2015
    Applicant: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Patent number: 9068040
    Abstract: Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4?-Bis(p-aminophenoxy) biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: June 30, 2015
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Patent number: 9034975
    Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend of insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: May 19, 2015
    Assignees: Hexcel Corporation, Hexcel Composites Limited
    Inventors: Maureen Boyle, Dana Blair, Yi-Jui Wu, Yen-Seine Wang, Bryce Floryancic, Paul Mackenzie
  • Publication number: 20140163139
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes a mixture of polyamide 12 particles and polyamide 11 particles.
    Type: Application
    Filed: February 13, 2014
    Publication date: June 12, 2014
    Applicant: Hexcel Corporation
    Inventors: Yen-Seine Wang, Maureen Boyle
  • Patent number: 8686069
    Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: April 1, 2014
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20140058013
    Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured/molded to form composite parts having high compression strength under hot and wet conditions, as well as, high damage tolerance and interlaminar fracture toughness. The matrix resin includes a thermoplastic particle component that includes polyamide particles which are composed of the polymeric condensation product of a methyl derivative of bis(4-aminocyclohexyl)methane and an aliphatic dicarboxylic acid.
    Type: Application
    Filed: August 26, 2012
    Publication date: February 27, 2014
    Applicant: HEXCEL CORPORATION
    Inventors: Yen-Seine Wang, Maureen Boyle
  • Publication number: 20130260022
    Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend of insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.
    Type: Application
    Filed: May 29, 2013
    Publication date: October 3, 2013
    Applicants: Hexcel Composites Limited, Hexcel Corporation
    Inventors: Maureen Boyle, Dana Blair, Yi-Jui Wu, Yen-Seine Wang, Bryce Floryancic, Paul Mackenzie
  • Patent number: 8470923
    Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.
    Type: Grant
    Filed: April 21, 2010
    Date of Patent: June 25, 2013
    Assignees: Hexcel Corporation, Hexcel Composites Limited
    Inventors: Maureen Boyle, Dana Blair, Yi-Jui Wu, Yen-Seine Wang, Bryce Floryancic, Paul Mackenzie
  • Patent number: 8404777
    Abstract: Composite materials that contain thermoplastic-toughened cyanate ester resins as the resin matrix. The composite materials exhibit low levels of heat release when burned. The matrix resins are composed of from 50 to 80 weight percent of a cyanate ester resin component. The matrix resin composition also includes from 10 to 40 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 1 to 10 weight percent of a curative agent. The composite materials may be used for primary structures in aircraft and other load-bearing structures.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: March 26, 2013
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Yi-Jui Wu
  • Patent number: 8404339
    Abstract: Prepreg that contains epoxy resin compositions that include an epoxy resin component and a curative powder comprising particles of 4,4?-diaminobenzanilide (DABA) wherein the size of the DABA particles is less than 100 microns and wherein the median particle size is below 20 microns.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: March 26, 2013
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20130005898
    Abstract: Composite materials that contain thermoplastic-toughened cyanate ester resins as the resin matrix. The composite materials exhibit low levels of heat release when burned. The matrix resins are composed of from 50 to 80 weight percent of a cyanate ester resin component. The matrix resin composition also includes from 10 to 40 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 1 to 10 weight percent of a curative agent. The composite materials may be used for primary structures in aircraft and other load-bearing structures.
    Type: Application
    Filed: September 12, 2012
    Publication date: January 3, 2013
    Applicant: HEXCEL CORPORATION
    Inventors: Yen-Seine Wang, Yi-Jui Wu
  • Patent number: 8283408
    Abstract: Composite materials that contain thermoplastic-toughened cyanate ester resins as the resin matrix. The composite materials exhibit low levels of heat release when burned. The matrix resins are composed of from 50 to 80 weight percent of a cyanate ester resin component. The matrix resin composition also includes from 10 to 40 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 1 to 10 weight percent of a curative agent. The composite materials may be used for primary structures in aircraft and other load-bearing structures.
    Type: Grant
    Filed: February 26, 2010
    Date of Patent: October 9, 2012
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Yi-Jui Wu
  • Publication number: 20120088863
    Abstract: Thermoplastic toughened epoxy resin for use in making prepreg for aerospace applications. The resin includes an epoxy resin component comprising a tri functional epoxy resin and/or tetra functional epoxy, a thermoplastic component and 4,4?-Bis(p-aminophenoxy)biphenyl (BAPB) as the curing agent. The use of BAPB as a curative was found to increase the resistance of the cured resin to attack by solvents.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Applicant: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20120088864
    Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.
    Type: Application
    Filed: October 12, 2010
    Publication date: April 12, 2012
    Applicant: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20110259514
    Abstract: Composite material that contain epoxy resin which is toughened and strengthened with thermoplastic materials and a blend insoluble particles. The uncured matrix resins include an epoxy resin component, a soluble thermoplastic component, a curing agent and an insoluble particulate component composed of elastic particles and rigid particles. The uncured resin matrix is combined with a fibrous reinforcement and cured/molded to form composite materials that may be used for structural applications, such as primary structures in aircraft.
    Type: Application
    Filed: April 21, 2010
    Publication date: October 27, 2011
    Applicants: Hexcel Composites Ltd., Hexcel Corporation
    Inventors: Maureen Boyle, Dana Blair, Yi-Jui Wu, Yen-Seine Wang, Bryce Floryancic, Paul Mackenzie
  • Patent number: 8039109
    Abstract: Epoxy resin compositions that generate reduced levels of sulfur dioxide and which unexpectedly have reduced self-extinguishing times. The epoxy resins are composed of from 50 to 70 weight percent of an epoxy resin component. The epoxy resin composition also includes from 15 to 35 weight percent of a thermoplastic blend that is composed of polyetherimide and polyamideimide. The epoxy resin composition further includes from 5 to 25 weight percent of a curative agent.
    Type: Grant
    Filed: October 7, 2008
    Date of Patent: October 18, 2011
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Yi-Jui Wu