Patents by Inventor Yen-Seine Wang

Yen-Seine Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6686057
    Abstract: A coating for metal sheets used in fabricating honeycomb structures. The coating includes a first layer located on the surface of the metal sheet. The first layer includes hydrated alumina dispersed in a binder. The coating may further include a second layer located on top of the first layer. The second layer includes a polymer sealant. The first and second layer form a coating which is corrosion resistant and bonds well to the node adhesives used in forming honeycomb structures.
    Type: Grant
    Filed: January 31, 2002
    Date of Patent: February 3, 2004
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Patent number: 6605685
    Abstract: An improved resin for use in making honeycomb sandwich panels. The improvement involves modifying a phenolic resin so that the amount of smoke and heat generated during combustion is reduced. The reduction in smoke and heat generation is achieved by reducing the amount of phenol used to form the phenolic resin. The phenol is replaced by low-smoke producing sulfone compounds such as 4,4′-bisphenol-S, 3,3′-bisphenol-S, biphenol and bisphenol ethers which reduce the number of smoke producing methylene or methylene ether linkages present in the cured phenolic resin. The low-smoke producing resin may be used as a dip resin for coating the honeycomb or as the matrix resin for the core and face sheets of the sandwich panel.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: August 12, 2003
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Publication number: 20030143418
    Abstract: A coating for metal sheets used in fabricating honeycomb structures. The coating includes a first layer located on the surface of the metal sheet. The first layer includes hydrated alumina dispersed in a binder. The coating may further include a second layer located on top of the first layer. The second layer includes a polymer sealant. The first and second layer form a coating which is corrosion resistant and bonds well to the node adhesives used in forming honeycomb structures.
    Type: Application
    Filed: January 31, 2002
    Publication date: July 31, 2003
    Inventor: Yen-Seine Wang
  • Publication number: 20030040598
    Abstract: An improved resin for use in making honeycomb sandwich panels. The improvement involves modifying a phenolic resin so that the amount of smoke and heat generated during combustion is reduced. The reduction in smoke and heat generation is achieved by reducing the amount of phenol used to form the phenolic resin. The phenol is replaced by low-smoke producing sulfone compounds such as 4,4′-bisphenol-S, 3,3′-bisphenol-S, biphenol and bisphenol ethers which reduce the number of smoke producing methylene or methylene ether linkages present in the cured phenolic resin. The low-smoke producing resin may be used as a dip resin for coating the honeycomb or as the matrix resin for the core and face sheets of the sandwich panel.
    Type: Application
    Filed: August 14, 2001
    Publication date: February 27, 2003
    Inventor: Yen-Seine Wang
  • Patent number: 6451406
    Abstract: A solventless node adhesive for use in bonding honeycomb layers together. The node adhesive includes thermoset resin and thermoplastic particles dispersed in the adhesive. The node adhesive is applied to the honeycomb node lines while the thermoplastic particles remain dispersed in the adhesive. The amount of thermoplastic particles in the node adhesive is selected to keep the viscosity of the adhesive between 30 and 150 poise at room temperature. The node adhesive may be applied to the honeycomb nodes using conventional application procedures. The thermoplastic particles are dissolved during heat curing of the thermoset resin to form a thermoplastic toughened node adhesive.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: September 17, 2002
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Mark S. Caldwell
  • Patent number: 6245407
    Abstract: Resins which are a combination of phenolic and polyamide polymers are used as dipping resins to coat composite honeycomb structures. The phenolic/polyamide dipping resins increase the heat formability of composite honeycomb structures. The dip resin forms a coating on the honeycomb which includes from 30 to 95 weight percent phenolic resin and 5 to 30 weight percent polyamide resin. The dip resin is especially useful for coating composite honeycomb cores made from graphite or glass fibers impregnated with flexible phenolic resins.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: June 12, 2001
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Emi Lee, Mark S. Caldwell, Robert Petrisko
  • Patent number: 6153687
    Abstract: A solution of phenolic and polyamide polymers is used as a dipping resin to coat composite honeycomb structures. The phenolic/polyamide dipping resin increases the heat formability and strength of composite honeycomb structures. The coating formed by the resin includes from 30 to 95 weight percent phenolic resin and 5 to 30 weight percent polyamide resin.
    Type: Grant
    Filed: April 27, 1999
    Date of Patent: November 28, 2000
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Mark S. Caldwell
  • Patent number: 5338594
    Abstract: High strength foam-filled materials and methods for their production are disclosed. The high strength materials include cellular structures comprising a plurality of open-ended cells containing polycyanurate foam. The polycyanurate foam-filled cellular structures have synergistically high mechanical properties and improved resistance to moisture. When cyanate ester foamable precursors in the form of tough films are foamed to fill honeycomb cells, the resulting foam-filled honeycomb has uniformly fine foam cell structure and improved bonding between the foam and the honeycomb.
    Type: Grant
    Filed: February 7, 1992
    Date of Patent: August 16, 1994
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Frank Lee, Ching-Chi Kuo, Ken Baron
  • Patent number: 5077319
    Abstract: Foamable resin compositions of cyanate esters and thermoplastic resins are disclosed.
    Type: Grant
    Filed: May 18, 1990
    Date of Patent: December 31, 1991
    Assignee: Hexcel Corporation
    Inventors: Yen-Seine Wang, Ching-Chi Kuo, David B. Conway, Frank W. Lee, Kenneth S. Baron