Abstract: A displayed image generation unit enlarges, reduces, or scrolls a displayed image in accordance with a command for change from a user. When a clip command receiving unit receives a clip command, a clipping area identification unit identifies an area to be clipped according to the clip command. A thumbnail image generation unit generates a thumbnail image corresponding to the identified area. A positional information acquisition unit acquires positional information identifying a position of the identified area in an image as a whole. A content ID acquisition unit acquires identification information identifying an image when the clipping command is received. A hard disk drive maps the identification information, the thumbnail image, and the positional information and stores the mapped information.

Abstract: The present application discloses a therapeutic antimicrobial composition comprising mucocidin antimicrobial peptides or analogue or fragments thereof having antimicrobial activity.

Abstract: A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.

Abstract: The present application discloses a therapeutic antimicrobial composition comprising mucocidin antimicrobial peptides or analogue or fragments thereof having antimicrobial activity.

Abstract: A semiconductor wafer including an identification indication is provided. The wafer includes a convex edge with an upper surface area and a lower surface area. The identification indication is in a marking region which is disposed on a lower side surface of the convex edge. The lower side surface has a wide region where the marking region is located. This wide region has a width that is wider than an upper side surface of the wafer and thus makes a cross-section of a side of the wafer asymmetrical. With the present invention, the entire top surface of the semiconductor wafer can be utilized for a semiconductor chip region and prevents manufacturing problems associated with the uneven nature of the identification indication when the identification is located on the top surface of the wafer.